A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions
2005 ◽
Vol 473-474
◽
pp. 189-194
Keyword(s):
1975 ◽
Vol 20
◽
pp. 261-266
◽
1997 ◽
Vol 1997
(182)
◽
pp. 741-750