Surface and interface stress effects on interfacial and nanostructured materials

1997 ◽  
Vol 237 (2) ◽  
pp. 180-184 ◽  
Author(s):  
R.C. Cammarata
2008 ◽  
Vol 35 (1-3) ◽  
pp. 267-286 ◽  
Author(s):  
Mi Changwen ◽  
Demitris Kouris

In this manuscript, we discuss the influence of surface and interface stress on the elastic field of a nanoparticle, embedded in a finite spherical substrate. We consider an axially symmetric traction field acting along the outer boundary of the substrate and a non-shear uniform eigenstrain field inside the particle. As a result of axial symmetry, two Papkovitch-Neuber displacement potential functions are sufficient to represent the elastic solution. The surface and interface stress effects are fully represented utilizing Gurtin and Murdoch's theory of surface and interface elasticity. These effects modify the traction-continuity boundary conditions associated with the classical continuum elasticity theory. A complete methodology is presented resulting in the solution of the elastostatic Navier's equations. In contrast to the classical solution, the modified version introduces additional dependencies on the size of the nanoparticles as well as the surface and interface material properties.


1995 ◽  
Vol 405 ◽  
Author(s):  
R. C. Cammarata ◽  
K. Sieradzki

AbstractSurface and interface stresses, which are intrinsic thermodynamic quantities associated with all types of solid surfaces and interfaces are reviewed. A simple model for one type of interface stress is presented. These stresses can strongly influence the structure and mechanical behavior of nanostructured materials such as multilayered materials withultrathin layer thicknesses.


2002 ◽  
Vol 16 (01n02) ◽  
pp. 64-70 ◽  
Author(s):  
Q. JIANG ◽  
D. S. ZHAO ◽  
M. ZHAO

Based on the theoretical consideration on the size-dependence of solid-liquid interface energy, a model for the intrinsic interface stress of metallic, ionic and semiconductor nanosolid has been developed, free from adjustable parameters. Modeling predictions agree well with experimental observations and other theoretical results.


2001 ◽  
Vol 680 ◽  
Author(s):  
Agustinus Sutandi ◽  
P. Paul Ruden ◽  
Kevin F. Brennan

ABSTRACTThe physics of bulk wurtzite-structure III-nitride materials and of III-nitride heterostructures includes many phenomena that can be modulated by the application of stress. In particular, p- type material is expected to display a rich variety of piezo-resistive and piezo-optic effects that originate from the stress-induced modulation of lattice polarization charges, of valence band energies, and of bulk, surface, and interface defect states in the band gap. Here we focus on the expected effects of in-plane uniaxial on p-channel AlGaN/GaN heterostructures grown along the hexagonal axis on sapphire substrates. The valence band structure in the channel region is calculated self-consistently in the framework of a six-band Rashba-Sheka-Pikus (RSP) Hamiltonian. Stress-effects are included (in linear elastic theory) through deformation potentials and through the modulation of interfacial polarization charges associated with the piezoelectric nature of the constituent materials.


1993 ◽  
Vol 317 ◽  
Author(s):  
R.C. Cammarata

ABSTRACTA review of surface and interface stresses relevant to thin film growth is presented. It is shown that surface stress effects that are generally ignored in the analysis of epitaxy can have an influence on the critical thickness for epitaxy, especially at larger Misfits. A discussion of intrinsic stress generation from surface stress is also presented.


1996 ◽  
Vol 440 ◽  
Author(s):  
H. Ibach ◽  
A. Grossmann.

AbstractRecent experimental measurements on the interface stresses in two heteroepitaxial systems have shown that the interface stresses were unexpectedly large. For thin deposited layers, the interface stress can exceed the stress caused by the lattice mismatch by far. Arguments are presented which indicate that the surface stress may be caused by the charge transfer between the deposit and the substrate. The consequences for the critical thickness of pseudomorphic films are discussed and it is shown that depending on the sign of the interface stress and the mismatch the critical thickness can be either reduced or enhanced by a large factor.


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