Characterization of Hygroscopic Swelling and Thermo-Hygro-Mechanical Design on Electronic Package

2009 ◽  
Vol 25 (3) ◽  
pp. 225-232 ◽  
Author(s):  
H.-C. Hsu ◽  
Y.-T. Hsu
Keyword(s):  
Moisture Absorption ◽  
Mechanical Design ◽  
Three Dimensional ◽  
Polymeric Materials ◽  
Moisture Diffusivity ◽  
Moisture Concentration ◽  
Moisture Expansion ◽  
Hygroscopic Swelling ◽  
Three Dimensional Models ◽  
Materials Used

AbstractThis paper discusses a successful experimental procedure to determine the hygroscopic swelling property of polymeric materials used in electronic packaging. Saturated moisture concentration and moisture diffusivity were determined by measuring the weight gain during moisture absorption. Hygromechanical properties, such as the coefficientof moisture expansion (CME), were determined through Thermo-Mechanical Analyzer (TMA) and Thermo-Gravimetric Analyzer (TGA) techniques. Fick's law of transient diffusion is solved by using finite element (FE) analysis to evaluate the overall moisture distributions. Both two-dimensional and three-dimensional models based on the FE software ANSYS were developed to predict the thermal-induced strain, hygroscopic swelling deformation, and residual thermohygro-mechanicalstress distributions. Reliability analysis at three JEDEC preconditioning standards 60°C60%RH, 85°C60%RH and 85°C85%RH was carried out. A series of comprehensive parametric studies were conducted in this research.

scholarly journals Numerical Simulation of Water Absorption and Swelling in Dehulled Barley Grains during Canned Porridge Cooking

Processes ◽  
2018 ◽  
Vol 6 (11) ◽  
pp. 230 ◽  
Author(s):  
Lei Wang ◽  
Mengting Wang ◽  
Mingming Guo ◽  
Xingqian Ye ◽  
Tian Ding ◽  
...  
Keyword(s):  
Moisture Absorption ◽  
Three Dimensional ◽  
Processing Conditions ◽  
Relative Deviation ◽  
Cooking Process ◽  
Proposed Model ◽  
Hygroscopic Swelling ◽  
3D Numerical Model ◽  
Barley Grains ◽  
Experimental Values

Understanding the hydration behavior of cereals during cooking is industrially important in order to optimize processing conditions. In this study, barley porridge was cooked in a sealed tin can at 100, 115, and 121 °C, respectively, and changes in water uptake and hygroscopic swelling in dehulled barley grains were measured during the cooking of canned porridge. In order to describe and better understand the hydration behaviors of barley grains during the cooking process, a three-dimensional (3D) numerical model was developed and validated. The proposed model was found to be adequate for representing the moisture absorption characteristics with a mean relative deviation modulus (P) ranging from 4.325% to 5.058%. The analysis of the 3D simulation of hygroscopic swelling was satisfactory for describing the expansion in the geometry of barley. Given that the model represented the experimental values adequately, it can be applied to the simulation and design of cooking processes of cereals grains, allowing for saving in both time and costs.

scholarly journals Numerical Analysis of the Brittle-Ductile Transition in the Failure-Mode in Polymeric Materials

2014 ◽  
Vol 566 ◽  
pp. 310-315
Author(s):  
Josué Aranda-Ruiz ◽  
J.A. Loya
Keyword(s):  
Failure Mode ◽  
Damage Model ◽  
Three Dimensional ◽  
Polymeric Materials ◽  
Material Behavior ◽  
The Finite Element Method ◽  
Brittle Ductile Transition ◽  
User Subroutine ◽  
The Difference ◽  
Three Dimensional Models

In this paper we analyze, using the Finite Element Method, the process of brittle-ductile transition in the failure mode observed in polycarbonate notched specimens under impact loads. In order to analyze this transition we have implemented, through a user subroutine, a damage model which combines a tensional fracture criterion and an energetic, acting simultaneously. The competition between both criteria predicts the difference in material behavior from a critical impact velocity, and how this transition is produced on different planes through the thickness of the specimen. These results show the necessity of employing three-dimensional models for its study.

scholarly journals Analysis of the dependence of stresses and deformations on the surfaces of shoe soles of different thicknesses and materials

2021 ◽  
Vol 273 ◽  
pp. 05001
Author(s):  
Olesya Golubeva ◽  
Alina Pogorelova
Keyword(s):  
Three Dimensional ◽  
Stress And Strain ◽  
Medium Density ◽  
Suitable Material ◽  
Two Component ◽  
Shoe Soles ◽  
Three Dimensional Models ◽  
Materials Used ◽  
Distribution Of Stress ◽  
Shape And Size

For this study, three-dimensional models of the soles of work shoes of different thicknesses and consisting of different materials were created. These models were analyzed to obtain the distribution of stress and strain on their surfaces. To build the model, we used experimental data on the shape and size of the sole, as well as the properties of specific materials used in the manufacture of soles for work shoes used in agriculture. The goal was to determine the most suitable material, that is, which of the materials has the most suitable characteristics for the sole, has the best wear resistance when used in agriculture. We noticed a significant reduction in deformations on the surface of the sole with an increase in the thickness of the sole, as well as when using two-component casting of the sole from a combination of materials: low-density EVA and flexible PU, medium-density EVA and soft PVC. This indicates their advantages and maximum suitability.

scholarly journals Simulation Models for Solar Photovoltaic Materials

2021 ◽  
pp. 114-133
Author(s):  
M. Rizwan
Keyword(s):  
Solar Cell ◽  
Band Structure ◽  
Computer Modelling ◽  
Three Dimensional ◽  
Simulation Models ◽  
Semiconductor Materials ◽  
Long Time ◽  
Three Dimensional Models ◽  
Materials Used ◽  
Device Operation

Semiconducting materials have dominated the photovoltaic industry for a long time. The advancement in solar cell technology is significantly influenced by computer modelling, designing and simulations of the semiconductor materials used for the device operation. Different modelling techniques including one, two and three dimensional models had been employed to comprehend the device operation of solar cell and other electronic devices based on semiconductor materials such as silicon and gallium arsenide. The performance of computing power is increasing with the passage of time in order to improve modelling and designing of different semiconductor materials for solar cell devices. In this chapter, different reported semiconductor materials, their standard characteristics and basic history of modelling, standard models used in photovoltaic industry and principles of modelling such as carrier statistics, transitions, band structure and mobility are explained in detail. Different characteristics of semiconductor material like the carrier transportation, carrier statistics, band structure, and heavy doping effect and carrier generations are described with respect to material modelling.

Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor

2009 ◽  
Vol 419-420 ◽  
pp. 493-496
Author(s):  
Hsiang Chen Hsu ◽  
Li Ming Chu ◽  
Lih Shan Chen ◽  
Shen Li Fu
Keyword(s):  
Vapor Pressure ◽  
Moisture Absorption ◽  
Three Dimensional ◽  
Moisture Diffusion ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Mechanical Analysis ◽  
Element Analysis ◽  
Swelling Properties ◽  
Moisture Expansion

A combined effect of moisture diffusion, heat transfer, and hygro-thermo-vapor pressure modeling for pre-mold QFN CMOS Image Sensor (CIS) package has been developed in this study. Hygroscopic swelling properties such as saturation, coefficient of moisture expansion (CME) and activation energy can be extracted through TMA (Thermal Mechanical Analysis) and TGA (Thermal Gravitational Analysis) instruments. Fick’s second law of transient diffusion is solved by using finite element analysis (FEA) to evaluate the overall moisture distributions. With obtained experimental data, a three-dimensional FEA CIS model using the “thermal-wetness” technique is developed to predict the moisture absorption, moisture desorption, temperature distributions, hygro-thermo-vapor pressure mechanical coupled effect and the residual stress distributions at JEDEC pre-conditioning standard JESD22-A120.

A Three Dimensional Virtual System Used to Analyze the Normal and Prosthetic Joint of the Hip

2019 ◽  
Vol 34 ◽  
pp. 165-174
Author(s):  
Razvan Cristian Vaduva ◽  
Ilaria Lorena Petrovici ◽  
Mihai Catalin Tenovici ◽  
Danut Nicolae Tarnita ◽  
Dragoş Laurenţiu Popa ◽  
...  
Keyword(s):  
Femoral Neck ◽  
Surgical Procedures ◽  
Hip Arthroplasty ◽  
Three Dimensional ◽  
Prosthetic Material ◽  
Joint Movement ◽  
Prosthetic Joint ◽  
Cemented Arthroplasty ◽  
Three Dimensional Models ◽  
Materials Used

Treatment of hip pathology has evolved over the last two centuries, ranging from rudimentary surgical procedures to modern hip arthroplasty, with an explosion marked in the last 30 years, considered to be one of the most successful surgeries to date. Hip arthroplasty is a permanent challenge due to the desire to discover the "supreme prosthesis", for which competition is still open. Hip disorders requiring prosthesis show a change in articular morphology. Among the most common medical conditions that have as final therapeutic solution hip arthroplasty are: coxarthrosis, both primary and secondary, followed by traumatic conditions: femoral neck collapse and femoral neck pseudarthrosis, aseptic head necrosis femoral stage III, as well as rheumatic coxitis from rheumatoid arthritis, ankylosing spondylitis or juvenile art. Endoprosthetic arthroplasty can be defined as an intervention of reconstructive surgery with bone sacrifice and prosthetic replacement of the articular components. It is, in the end, an operation aimed at restoring joint mobility and normal functioning of the muscles, ligaments and other periarticular structures that control joint movement. The materials initially used (glass, metal, plastic) did not have the desired bone strength and integration capacity. It followed the development of cemented implants, obtaining different types of cement with better and better quality. Problems arising from cemented arthroplasty (decimation, involving prosthetic revision) have led to a parallel development of the design and materials used for uncured prostheses with the possibility of very good integration of prosthetic material into the bone, raising them to the top of preferences in recent years. Treatment of hip pathology has evolved over the last two centuries, ranging from rudimentary surgical procedures to modern hip arthroplasty, with an explosion marked in the last 30 years, considered to be one of the most successful surgeries to date. The purpose of this study was to obtain the three-dimensional models of the hip joint and the prosthesis for the use of these models for various analyzes and virtual experiments. At the end of the paper important conclusions were drawn based on the results obtained in the simulations using the finite element method.

Hygrothermal Damage in Graphite/Epoxy Laminates

1987 ◽  
Vol 109 (1) ◽  
pp. 3-11 ◽  
Author(s):  
H. T. Hahn
Keyword(s):  
Residual Stresses ◽  
Moisture Absorption ◽  
Moisture Diffusion ◽  
Moisture Diffusivity ◽  
Moisture Concentration ◽  
Bulk Diffusivity ◽  
Hygrothermal Environments ◽  
Swelling Strain

The use of micromechanics equations for moisture diffusivity shows that the in situ diffusivity is slightly lower than the bulk diffusivity for matrix resins, thereby indicating absence of any matrix damage in virgin composites. When exposed to hygrothermal environments, however, composites undergo degradation which manifests itself in anomalous moisture diffusion behavior and reduced structural performance. The hygrothermal degradation is the result of matrix plasticization, microvoid formation, and microcracking. The time dependence of plasticization as well as the tensile stress resulting from steep moisture gradient is responsible for the damage induced by thermal spiking of wet composites. Swelling of neat resins is frequently less than predicted by the volume additivity. A simple micromechanics analysis provides a good estimate of composite swelling strain from resin properties. The bilinearity and the hysteresis observed in relations between swelling and moisture content are attributed to the existence of a threshold moisture concentration below which swelling is negligible. Relaxation of residual stresses is a long-term process under nonhostile environments. However, it is accelerated considerably around and above the glass transition temperature. The fast stress relaxation can change the transverse ply stress from compressive to tensile after thermal spiking, thereby inducing ply cracking and accelerating the subsequent moisture absorption. How residual stresses can affect ply cracking and delamination is shown through a fracture mechanics analysis.

Thermal-Hygro-Mechanical Design for CMOS Image Sensor

2007 ◽  
Vol 364-366 ◽  
pp. 1151-1156 ◽  
Author(s):  
Hsiang Chen Hsu ◽  
Hui Yu Lee ◽  
Yu Cha Hsu
Keyword(s):  
Finite Element ◽  
Moisture Absorption ◽  
Mechanical Design ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Ansys Software ◽  
Parametric Studies ◽  
Good Agreement

The characteristic of overall structure for CMOS image sensor has been studied in this research. A three-dimensional solid model of CMOS image sensor based on finite element ANSYS software is developed to predict the thermo-induced strain and the stress induced by moisture absorption. The predicted thermal-induced displacements were found to be very good agreement with the Moiré interferometer experimental in-plane deformation. The developed finite element 3D model, therefore, is applied to simulate the mechanism of thermal and hygroscopic stresses based on JEDEC pre-condition standard JESD22-A120. A series of comprehensive parametric studies were conducted in this research. The design rules for thermal optimization of CMOS image senor are summarized.

Plastic replicas as three-dimensional models of pulps

1975 ◽  
Vol 39 (8) ◽  
pp. 544-546
Author(s):  
HL Wakkerman ◽  
GS The ◽  
AJ Spanauf
Keyword(s):  
Three Dimensional ◽  
Dimensional Models ◽  
Three Dimensional Models
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