The behavior of organic components in copper recovery from electroless plating bath effluents using 3D electrode systems

2004 ◽  
Vol 112 (3) ◽  
pp. 261-267 ◽  
Author(s):  
G ORHAN ◽  
S GURMEN ◽  
S TIMUR
Keyword(s):  
Electroless Plating ◽  
Copper Recovery ◽  
Plating Bath ◽  
Organic Components ◽  
Electrode Systems ◽  
3D Electrode

scholarly journals 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

2015 ◽  
Vol 2015 ◽  
pp. 1-11
Author(s):  
Ahmet Ozan Gezerman ◽  
Burcu Didem Çorbacıoğlu
Keyword(s):  
Waste Water ◽  
Electroless Plating ◽  
Thioglycolic Acid ◽  
Electroless Nickel ◽  
Optical Microscope ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Bath ◽  
Bath Solution ◽  
Microscope Images

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

Electroless Plating of Copper Interconnections on Ion Beam Catalyzed Polyimide

1989 ◽  
Vol 167 ◽  
Author(s):  
T. Flottmann ◽  
A. Tulke ◽  
E. Esper ◽  
W. Lohmann
Keyword(s):  
Electroless Plating ◽  
Surface Composition ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Plating Bath ◽  
Chemical Surface ◽  
Polyimide Substrate ◽  
Palladium Acetylacetonate ◽  
Catalytic Sites

AbstractDecomposition of a palladium compound by ion irradiation has been used to catalyze electroless plating on polyimide. First, palladium-acetylacetonate or -acetate is spin-coated on a polyimide substrate. The thin resist film is then irradiated through a mask with He or Ar ions of 100 keV energy. After washing off the film parts which were not exposed to the ion beam, copper is deposited on the catalyzed polyimide substrate in an alkaline electroless plating bath. When using alkaline resistant polyimide, copper lines several microns thick can be plated. The chemical surface composition of the Pd-compounds after ion beam exposure has been investigated with ESCA. It has been found that the Pd is partially reduced. Pd-acetate is more effective to form catalytic sites than Pd-acetylacetonate.

Electroless Silver Plating Process on Al-Ag Alloy Powder

2013 ◽  
Vol 800 ◽  
pp. 256-259
Author(s):  
Wang Qun ◽  
Ye Fan Li ◽  
Dong Mei Li ◽  
Zhi Xue Qu
Keyword(s):  
Electroless Plating ◽  
Alloy Powder ◽  
Glucose Solution ◽  
Silver Content ◽  
Silver Coating ◽  
Chemical Compositions ◽  
Composite Powders ◽  
Plating Bath ◽  
Thiourea Solution ◽  
Electroless Silver Plating

The Ag coating was deposited on the surface of Al-Ag alloy powder by electroless plating process. 10 wt% of AgNO3 was put in the powder for precursor replacement reaction, and then added the powder into electroless plating bath which contained glucose solution, solution of silver ammonia, thiourea solution, tartaric acid solution and absolute ethanol. The effects of formula components were analyzed. The surface morphology of the prepared composite particles was studied with SEM and their chemical compositions were confirmed by XRD. With the chemical etching method, silver content of the powder was determined. The studies have shown that an uniform, complete and dense silver coating for the Al-Ag composite powders was generated by this method, with the silver content being 20wt%, and the conductivity was favorable.

Formation and Structural Characterization of Electroless Ni-B-P Ternary Alloy Coatings

2014 ◽  
Vol 592-594 ◽  
pp. 385-390 ◽  
Author(s):  
P.G. Venkatakrishnan ◽  
S.S. Mohamed Nazirudeen ◽  
T.S.N. Sankara Narayanan
Keyword(s):  
Electroless Plating ◽  
Morphological Characteristics ◽  
Reducing Agents ◽  
Sodium Hypophosphite ◽  
Electron Microscopic ◽  
Plating Bath ◽  
Peak Broadening ◽  
Chloride Hexahydrate ◽  
Electroless Ni

The aim of the present investigation is to study the formation of electroless Ni-B-P alloy coatings and structural and morphological characterization of various coatings with different boron and phosphorous content. An alkaline plating bath with nickel chloride hexahydrate as the source of nickel ions and sodium borohydride and sodium hypophosphite as reducing agents were used for the formation of electroless Ni-B-P alloy coatings. The influence of changes in the concentrations of the reducing agents in the electroless plating bath on the chemical composition, structural and morphological characteristics of the coatings were studied. Scanning electron microscopic studies revealed that the surface morphology of Ni-B-P alloy coatings changed from corn cob-like structure to cauliflower-like structure with increasing borohydride concentration in electroless plating bath, whereas increase in hypophosphite concentration favoured sideway growth, thereby decreased the surface roughness of the Ni-B-P alloy coatings. The peak broadening in the X-Ray Diffraction profiles indicates the large reduction in the crystallite size of the electroless Ni-B-P alloy coatings with increasing boron content in the coating (i.e. for higher borohydride concentration in the plating bath).

Preparation and Characterization of Micro Polypyrrole Electrodes for Supercapacitor

2009 ◽  
Vol 60-61 ◽  
pp. 375-379
Author(s):  
Wei Sun ◽  
Hai Sheng San ◽  
Ying Xian Duo ◽  
Xu Yuan Chen
Keyword(s):  
Specific Capacitance ◽  
Electroless Plating ◽  
Electrochemical Impedance ◽  
3D Structure ◽  
Three Dimensional ◽  
Current Collector ◽  
Deep Reactive Ion Etching ◽  
Sio2 Substrate ◽  
Polypyrrole Film ◽  
3D Electrode

A novel electrode of supercapacitor was developed with a three dimensional (3D) structure which results in a significant increase of the electrode area per unit capacitor volume. An area of 2.58 times the area of corresponding planar design was obtained. The process flow for fabricating the 3D electrode was developed compatible with microelectromechanical system technology. The key processes were high-aspect-ratio Deep Reactive Ion Etching, electroless plating and electropolymerization. Ni as the current collector was deposited on Si/SiO2 substrate by using electroless plating, Polypyrrole was galvanostatically polymerized as electroactive film. The capacitance properties of the 3D electrode were investigated. Cyclic voltammetry tests show that the specific capacitance of the 3D electrode at 100 mV/s was 0.014 F/cm2 which is comparable with the 0.013 F/cm2 for the planar design. Electrochemical impedance spectroscopy plot of the 3D electrode is well fitted by equivalent circuit, we found the specific capacitance is 0.011 F/cm2 which is slightly larger than 0.0094 F/cm2 for similarly planar design. From the gavanostatic charge/discharge tests, the specific capacitance of the 3D electrode at 2 mA/cm2 is 0.011 F/cm2 while for planar design the corresponding value is 0.010 F/cm2. The results indicate the continuous and homogeneous Polypyrrole film with 3D structure was obtained as we designed.

Covalent Coupling of Gold Nanoparticles to Multiwalled Carbon Nanotubes for Electronic Device Applications

2004 ◽  
Vol 818 ◽  
Author(s):  
Xicheng Ma ◽  
Ning Lun ◽  
Xia Li ◽  
Shulin Wen
Keyword(s):  
Carbon Nanotubes ◽  
Gold Nanoparticles ◽  
Multiwalled Carbon Nanotubes ◽  
Electroless Plating ◽  
Electronic Device ◽  
Hybrid Nanostructures ◽  
Gold Deposition ◽  
Multiwalled Carbon ◽  
Plating Bath ◽  
Conjugation Process

AbstractCreating hybrid nanostructures of disparate nanoscale blocks is of interest of exploring new types of electronic devices and networks. Here, we demonstrate the novel coupling of gold nanoparticles of 3-4 nm diameters to sidewall of multiwalled carbon nanotubes (MWNTs) using the electroless plating technique. MWNTs were initially chemically modified with an H2SO4-HNO3 acid treatment, and subsequently activated with Pd-Sn catalytic nuclei via a one-step activation approach. When the activated MWNTs were immersed in a gold-containing electroless plating bath, gold deposition occurred at the catalytic sites. The deposited gold clusters then catalyze further gold deposition on the tube surface (autocatalytic process). Novel hybrid nanostructures with gold nanoparticles homogeneously distributed on MWNTs resulted. High-resolution transmission electron microscopy (HRTEM) and energy dispersive X-ray spectroscopy (EDS) were used to characterize the conjugation process.

Electroless Plated Pd/GaAs Schottky Diode and its Application to Hydrogen Detection

2007 ◽  
Vol 124-126 ◽  
pp. 81-84
Author(s):  
Yen I Chou ◽  
Huey Ing Chen ◽  
Chien Kang Hsiung
Keyword(s):  
Grain Size ◽  
Oxide Layer ◽  
Schottky Diode ◽  
Electroless Plating ◽  
Sodium Ion ◽  
Bath Composition ◽  
Plating Bath ◽  
Hydrogen Detection ◽  
Hydrogen Sensing ◽  
Intermediate Oxide

In this study, the dependence of Pd/GaAs Schottky diode on the electroless plating (EP) variable is systematically studied. Both alkaline and acidic formulas for electroless Pd depositions are employed for investigations. The correlation between Pd gain size and the manipulation of plating bath composition is constructed. Experimental results show that the performances of Pd/GaAs Schottky diode, electric rectification and hydrogen detection, are largely governed by the Pd grain size. Furthermore, without the interference of sodium ion, the acidic-plated Pd/GaAs diode with intermediate oxide layer exhibits the excellent hydrogen sensing performances from 15 ppm to 1.0 % H2/air.

scholarly journals Stability of Passivation Film on Stainless Steel in a Nickel Electroless Plating Bath.

1994 ◽  
Vol 43 (494) ◽  
pp. 1416-1421
Author(s):  
Yoshihiro SUGIE ◽  
Masafumi KOBUNE ◽  
Satoshi FUJII ◽  
Tadahiro YAMAMOTO
Keyword(s):  
Stainless Steel ◽  
Electroless Plating ◽  
Plating Bath ◽  
Passivation Film

Effect of Electroless Plating Conditions on Toluene Catalytic Combustion Performance of Palladium-Based Catalyst

2011 ◽  
Vol 233-235 ◽  
pp. 416-419
Author(s):  
Yong Feng Li ◽  
Yu Li ◽  
Rong Jian Mai ◽  
Qian Yu ◽  
Lin Yu
Keyword(s):  
Electroless Plating ◽  
Catalytic Combustion ◽  
Bath Temperature ◽  
Catalytic Performance ◽  
Plating Bath ◽  
High Efficient ◽  
Plating Method ◽  
Catalytic Stability ◽  
The Stability ◽  
Palladium Salt

Catalytic combustion of volatile organic compounds (VOCs) is a high efficient and low-polluted technique. In this paper, the palladium-based combustion catalysts on cordierite honeycomb ceramics (CHC) substrate without interlayer film — Pd/CHC, were prepared by electroless plating method, and the effect of preparing conditions for the catalysts on the catalytic performance of toluene combustion was mainly studied. The optimal conditions were confirmed as follows: plating bath temperature is 60°C, plating time is 30min, palladium salt concentrationis 0.2g/L, and calcination temperature after plating is 500°C. Finally, the stability test further indicated that the Pd/CHC catalyst prepared by the optimal electroless plating conditions has good catalytic stability.

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