scholarly journals Room-temperature plasma-enhanced atomic layer deposition of ZnO: Film growth dependence on the PEALD reactor configuration

2017 ◽  
Vol 326 ◽  
pp. 281-290 ◽  
Author(s):  
Mari Napari ◽  
Manu Lahtinen ◽  
Alexey Veselov ◽  
Jaakko Julin ◽  
Erik Østreng ◽  
...  
RSC Advances ◽  
2020 ◽  
Vol 10 (31) ◽  
pp. 18073-18081
Author(s):  
D. Arl ◽  
V. Rogé ◽  
N. Adjeroud ◽  
B. R. Pistillo ◽  
M. Sarr ◽  
...  

In this study, less contaminated and porous SiO2 films were grown via ALD at room temperature.


2016 ◽  
Vol 34 (1) ◽  
pp. 01A118 ◽  
Author(s):  
Alexander Strobel ◽  
Hans-Dieter Schnabel ◽  
Ullrich Reinhold ◽  
Sebastian Rauer ◽  
Andreas Neidhardt

2015 ◽  
Vol 3 (19) ◽  
pp. 4848-4851 ◽  
Author(s):  
Matthias M. Minjauw ◽  
Jolien Dendooven ◽  
Boris Capon ◽  
Marc Schaekers ◽  
Christophe Detavernier

A plasma enhanced ALD process for Ru using RuO4 and H2-plasma is reported at sample temperatures ranging from 50 °C to 100 °C.


2021 ◽  
Author(s):  
Yuanyuan Cao ◽  
Sha Zhu ◽  
Julien Bachmann

The two-dimensional material and semiconducting dichalcogenide hafnium disulfide is deposited at room temperature by atomic layer deposition from molecular precursors dissolved in hexane.


Author(s):  
Yoon Kyeung Lee ◽  
Chanyoung Yoo ◽  
Woohyun Kim ◽  
Jeongwoo Jeon ◽  
Cheol Seong Hwang

Atomic layer deposition (ALD) is a thin film growth technique that uses self-limiting, sequential reactions localized at the growing film surface. It guarantees exceptional conformality on high-aspect-ratio structures and controllability...


1999 ◽  
Vol 169-170 ◽  
pp. 159-162 ◽  
Author(s):  
K. Kobayashi ◽  
S. Okudaira ◽  
Yuuki Ishida

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