Process optimization for aqueous extraction of reducing sugar from cashew apple bagasse: A potential, low cost substrate

LWT ◽  
2011 ◽  
Vol 44 (1) ◽  
pp. 62-66 ◽  
Author(s):  
Arindam Kuila ◽  
Anshu Singh ◽  
Mainak Mukhopadhyay ◽  
Rintu Banerjee
2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Ananthamurthy Koteshwara ◽  
Nancy V. Philip ◽  
Jesil Mathew Aranjani ◽  
Raghu Chandrashekhar Hariharapura ◽  
Subrahmanyam Volety Mallikarjuna

AbstractA carefully designed ammonium sulfate precipitation will simplify extraction of proteins and is considered to be a gold standard among various precipitation methods. Therefore, optimization of ammonium sulfate precipitation can be an important functional step in protein purification. The presence of high amounts of ammonium sulphate precludes direct detection of many enzymatically active proteins including reducing sugar assays (e.g. Nelson-Somogyi, Reissig and 3,5-dinitrosalicylic acid methods) for assessing carbohydrases (e.g. laminarinase (β (1–3)-glucanohydrolase), cellulases and chitinases). In this study, a simple method was developed using laminarin infused agarose plate for the direct analysis of the ammonium sulphate precipitates from Streptomyces rimosus AFM-1. The developed method is simple and convenient that can give accurate results even in presence of ammonium sulfate in the crude precipitates. Laminarin is a translucent substrate requiring the use of a stain to visualize the zones of hydrolysis in a plate assay. A very low-cost and locally available fluorescent optical fabric brightener Tinopal CBS-X has been used as a stain to detect the zones of hydrolysis. We also report simple methods to prepare colloidal chitin and cell free supernatant in this manuscript.


2021 ◽  
Vol 144 (3) ◽  
Author(s):  
Matthias Joppa ◽  
Mike Bermuske ◽  
Frank Rüdiger ◽  
Lars Büttner ◽  
Jochen Fröhlich ◽  
...  

Abstract Impinging circular free-surface water jets are used in challenging cooling and cleaning tasks. In order to develop simulation models for process optimization, validation data are required, which are currently not available. Therefore, the flow field of these jets is studied for the first time with the novel laser Doppler velocity profile sensor. The mean velocity field and fluctuations are measured within the stagnation and adjacent redirection region for radial coordinates up to three times the nozzle diameter. In the examined parameter range with jet velocities up to 17 m/s and nozzle diameters up to 5.2 mm, i.e., Reynolds numbers up to 69 500, thin films of a few hundred micrometers are formed, which hinder the measurement with common optical measuring systems. Based on the measurement results, a comparatively low-cost volume of fluid simulation model is developed and validated that presumes a relaminarized film flow. The profiles measured and the simulated flow show very good agreement. In the future, the simulation model provides a basis for process optimization and the innovative measurement technology used will prospectively provide further detailed insights into other flows with high velocity gradients.


2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000398-000424
Author(s):  
Doug Shelton ◽  
Tomii Kume

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000790-000793 ◽  
Author(s):  
Doug Shelton ◽  
Tomii Kume

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.


2020 ◽  
Vol 91 ◽  
pp. 145-152
Author(s):  
Issmat Shah Masoodi ◽  
Insha Ishteyaq ◽  
Khalid Muzaffar ◽  
Muhammad Idrees Magray

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