scholarly journals Effects of the binder material on the mechanical properties of thick-film magnetostrictive materials

2004 ◽  
Vol 110 (1-3) ◽  
pp. 365-370 ◽  
Author(s):  
N.J. Grabham ◽  
S.P. Beeby ◽  
N.M. White
Keyword(s):  
Mechanical Properties ◽  
Thick Film ◽  
Magnetostrictive Materials ◽  
Binder Material

scholarly journals THE DEPENDENCE OF THE PHYSICAL MECHANICAL PROPERTIES OF EXPANDED-CLAY LIGHTWEIGHT CONCRETE ON THE COMPOSITION

2010 ◽  
Vol 2 (6) ◽  
pp. 50-55
Author(s):  
Marija Vaičienė ◽  
Jurgita Malaiškienė
Keyword(s):  
Mechanical Properties ◽  
Compressive Strength ◽  
Chemical Composition ◽  
Water Absorption ◽  
Lightweight Concrete ◽  
Physical And Mechanical Properties ◽  
Concrete Mixture ◽  
Active Filler ◽  
Binder Material ◽  
Substitute Materials

Binder material is the most expensive raw component of concrete; thus, scientists are looking for cheaper substitute materials. This paper shows that when manufacturing, a part of the binder material of expanded-clay lightweight concrete can be replaced with active filler. The conducted studies show that technogenic – catalyst waste could act as similar filler. The study also includes the dependence of the physical and mechanical properties of expanded-clay lightweight concrete on the concrete mixture and the chemical composition of the samples obtained. Different formation and composition mixtures of expanded-clay lightweight concrete were chosen to determine the properties of physical-mechanical properties such as density, water absorption and compressive strength.

Review on Different Types of Geopolymer Concrete Fibres

2016 ◽  
Vol 857 ◽  
pp. 388-394 ◽  
Author(s):  
Meor Ahmad Faris ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Khairul Nizar Ismail ◽  
Ratnasamy Muniandy ◽  
Aeslina Abdul Kadir ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Compressive Strength ◽  
Flexural Strength ◽  
Ordinary Portland Cement ◽  
Geopolymer Concrete ◽  
Base Materials ◽  
Different Types ◽  
History Of ◽  
Binder Material ◽  
Materials Used

Ordinary Portland Cement (OPC) has been used over the than hundred years for material construction especially as a binder in production of concrete. However, there are a few disadvantages with the using of OPC that have been found especially in terms of properties and green house effect. This paper reviews the potential of an alternative binder material with no cement usage (cementless) called as “geopolymer”. The history of the development geopolymer will be described. Different types of base materials used in the formation of geopolymer will be explained in details. The influence of different types of fibres to the mechanical properties especially compressive strength and flexural strength were explained well.

scholarly journals Effect of Cement Variation on Properties of CLC Concrete Masonry Brick

2018 ◽  
Vol 159 ◽  
pp. 01008
Author(s):  
Erwin Sutandar ◽  
Asep Supriyadi ◽  
Cek Putera Andalan
Keyword(s):  
Mechanical Properties ◽  
Lightweight Concrete ◽  
Physical And Mechanical Properties ◽  
Filler Material ◽  
Soap Bubbles ◽  
Volume Weight ◽  
Concrete Masonry ◽  
Chemical Admixture ◽  
Binder Material

One of the methods used to reduce the weight of a construction is by reducing the weight of the walls of the building. In such a case, a wall made of red brick has a volume weight of 1,500–2,000 kg/m3, and concrete masonry bricks made of CLC have a volume weight of 400–1,800 kg/m3. So, in comparison, concrete masonry bricks have a volume weight that is ≤ 50% of that of red brick. In the manufacturing of concrete masonry bricks, one variant is CLC (Cellular Lightweight Concrete), produced using a mixture of cement, sand, chemical admixture and water, with the filler material in the form of air generated as microscale soap bubbles (microbubbles), also known as foam agent. In the manufacturing of concrete masonry bricks, the cement as a binder material clearly affects the physical and mechanical properties of the bricks produced. This research is conducted to investigate the effect of the amount or composition of the cement used on the physical and mechanical properties of concrete masonry bricks. The composition is varied among 200, 250, 300, 350 and 400 kg/m3 of cement usage.

Comparison between Cobalt and Niobium as a Matrix Component for Diamond Impregnated Tools Used for Stone Cutting

2013 ◽  
Vol 548 ◽  
pp. 98-105 ◽  
Author(s):  
Hellen C.P. de Oliveira ◽  
Adriano Coelho ◽  
Pedro M. Amaral ◽  
Jorge C. Fernandes ◽  
Luís Guerra Rosa
Keyword(s):  
Mechanical Properties ◽  
Comparative Study ◽  
Hot Pressing ◽  
Powder Compaction ◽  
Wear Properties ◽  
Matrix Component ◽  
Stone Cutting ◽  
Binder Material ◽  
Near Future ◽  
Co Alloys

This investigation examines the possibility of adding niobium (Nb) to the Fe-Cu system in order to obtain, after powder compaction and sintering, a binder material (bonding matrix) with the adequate wear properties needed for the fabrication of diamond impregnated tools for stone cutting. The main objective is the replacement of cobalt (Co) by Nb in the Fe-Cu-Co alloys that are currently used in diamond tools. For this purpose, a comparative study has been conducted on some selected compositions of matrices integrated in cutting discs. Results of diamond impregnated 25wt%Fe-50wt%Cu-25wt%Nb and 25wt%Fe-50wt%Cu-25wt%Co matrices are directly compared because all tests were conducted under similar conditions. Two types of diamonds were used: without coating and Ti-coated. After the hot-pressing cycles, the main mechanical properties of the sintered bodies were evaluated. Cutting tests under real conditions, in Porriño granite, were carried out to compare the performance of the tools. Although the mechanical properties of the matrices with Nb were different from those found in the matrices with Co, the results obtained from the cutting tests have revealed that the tools made of 25wt%Fe-50wt%Cu-25wt%Nb and 25wt%Fe-50wt%Cu-25wt%Co matrices, both with 50/60 mesh diamonds, show quite similar behaviour during the cutting operations, thus indicating that replacement of Co by Nb is a promising route to be followed in the near future.

scholarly journals Applicability of Different Bio-based Polymers for Wiring Boards

2019 ◽  
Vol 63 (1) ◽  
pp. 1-8 ◽  
Author(s):  
Carolin Henning ◽  
Anna Schmid ◽  
Sophia Hecht ◽  
Kathrin Harre ◽  
Reinhard Bauer
Keyword(s):  
Mechanical Properties ◽  
Flame Retardant ◽  
Cellulose Acetate ◽  
Thick Film ◽  
Electrical Performance ◽  
Biobased Materials ◽  
Board Material ◽  
Order Of Magnitude ◽  
Wiring Board ◽  
Performance Surface

The paper gives a review of experiments for the application of biodegradable, sustainable polymers as a wiring board material. In the paper two different biobased materials and the standard PCB materials FR4 and FR2 were compared. The investigations refer to mechanical, electrical performance, surface quality the flammability and applicability for Polymer Thick Film Technology (PTFT) of the biobased material. The biobased materials are polylactic acid (PLA) mixed with different contents of cellulose acetate (CA) or flame retardant zinc pyrophosphate (ZnPP) and polyurethane (PU) with CA. The results show that the addition of CA to the polymers leads to a change of different properties for PLA and to a significant change in mechanical properties for PU. The use of ZnPP in PLA shows major improvements regarding the flammability of the polymer. The properties of the samples are in the same order of magnitude as the properties of FR2.

Preparation of ternary alloy libraries by means of thick film deposition and interdiffusion: structure and mechanical properties

2003 ◽  
Vol 804 ◽  
Author(s):  
A. Rar ◽  
E. D. Specht ◽  
H. M. Meyer ◽  
M. L. Santella ◽  
E.P. George ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thick Film ◽  
Ternary Alloy ◽  
Film Deposition ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
Materials Development ◽  
X Ray ◽  
Sapphire Substrates ◽  
Combinatorial Materials

A method of preparing ternary alloy libraries for combinatorial materials development based on thick film deposition and interdiffusion was studied, using the Ni-Fe-Cr ternary system. Specimens were prepared by depositing films onto sapphire substrates with an e-beam evaporation system followed by annealing in a vacuum for interdiffusion. The specimens were examined using cross sectional scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS), scanning Auger microanalysis (SAM), angular resolved x-ray fluorescence (AR-XRF), x-ray diffraction (XRD), and nanoindentation. The method proved an effective way to make the alloy libraries for screening mechanical properties by means of nanoindentation.

Influence of a binder material on the mechanical properties and model parameters of a subgrade filler

2021 ◽  
Vol 15 (1) ◽  
Author(s):  
Yingying Zhao ◽  
Jiahui Wang ◽  
Lei Su ◽  
Xianzhang Ling ◽  
Yongqiang Zhang
Keyword(s):  
Mechanical Properties ◽  
Model Parameters ◽  
Binder Material

Study on Features and Application of Typical Smart Materials

2014 ◽  
Vol 599-601 ◽  
pp. 114-117
Author(s):  
Guo Min Lin ◽  
Yan Hua Li
Keyword(s):  
Mechanical Properties ◽  
Smart Materials ◽  
Smart Material ◽  
Future Research ◽  
Magnetostrictive Materials ◽  
Movement Characteristics ◽  
The Future ◽  
Working Principle ◽  
The Relationship

The working principle and structure of piezoelectronic material are studied. The relationship between piezoelectronic element signal and deformation are given. The microstruction and movement characteristics of magnetostrictive materials are alynazed. The performance, mechanical properties and applications of electro rheological fluids are researched. At last the future research focuses of smart material are prospected. Keywords: Smart materials; Piezoelectronic material; Magnetostrictive materials; Electro rheological materials

Mechanical properties of SMD interconnections on flexible and rigid substrates

2016 ◽  
Vol 28 (1) ◽  
pp. 27-32 ◽  
Author(s):  
Damian Nowak ◽  
Andrzej Dziedzic ◽  
Zbigniew Żaluk ◽  
Henryk Roguszczak ◽  
Mariusz Węglarski
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Thick Film ◽  
Thermal Ageing ◽  
Flexible Substrates ◽  
Conductive Adhesives ◽  
Content Type ◽  
Electrically Conductive Adhesive ◽  
Thermally Conductive

Purpose – The paper aims to investigate on the mechanical properties of surface-mount device (SMD) interconnections made on flexible and rigid substrates. Design/methodology/approach – The durability of joints to shear strength was measured with tensile machine. Investigations were carried out for 0402- and 0603-sized ceramic passives and integrated circuits in SOIC-8, TSSOP-8, XSON3 and XSON6 packages. Three types of flexible substrates (Kapton, Mylar and Pyralux) and two types of rigid substrates (LTCC and alumina) were used. SMD components were mounted with SAC solder or electrically conductive adhesive. Contact pads were made of Ag-based polymer paste on flexible substrates and PdAg-based cermet paste on ceramics. The shear strength was measured for as-made and long-term thermally aged test structures. The average durability and standard deviation were compared for different combination of materials. Moreover, mechanical properties of interconnections made of polymer thick-film pastes or electrically/thermally conductive adhesives between ceramic chips and flexible/ceramic substrates were investigated. Findings – The mechanical properties of joints strongly depend on configuration of applied materials. Some of them exhibit high durability to shear strength, while other should not be recommended due to very weak connections. Additionally, long-term thermal ageing showed that exploitation of such connections at elevated temperature in some cases might increase their strength. However, for some materials, it leads to accelerated degradation of joints. Originality/value – This paper provides practical information about SMD interconnections made with standard materials (lead-free solder, electrically/thermally conductive adhesives) and proposed non-standard procedures, e.g. assembling of ceramic chips with low temperature cermet or polymer thick-film conductive pastes.

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