Real-time heat dissipation model of electronic equipment for determining the dynamic cooling demand of office buildings

Abstract Due to the huge energy consumption of land-based data centers, it is necessary to establish undersea data centers as soon as possible in order to alleviate the problem of resource tension. In this paper, the uniformity of containers is assumed. Through force analysis, it is found that the stress of containers is uniformly distributed, so only the external stress should be considered. Hypothesis submarine data center in the 50 m deep seawater, calculate the container need to withstand stress is 76.417403 Mpa, common material in engineering field, then physical parameters of material to deal with the dimensional and normalization, and establishes a comprehensive evaluation model material, the Topsis method is adopted to solve, to solve the optimal evaluation of the results can be divided into: 7-4 PH Stainless Stee 0.7450 points, so choose it as IU server container material.

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Explore Big Data and Forecasting Future Values using Univariate Arima Model in R

International Journal of Engineering & Technology ◽

10.14419/ijet.v7i2.7.12300 ◽

2018 ◽

Vol 7 (2.7) ◽

pp. 1107 ◽

Cited By ~ 1

Author(s):

S Sagar Imambi ◽

P Vidyullatha ◽

M V.B.T.Santhi ◽

P Haran Babu

Keyword(s):

Time Series ◽

Big Data ◽

Real Time ◽

Arima Model ◽

Electronic Equipment ◽

Experimental Results ◽

Business Organization ◽

Huge Amount ◽

Diagnostic Data ◽

Using Data

Electronic equipment and sensors spontaneously create diagnostic data that needs to be stocked and processed in real time. It is not only difficult to keep up with huge amount of data but also reasonably more challenging to analyze it. Big Data is providing many opportunities for organizations to evolve their processes they try to move beyond regular BI activities like using data to populate reports. Predicting future values is one of the requirements for any business organization. The experimental results shows that time series model with ARIMA (3,0,1)(1,0,0) is best fitted for predicting future values of the sales.

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Real-Time Energy Dissipation Model for Mobile Devices

Emerging Research in Computing, Information, Communication and Applications ◽

10.1007/978-81-322-2550-8_27 ◽

2015 ◽

pp. 281-288 ◽

Cited By ~ 2

Author(s):

Shalini Prasad ◽

S. Balaji

Keyword(s):

Energy Dissipation ◽

Real Time ◽

Mobile Devices ◽

Dissipation Model

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Heat dissipation model and temperature distribution of Yb-doped double-clad fiber in the composite system

Optical Fiber Technology ◽

10.1016/j.yofte.2020.102269 ◽

2020 ◽

Vol 58 ◽

pp. 102269 ◽

Cited By ~ 1

Author(s):

Yi Lv ◽

Sheng Liu

Keyword(s):

Temperature Distribution ◽

Heat Dissipation ◽

Composite System ◽

Dissipation Model

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Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 ◽

10.1115/ipack2003-35305 ◽

2003 ◽

Cited By ~ 18

Author(s):

Gary L. Solbrekken ◽

Kazuaki Yazawa ◽

Avram Bar-Cohen

Keyword(s):

Thermal Resistance ◽

Heat Sink ◽

High Performance ◽

Heat Dissipation ◽

Electronic Equipment ◽

Interfacial Thermal Resistance ◽

Maximum Heat ◽

Power Efficient ◽

System Sensitivity ◽

Heat Pumping

It is well established that the power dissipation for electronic components is increasing. At the same time, high performance portable equipment with volume, weight, and power limitations are gaining widespread acceptance in the marketplace. The combination of the above conditions requires thermal solutions that are high performance and yet small, light, and power efficient. This paper explores the possibility of using thermoelectric (TE) refrigeration as an integrated solution for portable electronic equipment accounting for heat sink and interface material thermal resistances. The current study shows that TE refrigeration can indeed have a benefit over using just a heat sink. Performance maps illustrating where TE refrigeration offers an advantage over an air-cooled heat sink are created for a parametric range of CPU heat flows, heat sink thermal resistances, and TE material properties. During the course of the study, it was found that setting the TE operating current based on minimizing the CPU temperature (Tj), as opposed to maximizing the amount of heat pumping, significantly reduces Tj. For the baseline case studied, a reduction of 20–30°C was demonstrated over a range of CPU heat dissipation. The parametric studies also illustrate that management of the heat sink thermal resistance appears to be more critical than the CPU/TE interfacial thermal resistance. However, setting the TE current based on a minimum Tj as opposed to maximum heat pumping reduces the system sensitivity to the heat sink thermal resistance.

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Real-Time Occupant Based Plug-in Device Control Using ICT in Office Buildings

Energies ◽

10.3390/en9030143 ◽

2016 ◽

Vol 9 (3) ◽

pp. 143

Author(s):

Woo-Bin Bae ◽

Sun-Hye Mun ◽

Jung-Ho Huh

Keyword(s):

Real Time ◽

Office Buildings

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Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.139-141.1433 ◽

2010 ◽

Vol 139-141 ◽

pp. 1433-1437

Author(s):

Kai Lin Pan ◽

Jiao Pin Wang ◽

Jing Liu ◽

Guo Tao Ren

Keyword(s):

High Power ◽

Heat Sink ◽

Heat Dissipation ◽

Light Emitting Diode ◽

Three Dimensional ◽

Junction Temperature ◽

Light Emitting ◽

Die Attach ◽

Dissipation Model ◽

Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

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Practical bioinstrumentation developments for AC magnetic field-mediated magnetic nanoparticle heating applications

10.1101/328211 ◽

2018 ◽

Author(s):

Mahendran Subramanian ◽

Arkadiusz Miaskowski ◽

Ajit K. Mahapatro ◽

Ondrej Hovorka ◽

Jon Dobson

Keyword(s):

Drug Release ◽

Real Time ◽

Thermal Imaging ◽

Heat Dissipation ◽

Temperature Measurements ◽

Whole Body ◽

Planar Coil ◽

Release Analysis

AbstractHeat dissipation during magnetization reversal processes in magnetic nanoparticles (MNP), upon exposure to alternating magnetic fields (AMF), has been extensively studied in relation to applications in magnetic fluid hyperthermia (MFH). This current paper demonstrates the design, fabrication, and evaluation of an efficient instrument, operating on this principle, for use as (i) a non-contact, in vitro, real-time temperature monitor; (ii) a drug release analysis system (DRAS); (iii) a high flux density module for AMF-mediated MNP studies; and (iv) an in vivo coil setup for real-time, whole body thermal imaging. The proposed DRAS is demonstrated by an AMF-mediated drug release proof-of-principle experiment. Also, the technique described facilitates non-contact temperature measurements of specific absorption rate (SAR) as accurately as temperature measurements using a probe in contact with the sample. Numerical calculations estimating the absolute and root mean squared flux densities, and other MNP – AMF studies suggest that the proposed stacked planar coil module could be employed for calorimetry. Even though the proposed in vivo coil setup could be used for real-time, whole body thermal imaging (within the limitations due to issues of penetration depth), further design effort is required in order to enhance the energy transfer efficiency.

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Simulation of heat dissipation model of lithium-ion battery pack

E3S Web of Conferences ◽

10.1051/e3sconf/202130001014 ◽

2021 ◽

Vol 300 ◽

pp. 01014

Author(s):

Maode Li ◽

Chuan He ◽

Jinkui Zheng

Keyword(s):

Phase Change ◽

Temperature Rise ◽

Heat Dissipation ◽

Lithium Ion ◽

Maximum Temperature ◽

Air Cooling ◽

Power Battery ◽

Staggered Arrangement ◽

Dissipation Model ◽

Cooling Methods

Lithium-ion power battery has become an important part of power battery. According to the performance and characteristics of lithiumion power battery, the influence of current common charge and discharge and different cooling methods on battery performance was analysed in this paper. According to the software simulation, in the 5C charge-discharge cycle, the maximum temperature of the cells with regular arrangement is 57.97°C, the maximum temperature of the cells with staggered arrangement is 55.83°C, and the maximum temperature of phase change cooling is 47.42°C. The most important thing is that the temperature difference between the cells with phase change cooling is only 5.5°C. Some simulation results of air cooling and phase change show that phase change cooling can control the heat dissipation and temperature rise of power battery well. The research in this paper can provide better theoretical guidance for the temperature rise, heat transfer and thermal management of automotive power battery.

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