Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics
Keyword(s):
A composite that synergistically combines the best thermal properties of carbon nanotubes and copper is developed for efficient cooling of microelectronics.
2012 ◽
Vol 512-515
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pp. 469-473
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Keyword(s):
2018 ◽
Vol 233
(8)
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pp. 2909-2919
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2016 ◽
Vol 82
(844)
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pp. 16-00228-16-00228
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2003 ◽
Vol 18
(4)
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pp. 855-860
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