scholarly journals Use of reciprocal lattice layer spacing in electron backscatter diffraction pattern analysis

2000 ◽  
Vol 81 (2) ◽  
pp. 67-81 ◽  
Author(s):  
J.R Michael ◽  
J.A Eades
Keyword(s):  
Diffraction Pattern ◽  
Pattern Analysis ◽  
Electron Backscatter Diffraction ◽  
Reciprocal Lattice ◽  
Layer Spacing ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Identification of Phases in the Wide-Gap Region Brazed with BNi-3 Filler Metal Powder Using Electron Backscatter Diffraction

2007 ◽  
Vol 544-545 ◽  
pp. 355-358 ◽  
Author(s):  
Yong Hwan Kim ◽  
Il Ho Kim ◽  
K.T. Kim ◽  
Seung Y. Shin ◽  
S.I. Kwun
Keyword(s):  
Metal Powder ◽  
Pattern Analysis ◽  
Filler Metal ◽  
Electron Backscatter Diffraction ◽  
Ternary Eutectic ◽  
Lattice Parameter ◽  
Electron Backscatter ◽  
Binary Eutectic ◽  
Wide Gap ◽  
Backscatter Diffraction

The phases formed in the wide-gap region brazed with BNi-3 filler metal powder in IN738 superalloy were investigated by electron backscatter diffraction (EBSD). The morphology and chemical composition of the phase were investigated by field emission scanning electron microscopy (FESEM) and Auger electron spectroscopy (AES). The wide-gap region brazed with BNi-3 filler metal had a microstructure consisting of primary Ni3B, binary eutectic of Ni3B-Ni solid solution and ternary eutectic of Ni3B-Ni-Ni3Si structure. EBSD pattern analysis revealed that the Ni3B had orthorhombic structure with lattice parameter of a=0.439, b=0.522 and c=0.662 nm, and the Ni3Si phase had cubic structure with lattice parameter of a=0.350 nm.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

Sign in / Sign up

Export Citation Format

Share Document