Characterization of Young's modulus and residual stress gradient of MetalMUMPs electroplated nickel film

2009 ◽  
Vol 154 (1) ◽  
pp. 149-156 ◽  
Author(s):  
Siyuan He ◽  
John S. Chang ◽  
Lihua Li ◽  
Hsu Ho
Keyword(s):  
Residual Stress ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Stress Gradient ◽  
Nickel Film ◽  
Residual Stress Gradient

scholarly journals Measurement of the properties of MetalMUMPS® thin films

2021 ◽  
Author(s):  
John Shih-Hua Chang
Keyword(s):  
Residual Stress ◽  
Silicon Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Stress Gradient ◽  
Nickel Film ◽  
Machining Process ◽  
Stress Difference ◽  
Mems Devices ◽  
Silicon Nitride Films

The metal multi-user micro-electro-mechanical-systems (MEMS) processes (MetalMUMPs®) micro-machining process includes two silicon nitride films, one polysilicon film, and one nickel film for constructing various MEMS devices. This thesis presents property measurements of the metalMUMPs® silicon nitride and nickel films. Fabricated MetalMUMPs® silicon nutride prototypes were used to experimentally determine a Young’s modulus of 209 GPa and a residual stress difference of 169 MPa for the silicon nitride films. A method, which uses the deformations along the width of bi-layered cantilever beams, was proposed to determine the residual stress difference of the two silicon nitride films. Fabricated MetalMUMPs® nickel prototypes were used to experimentally extract a Young’s modulus of 159 GPa and a residual stress gradient of -4.72 MPa/m for the nickel film. A micro bridge mechanism was developed to lift long silicon nitride beams for the determination of the residual stress difference of the two silicon nitride films.

scholarly journals Measurement of the properties of MetalMUMPS® thin films

2021 ◽  
Author(s):  
John Shih-Hua Chang
Keyword(s):  
Residual Stress ◽  
Silicon Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Stress Gradient ◽  
Nickel Film ◽  
Machining Process ◽  
Stress Difference ◽  
Mems Devices ◽  
Silicon Nitride Films

The metal multi-user micro-electro-mechanical-systems (MEMS) processes (MetalMUMPs®) micro-machining process includes two silicon nitride films, one polysilicon film, and one nickel film for constructing various MEMS devices. This thesis presents property measurements of the metalMUMPs® silicon nitride and nickel films. Fabricated MetalMUMPs® silicon nutride prototypes were used to experimentally determine a Young’s modulus of 209 GPa and a residual stress difference of 169 MPa for the silicon nitride films. A method, which uses the deformations along the width of bi-layered cantilever beams, was proposed to determine the residual stress difference of the two silicon nitride films. Fabricated MetalMUMPs® nickel prototypes were used to experimentally extract a Young’s modulus of 159 GPa and a residual stress gradient of -4.72 MPa/m for the nickel film. A micro bridge mechanism was developed to lift long silicon nitride beams for the determination of the residual stress difference of the two silicon nitride films.

A Nanoindentation-Based Microbridge Testing Method for Mechanical Characterization of Thin Films for MEMS Applications

2005 ◽  
Author(s):  
Zhiqiang Cao ◽  
Tong-Yi Zhang ◽  
Xin Zhang
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Mechanical Characterization ◽  
Young's Modulus ◽  
Chemical Vapor ◽  
Testing Method ◽  
Chemical Vapor Deposited

Plasma-enhanced chemical vapor deposited (PECVD) silane-based oxides (SiOx) have been widely used in both microelectronics and MEMS (MicroElectroMechanical Systems) to form electrical and/or mechanical components. In this paper, a novel nanoindentation-based microbridge testing method is developed to measure both the residual stresses and Young’s modulus of PECVD SiOx films on silicon wafers. Theoretically, we considered both the substrate deformation and residual stress in the thin film and derived a closed formula of deflection versus load. The formula fitted the experimental curves almost perfectly, from which the residual stresses and Young’s modulus of the film were determined. Experimentally, freestanding microbridges made of PECVD SiOx films were fabricated using the silicon undercut bulk micromachining technique. The results showed that the as-deposited PECVD SiOx films had a residual stress of −155±17 MPa and a Young’s modulus of 74.8±3.3 GPa.

scholarly journals Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers

Nanomaterials ◽  
2022 ◽  
Vol 12 (2) ◽  
pp. 265
Author(s):  
Luis A. Velosa-Moncada ◽  
Jean-Pierre Raskin ◽  
Luz Antonio Aguilera-Cortés ◽  
Francisco López-Huerta ◽  
Agustín L. Herrera-May
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Thick Films ◽  
Stress Gradient ◽  
Chemical Vapor ◽  
Intrinsic Stress ◽  
Pressure Chemical ◽  
Reference Layer

Precise prediction of mechanical behavior of thin films at the nanoscale requires techniques that consider size effects and fabrication-related issues. Here, we propose a test methodology to estimate the Young’s modulus of nanometer-thick films using micromachined bilayer cantilevers. The bilayer cantilevers which comprise a well-known reference layer and a tested film deflect due to the relief of the residual stresses generated during the fabrication process. The mechanical relationship between the measured residual stresses and the corresponding deflections was used to characterize the tested film. Residual stresses and deflections were related using analytical and finite element models that consider intrinsic stress gradients and the use of adherence layers. The proposed methodology was applied to low pressure chemical vapor deposited silicon nitride tested films with thicknesses ranging from 46 nm to 288 nm. The estimated Young’s modulus values varying between 213.9 GPa and 288.3 GPa were consistent with nanoindentation and alternative residual stress-driven techniques. In addition, the dependence of the results on the thickness and the intrinsic stress gradient of the materials was confirmed. The proposed methodology is simple and can be used to characterize diverse materials deposited under different fabrication conditions.

Residual Stress and Thickness Control of Piezoelectric Multilayer Micromirror Actuators for Initial Deflection Minimization

1999 ◽  
Author(s):  
Myeong-Jin Kim ◽  
Young-Ho Cho
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Stress Gradient ◽  
Experimental Results ◽  
Initial Deflection ◽  
Thickness Control ◽  
Fabrication And Characterization ◽  
Layered Thin Film ◽  
Residual Stress Gradient

Abstract We present the design, fabrication and characterization of multi-layer piezoelectric micromirror actuators for minimizing the initial deflection without loosing the actuation performance. We modified the initial designs in order to minimize the initial deflection of the multi-layer device by changing the residual stress and thickness ratio of selected layers, thereby reducing the residual stress gradient across the multi-layered thin film materials. The modified designs are fabricated by surface-micromachining process. Experimental results indicate that over 70% reduction of the initial deflection has been achieved by the residual stress and thickness control of the multi-layer piezoelectric micromirror devices.

The evaluation of Young's modulus and residual stress of nickel films by microbridge testings

2004 ◽  
Vol 15 (12) ◽  
pp. 2389-2394 ◽  
Author(s):  
Z M Zhou ◽  
Y Zhou ◽  
C S Yang ◽  
J A Chen ◽  
G F Ding ◽  
...  
Keyword(s):  
Residual Stress ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Nickel Films

Microbridge Testing of Thin Films Under Small Deformation

1999 ◽  
Vol 594 ◽  
Author(s):  
T. Y. Zhang ◽  
Y. J. Su ◽  
C. F. Qian ◽  
M. H. Zhao ◽  
L. Q. Chen
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Silicon Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Chemical Vapor ◽  
Small Deformation ◽  
Nitride Film ◽  
Silicon Nitride Film ◽  
Pressure Chemical

AbstractThe present work proposes a novel microbridge testing method to simultaneously evaluate the Young's modulus, residual stress of thin films under small deformation. Theoretic analysis and finite element calculation are conducted on microbridge deformation to provide a closed formula of deflection versus load, considering both substrate deformation and residual stress in the film. Silicon nitride films fabricated by low pressure chemical vapor deposition on silicon substrates are tested to demonstrate the proposed method. The results show that the Young's modulus and residual stress for the annealed silicon nitride film are respectively 202 GPa and 334.9 MPa.

Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications

2012 ◽  
Vol 18 (7-8) ◽  
pp. 945-953 ◽  
Author(s):  
Oliver Pabst ◽  
Michael Schiffer ◽  
Ernst Obermeier ◽  
Tolga Tekin ◽  
Klaus Dieter Lang ◽  
...  
Keyword(s):  
Residual Stress ◽  
High Temperature ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Temperature Applications

A UNIQUE APPROACH TO EXPERIMENTAL CHARACTERIZATION OF A THERMOSETTING POLYMER MATRIX FOR ICME FRAMEWORKS

2021 ◽  
Author(s):  
MICHAEL N. OLAYA ◽  
SAGAR PATIL ◽  
GREGORY M. ODEGARD ◽  
MARIANNA MAIARÙ
Keyword(s):  
Tensile Strength ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Cure Kinetics ◽  
Image Correlation ◽  
Scanning Calorimetry ◽  
Mixing Ratios ◽  
Fitting Procedure ◽  
Amine Content

A novel approach for characterization of thermosetting epoxy resins as a function of the degree of cure is presented. Density, cure kinetics, tensile strength, and Young’s modulus are experimentally characterized across four mixing ratios of DGEBF/DETDA epoxy. Dynamic differential scanning calorimetry (DSC) is used to characterize parameters for a Prout-Thompkins kinetic model unique to each mixing ratio case through a data fitting procedure. Tensile strength and Young’s modulus are then characterized using stress-strain data extracted from quasi-static, uniaxial tension tests at room temperature. Strains are measured with the 2-D digital image correlation (DIC) optical strain measurement technique. Strength tends to increase as amine content use in the formulation increases. The converse trend is observed for Young’s modulus. Density measurements also reveal an inverse relationship with amine content.

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