Tri-layer contact photolithography process for high-resolution lift-off

2021 ◽  
Vol 241 ◽  
pp. 111545
Author(s):  
Howard Northfield ◽  
Oleksiy Krupin ◽  
R. Niall Tait ◽  
Pierre Berini
2013 ◽  
Vol 562-565 ◽  
pp. 1224-1228
Author(s):  
Marina Ashmkhan ◽  
Jing Liu ◽  
Bo Wang ◽  
Fu Ting Yi

Silicon nano pin arrays with heights of 1.3-3.66um and diameter of 315-899nm, are fabricated by CsCl self-assemble for CsCl nano islands for mask and ICP etching for silicon pins. CsCl film is firstly deposited on the wafer by thermal evaporation and putted in the humid controlled environment to be developed to the CsCl islands with diameter of 341-915 nm as self-assembled technology. Then the ICP etching with SF6, CCl4, He gas is introduced to make the silicon nano pin by the mask of CsCl nano islands, and the silicon nano pins with the different height of 1.3-3.66 um are finished for field emission. The gated FEA templates are fabricated by photolithography process and the lift-off technology with Ti-Si film as the gate electrodes. The final template for field emission has the silicon nano pins with diameters of 31.7 nm on top, Ti-Ag film with thickness of 105nm and gate holes of 30um in diameter, and SU8 resist insulator structure with thickness of 4um and holes of 10um in diameter. The optimization of the fabrication process and the performance for the configuration will be made.


2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Dae-Myeong Geum ◽  
SangHyeon Kim ◽  
Seong Kwang Kim ◽  
SooSeok Kang ◽  
JiHoon Kyhm ◽  
...  

AbstractIn this study, multicolor photodetectors (PDs) fabricated by using bulk p-i-n-based visible GaAs and near-infrared InGaAs structures were monolithically integrated through a high-throughput epitaxial lift-off (ELO) process. To perform multicolor detection in integrated structures, GaAs PDs were transferred onto InGaAs PDs by using a Y2O3 bonding layer to simultaneously detect visible and near-infrared photons and minimize the optical loss. As a result, it was found that the GaAs top PD and InGaAs bottom PD were vertically aligned without tilting in x-ray diffraction (XRD) measurement. A negligible change in the dark currents for each PD was observed in comparison with reference PDs through electrical characterization. Furthermore, through optical measurements and simulation, photoresponses were clearly revealed in the visible and near-infrared band for the material’s absorption region, respectively. Finally, we demonstrated the simultaneous multicolor detection of the visible and near-infrared region,which implies individual access to each PD without mutual interference. These results are a significant improvement for the fabrication of multicolor PDs that enables the formation of bulk-based multicolor PDs on a single substrate with a high pixel density and nearly perfect vertical alignment for high-resolution multicolor imaging.


2017 ◽  
Vol 34 (2) ◽  
pp. 99-107 ◽  
Author(s):  
Sharipah Nadzirah ◽  
Uda Hashim

Purpose The purpose of this study is to fabricate a transducer-based TiO2 interdigitated microelectrodes with various gap sizes. The most stable electrical properties have been selected for Escherichia. coli O157:H7 DNA detection. Design/methodology/approach Sol-gel was used to synthesize TiO2 nanoparticles. Lift-off photolithography process was used for fabrication of interdigitated electrodes (IDEs) and dry-state DNA detection was done using a Picoammeter. Findings TiO2 nanoparticles IDEs with 16-um gap size is able to detect DNA of E. coli in a dry state. Originality/value This paper describes IDEs for dry-state detection of E. coli O157:H7 DNA. The technique presented in this paper ensures the high uniformity of nanoparticle deposition on the finger electrode.


2000 ◽  
Vol 37 (12) ◽  
pp. 1723-1734 ◽  
Author(s):  
Michael R Gipp

Lift-off moraines are acoustically incoherent, subparallel ridges observed on sidescan sonograms and high-resolution reflection seismic profiles on the southeastern continental margin of Canada. They are up to 3 m high, 20–80 m wide, and are commonly overlain by stratified proglacial sediments. Although little is known about them, detailed study of high-resolution seismic profiles from the Emerald Basin and the LaHave Basin, on the Scotian Shelf, show that their height:width ratio varies with the sounder–seabed separation, suggesting that the ridges may be narrower than they appear. Their morphology is similar to DeGeer moraines or cross-valley moraines, which form perpendicular to ice-flow direction. As their orientations can be estimated at the intersection of seismic lines, they can be used to estimate ice-flow directions. Since proglacial sediments are draped directly over top of them, they are assumed to record the direction of last ice flow. This directional data suggests that ice retreated not only northward (to Nova Scotia), but also toward local topographic highs on the continental shelf, which acted as anchoring points for ice rises around both the Emerald and LaHave Basins. This pattern of ice-flow directions suggests that ice flowed from the high ground of banks, converging into basin deeps, suggesting that small moraines within the basins are probably of interlobate origin.


2020 ◽  
Vol 990 ◽  
pp. 283-287
Author(s):  
Yaw Jen Chang

This paper presents a simple approach to selectively synthesize the ZnO nanowires between interdigitated electrodes by integrating the hydrothermal method with the photolithography process. The printed circuit board (PCB) was adopted as the substrate. Interdigitated electrodes were fabricated by etching the copper foil of PCB. Then, both the positive and negative photoresists were used to control the growth of nanowires through lift-off concept. No costly materials and expensive apparatuses are required. Biotin–streptavidin reaction was used as an example to examine this proposed device. When histidine-tagged biotin was added and the reaction of biotin–streptavidin was completed, the distinguishable I-V curves were detected, respectively. The experimental results reveal that this proposed device is sensitive.


2016 ◽  
Vol 28 (2) ◽  
pp. 74-83 ◽  
Author(s):  
Ming Xiao ◽  
Walid Madhat Munief ◽  
Fengshun Wu ◽  
Rainer Lilischkis ◽  
Tobias Oberbillig ◽  
...  

Purpose The purpose of this paper is to fabricate a new Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration. Design/methodology/approach The Cu-Sn-Ni-Cu interconnection microstructure is fabricated by a three-mask photolithography process with different electroplating processes. This microstructure consists of pads and conductive lines as the bottom layer, Cu-Sn-Ni-Cu pillars with the diameter of 10-40 μm as the middle layer and Cu conductive lines as the top layer. A lift-off process is adopted for the bottom layer. The Cu-Sn-Ni-Cu pillars are fabricated by photolithography with sequential electroplating processes. To fabricate the top layer, a sputtered Cu layer is introduced to prevent the middle-layer photoresist from being developed. With the final Cu electroplating processes, the Cu-Sn-Ni-Cu interconnection microstructure is successfully achieved. Findings The surface morphology of Cu-Sn pillars consists of densely packed clusters which are formed by an ordered arrangement of tetragonal Sn grains. The diffusion of Cu atoms into the Sn phases is observed at the Cu/Sn interface. Furthermore, the obtained Cu-Sn-Ni-Cu pillars have a flat surface with an average roughness of 13.9 nm. In addition, the introduction of Ni layer between the Sn and the top Cu layers in the Cu-Sn-Ni-Cu pillars can mitigate the diffusion of Cu atoms into Sn phases. The process is verified by checking the electrical performance using four-point probe measurements. Originality/value The method described in this paper which combined a three-mask photolithography process with sequential Cu, Sn, Ni and Cu electroplating processes provides a new way to fabricate the interconnection microstructure for future electromigration studies.


2010 ◽  
Vol 20 (7) ◽  
pp. 075026 ◽  
Author(s):  
A Wisitsoraat ◽  
S Mongpraneet ◽  
R Phatthanakun ◽  
N Chomnawang ◽  
D Phokharatkul ◽  
...  
Keyword(s):  
Low Cost ◽  
X Ray ◽  
Lift Off ◽  

2002 ◽  
Author(s):  
Medhat A. Toukhy ◽  
Salem K. Mullen ◽  
Ping-Hung Lu ◽  
Mark Neisser
Keyword(s):  

2007 ◽  
Vol 298 ◽  
pp. 840-842 ◽  
Author(s):  
K.K. Leung ◽  
C.P. Chan ◽  
W.K. Fong ◽  
M. Pilkuhn ◽  
H. Schweizer ◽  
...  

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