Thickness-Controlled Three-Dimensional Dirac Semimetal for Scalable High-Performance Terahertz Optoelectronics

ACS Photonics ◽  
2021 ◽  
Author(s):  
Xiaomei Yao ◽  
Shengxi Zhang ◽  
Qiang Sun ◽  
Peizong Chen ◽  
Xutao Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Dirac Semimetal

scholarly journals Three-Dimensional Dirac Semimetal/Organic Thin Film Heterojunction Photodetector With Fast Response and High Detectivity

2021 ◽  
Vol 9 ◽  
Author(s):  
Qi Liu ◽  
Ming Yang ◽  
Jiangwei Zhang ◽  
Mingliang Yang ◽  
Jun Wang ◽  
...  
Keyword(s):  
Thin Film ◽  
High Performance ◽  
Three Dimensional ◽  
Fast Response ◽  
Current Response ◽  
Organic Thin Film ◽  
Small Current ◽  
Dirac Semimetal ◽  
High Level ◽  
P Type

As a typical three-dimensional Dirac semimetal (3D DSM), Cd3As2 possess ultrahigh carrier mobility, high level of full spectral absorption, fast electron transmission speed, and high photocurrent response, which enable wide applications in infrared photodetector. However, the large dark current of the detector based on Cd3As2 thin film limits the application of the small current response. Hence, we demonstrated heterojunction photodetectors based on n-type 3D DSM Cd3As2 (pristine and Zn doped) and p-type organic (PbPc) by depositing PbPc thin film on Cd3As2 (pristine and Zn doped) thin film using thermal deposition method. These photodetectors can detect the radiation wavelength from 405 to 1,550 nm at room temperature. It is remarkable that this thin film heterojunction photodetector exhibits high detectivity (3.95 × 1011 Jones) and fast response time (160 μs) under bias voltage, which is significantly improved vs. that of Cd3As2-based devices. The excellent performances are attributed to the strong built-in electric field at the interface of p-n junction, which is beneficial for efficient photocarriers collection and transportation. These results show that DSM/organic thin film heterojunction has excellent performance in the application of photodetectors. By combining 3D DSM with organic to form heterojunction, it provides a feasible solution for high-performance photodetectors.

Three-dimensional Dirac semimetal Cd3As2 as high-performance 2-5 μm saturable absorbers

2016 ◽  
Author(s):  
Chunhui Zhu ◽  
Yafei Meng ◽  
Xiang Yuan ◽  
Faxian Xiu ◽  
Yongbing Xu ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Saturable Absorbers ◽  
Dirac Semimetal

Improved 3-D reconstruction using stereo computer graphics and multiple tilt EM images

1995 ◽  
Vol 53 ◽  
pp. 630-631
Author(s):  
Lee D. Peachey ◽  
Lou Fodor ◽  
John C. Haselgrove ◽  
Stanley M. Dunn ◽  
Junqing Huang
Keyword(s):  
Computer Graphics ◽  
High Performance ◽  
Transverse Section ◽  
Three Dimensional ◽  
Stereo Pair ◽  
3D Reconstructions ◽  
Video Cameras ◽  
Biological Objects ◽  
Microscope Images ◽  
High Performance Computer

Stereo pairs of electron microscope images provide valuable visual impressions of the three-dimensional nature of specimens, including biological objects. Beyond this one seeks quantitatively accurate models and measurements of the three dimensional positions and sizes of structures in the specimen. In our laboratory, we have sought to combine high resolution video cameras with high performance computer graphics systems to improve both the ease of building 3D reconstructions and the accuracy of 3D measurements, by using multiple tilt images of the same specimen tilted over a wider range of angles than can be viewed stereoscopically. Ultimately we also wish to automate the reconstruction and measurement process, and have initiated work in that direction.Figure 1 is a stereo pair of 400 kV images from a 1 micrometer thick transverse section of frog skeletal muscle stained with the Golgi stain. This stain selectively increases the density of the transverse tubular network in these muscle cells, and it is this network that we reconstruct in this example.

Rationally Designed Three-Dimensional Porous Nico 2n@C Reticular Structure for High-Performance Li-Ion Batteries

2020 ◽  
Author(s):  
Peiyao Wang ◽  
Bangchuan Zhao ◽  
Jin Bai ◽  
Kunzhen Li ◽  
Hongyang Ma ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Li Ion Batteries ◽  
Reticular Structure ◽  
Li Ion

scholarly journals Polarization-sensitive photodetectors based on three-dimensional molybdenum disulfide (MoS2) field-effect transistors

Nanophotonics ◽  
2020 ◽  
Vol 9 (16) ◽  
pp. 4719-4728
Author(s):  
Tao Deng ◽  
Shasha Li ◽  
Yuning Li ◽  
Yang Zhang ◽  
Jingye Sun ◽  
...  
Keyword(s):  
Molybdenum Disulfide ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Three Dimensional ◽  
Polarized Light ◽  
Optical Field ◽  
Two Dimensional ◽  
Polarization Ratio ◽  
Two Dimensional Materials

AbstractThe molybdenum disulfide (MoS2)-based photodetectors are facing two challenges: the insensitivity to polarized light and the low photoresponsivity. Herein, three-dimensional (3D) field-effect transistors (FETs) based on monolayer MoS2 were fabricated by applying a self–rolled-up technique. The unique microtubular structure makes 3D MoS2 FETs become polarization sensitive. Moreover, the microtubular structure not only offers a natural resonant microcavity to enhance the optical field inside but also increases the light-MoS2 interaction area, resulting in a higher photoresponsivity. Photoresponsivities as high as 23.8 and 2.9 A/W at 395 and 660 nm, respectively, and a comparable polarization ratio of 1.64 were obtained. The fabrication technique of the 3D MoS2 FET could be transferred to other two-dimensional materials, which is very promising for high-performance polarization-sensitive optical and optoelectronic applications.

Interpenetrating Gels as Conducting/Adhering Matrices Enabling High-Performance Silicon Anodes

2021 ◽  
Author(s):  
Tingting Xia ◽  
Chengfei Xu ◽  
Pengfei Dai ◽  
Xiaoyun Li ◽  
Riming Lin ◽  
...  
Keyword(s):  
Energy Storage ◽  
High Performance ◽  
Electrode Materials ◽  
Three Dimensional ◽  
Electrochemical Energy Storage ◽  
Active Materials ◽  
Silicon Anodes ◽  
Weak Binding ◽  
Binding Forces

Three-dimensional (3D) conductive polymers are promising conductive matrices for electrode materials toward electrochemical energy storage. However, their fragile nature and weak binding forces with active materials could not guarantee long-term...

scholarly journals 3D Printing of High Viscosity Reinforced Silicone Elastomers

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2239
Author(s):  
Nicholas Rodriguez ◽  
Samantha Ruelas ◽  
Jean-Baptiste Forien ◽  
Nikola Dudukovic ◽  
Josh DeOtte ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Viscosity ◽  
Layer By Layer ◽  
Silicone Elastomers ◽  
Uv Curable ◽  
Octet Truss ◽  
Tunable Mechanical Properties

Recent advances in additive manufacturing, specifically direct ink writing (DIW) and ink-jetting, have enabled the production of elastomeric silicone parts with deterministic control over the structure, shape, and mechanical properties. These new technologies offer rapid prototyping advantages and find applications in various fields, including biomedical devices, prosthetics, metamaterials, and soft robotics. Stereolithography (SLA) is a complementary approach with the ability to print with finer features and potentially higher throughput. However, all high-performance silicone elastomers are composites of polysiloxane networks reinforced with particulate filler, and consequently, silicone resins tend to have high viscosities (gel- or paste-like), which complicates or completely inhibits the layer-by-layer recoating process central to most SLA technologies. Herein, the design and build of a digital light projection SLA printer suitable for handling high-viscosity resins is demonstrated. Further, a series of UV-curable silicone resins with thiol-ene crosslinking and reinforced by a combination of fumed silica and MQ resins are also described. The resulting silicone elastomers are shown to have tunable mechanical properties, with 100–350% elongation and ultimate tensile strength from 1 to 2.5 MPa. Three-dimensional printed features of 0.4 mm were achieved, and complexity is demonstrated by octet-truss lattices that display negative stiffness.

scholarly journals Data-Driven Intelligent 3D Surface Measurement in Smart Manufacturing: Review and Outlook

Machines ◽  
2021 ◽  
Vol 9 (1) ◽  
pp. 13
Author(s):  
Yuhang Yang ◽  
Zhiqiao Dong ◽  
Yuquan Meng ◽  
Chenhui Shao
Keyword(s):  
High Resolution ◽  
High Performance ◽  
Sampling Design ◽  
Three Dimensional ◽  
Measurement Data ◽  
Data Driven ◽  
Surface Measurement ◽  
Smart Manufacturing ◽  
Future Research ◽  
3D Surface

High-fidelity characterization and effective monitoring of spatial and spatiotemporal processes are crucial for high-performance quality control of many manufacturing processes and systems in the era of smart manufacturing. Although the recent development in measurement technologies has made it possible to acquire high-resolution three-dimensional (3D) surface measurement data, it is generally expensive and time-consuming to use such technologies in real-world production settings. Data-driven approaches that stem from statistics and machine learning can potentially enable intelligent, cost-effective surface measurement and thus allow manufacturers to use high-resolution surface data for better decision-making without introducing substantial production cost induced by data acquisition. Among these methods, spatial and spatiotemporal interpolation techniques can draw inferences about unmeasured locations on a surface using the measurement of other locations, thus decreasing the measurement cost and time. However, interpolation methods are very sensitive to the availability of measurement data, and their performances largely depend on the measurement scheme or the sampling design, i.e., how to allocate measurement efforts. As such, sampling design is considered to be another important field that enables intelligent surface measurement. This paper reviews and summarizes the state-of-the-art research in interpolation and sampling design for surface measurement in varied manufacturing applications. Research gaps and future research directions are also identified and can serve as a fundamental guideline to industrial practitioners and researchers for future studies in these areas.

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