A carbon nanotube–epoxy interface improved damping below the glass transition temperature

This paper reported the effect of high temperature on the electro-mechanical behavior of carbon nanotube (CNT) reinforced epoxy composites. CNT/epoxy composites were fabricated by dispersing CNTs in the epoxy matrix using a solution casting method. Electrical conductivity measurements obtained for the CNT/epoxy composites indicated a steadily increasing directly proportional relationship with CNT concentration with a percolation threshold at 0.25 wt %, reaching a maximum of up to 0.01 S/m at 2.00 wt % CNTs. The electro-mechanical behavior of CNT/epoxy composites were investigated at a room temperature under the static and cyclic compressive loadings, resulting that the change in resistance of CNT/epoxy composites was reduced as increasing CNT concentration with good repeatability. This is due to well-networked CNTs conducting pathways created within the solid epoxy matrix observed by scanning electron microscopy. Temperature significantly affects the electro-mechanical behavior of CNT/epoxy composites. In particular, the electro-mechanical behavior of CNT/epoxy composites below the glass transition temperature showed the similar trend with those at room temperature, whereas the electro-mechanical behavior of CNT/epoxy composites above the glass transition temperature showed an opposite change in resistance with poor repeatability due to unstable CNT network in epoxy matrix.

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Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

MRS Proceedings ◽

10.1557/proc-476-9 ◽

1997 ◽

Vol 476 ◽

Cited By ~ 46

Author(s):

P. H. Townsend ◽

S. J. Martin ◽

J. Godschalx ◽

D. R. Romer ◽

D. W. Smith ◽

...

Keyword(s):

Thin Film ◽

Dielectric Constant ◽

Glass Transition ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Integrated Circuits ◽

Room Temperature ◽

Polymer Network ◽

Flow Characteristics ◽

Interlayer Dielectric

AbstractA novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipment and produces highly uniform films after curing at 400 °C to 450 °C. The oligomeric solution, with a viscosity of ca. 30 cPs, is readily handled on standard thin film coating equipment. Polymerization does not require a catalyst. There is no water evolved during the polymerization. The resulting polymer network is an aromatic hydrocarbon with an isotropie structure and contains no fluorine.The properties of the cured films are designed to permit integration with current ILD processes. In particular, the rate of weight-loss during isothermal exposures at 450 °C is ca. 0.7 wt.%/hour. The dielectric constant of cured SiLK has been measured at 2.65. The refractive index in both the in-plane and out-of-plane directions is 1.63. The flow characteristics of SiLK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm. The glass transition temperature for the fully cured film is greater than 490 °C. The coefficient of thermal expansivity is 66 ppm/°C below the glass transition temperature. The stress in fully cured films on Si wafers is ca. 60 MPa at room temperature. The fracture toughness measured on thin films is 0.62 MPa m ½. Thin coatings absorb less than 0.25 wt.% water when exposed to 80% relative humidity at room temperature.

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Influence of Carbon Nanotube Aspect Ratio on Glass Transition Temperature of Polymers: A Molecular Dynamics Simulation Study

Materials Science Forum ◽

10.4028/www.scientific.net/msf.817.797 ◽

2015 ◽

Vol 817 ◽

pp. 797-802 ◽

Cited By ~ 2

Author(s):

Cai Jiang ◽

Jian Wei Zhang ◽

Shao Feng Lin ◽

Su Ju ◽

Da Zhi Jiang

Keyword(s):

Molecular Dynamics ◽

Glass Transition ◽

Carbon Nanotube ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Aspect Ratio ◽

Epoxy Resin ◽

Md Simulations ◽

Diglycidyl Ether ◽

Dynamics Simulation

Molecular dynamics (MD) simulations on three single walled carbon nanotube (SWCNT) reinforced epoxy resin composites were conducted to study the influence of SWCNT type on the glass transition temperature (Tg) of the composites. The composite matrix is cross-linked epoxy resin based on the epoxy monomers bisphenol A diglycidyl ether (DGEBA) cured by diaminodiphenylmethane (DDM). MD simulations of NPT (constant number of particles, constant pressure and constant temperature) dynamics were carried out to obtain density as a function of temperature for each composite system. The Tg was determined as the temperature corresponding to the discontinuity of plot slopes of the densityvsthe temperature. In order to understand the motion of polymer chain segments above and below the Tg, various energy components and the MSD at various temperatures of the composites were investigated and their roles played in the glass transition process were analyzed. The results show that the Tg of the composites increases with increasing aspect ratio of the embedded SWCNT

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The Effect of Thermal History on Porcelain Expansion Behavior

Journal of Dental Research ◽

10.1177/00220345890680090401 ◽

1989 ◽

Vol 68 (9) ◽

pp. 1313-1315 ◽

Cited By ~ 13

Author(s):

C.W. Fairhurst ◽

D.T. Hashinger ◽

S.W. Twiggs

Keyword(s):

Thermal Expansion ◽

Glass Transition ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Heating Rate ◽

Room Temperature ◽

Heating Rates ◽

Thermal Expansion Data ◽

Temperature Range ◽

Expansion Behavior

Porcelain-fused-to-metal restorations are fired several hundred degrees above the glass-transition temperature and cooled rapidly through the glass-transition temperature range. Thermal expansion data from room temperature to above the glass-transition temperature range are important for the thermal expansion of the porcelain to be matched to the alloy. The effect of heating rate during measurement of thermal expansion was determined for NBS SRM 710 glass and four commercial opaque and body porcelain products. Thermal expansion data were obtained at heating rates of from 3 to 30°C/min after the porcelain was cooled at the same rate. By use of the Moynihan equation (where Tg systematically increases in temperature with an increase in cooling/heating rate), the glass-transition temperatures (Tg) derived from these data were shown to be related to the heating rate.

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Free, partial, and fully constrained recovery analysis of cold-programmed shape memory epoxy/carbon nanotube nanocomposites: Experiments and predictions

Journal of Intelligent Material Systems and Structures ◽

10.1177/1045389x18758187 ◽

2018 ◽

Vol 29 (10) ◽

pp. 2164-2176 ◽

Cited By ~ 6

Author(s):

R Abishera ◽

R Velmurugan ◽

KV Nagendra Gopal

Keyword(s):

Glass Transition ◽

Carbon Nanotube ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Shape Memory ◽

Thermally Activated ◽

Large Structures ◽

Multi Walled Carbon Nanotube ◽

Optical Strain Measurement ◽

Optical Strain

Thermally activated shape memory polymers are typically programmed by initially heating the material above the glass transition temperature ( Tg), deforming to the desired shape, cooling below Tg, and unloading to fix the temporary shape. This process of deforming at high temperatures becomes a time-, labor-, and energy-expensive process while applying to large structures. Alternatively, materials with reversible plasticity shape memory property can be programmed at temperatures well below the glass transition temperature which offers several advantages over conventional programming. Here, the free, partial, and fully constrained recovery analysis of cold-programmed multi-walled carbon nanotube–reinforced epoxy nanocomposites is presented. The free recovery analysis involves heating the temporary shape above Tg without any constraints (zero stress), and for fully constrained recovery analysis, the temporary shape is held constant while heating. The partially constrained recovery behavior is studied by applying a constant stress of 10%, 25%, and 50% of the maximum recovery stress obtained from the completely constrained recovery analysis. The samples are also characterized for their thermal, morphological, and mechanical properties. A non-contact optical strain measurement method is used to measure the strains during cold-programming and shape recovery. The different recovery behaviors are analyzed by using a thermo-viscoelastic–viscoplastic model, and the predictions are compared with the experimental results.

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A Molecular-Dynamics Study of Size and Chirality Effects on Glass-Transition Temperature and Ordering in Carbon Nanotube-Polymer Composites

Macromolecular Theory and Simulations ◽

10.1002/mats.201600041 ◽

2016 ◽

Vol 25 (6) ◽

pp. 571-581 ◽

Cited By ~ 7

Author(s):

Marcello Malagù ◽

Alexey Lyulin ◽

Elena Benvenuti ◽

Angelo Simone

Keyword(s):

Molecular Dynamics ◽

Glass Transition ◽

Carbon Nanotube ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Polymer Composites

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Physical properties, thermal stability, and glass transition temperature of multi-walled carbon nanotube/polypyrrole nanocomposites

Composite Interfaces ◽

10.1080/15685543.2014.943020 ◽

2014 ◽

Vol 21 (8) ◽

pp. 737-747 ◽

Cited By ~ 10

Author(s):

Mansoor Farbod ◽

Nooshin Mobini

Keyword(s):

Thermal Stability ◽

Glass Transition ◽

Carbon Nanotube ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Physical Properties ◽

Multi Walled Carbon Nanotube

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The Effect of Glass-cracking during Cooling in Liquid Nitrogen on Viability of Mint Shoot Tips

HortScience ◽

10.21273/hortsci.30.4.874d ◽

1995 ◽

Vol 30 (4) ◽

pp. 874D-874

Author(s):

L.E. Towill

Keyword(s):

Glass Transition ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Liquid Nitrogen ◽

Plant Species ◽

Room Temperature ◽

Shoot Formation ◽

Shoot Tips ◽

Vitrification Solution

Cryopreservation using vitrification has been reported for several plant species. Shoot tips and vitrification solution were placed in semen straws and immersed in liquid nitrogen (LN). Cracking of the external glass occurred, but may be avoided by annealing slightly below the glass transition temperature before immersion. A varying percentage still cracked with some vitrification solutions. Rapid warming also can cause cracking. There is concern that cracking may reduce viability. Shoot tips from Mentha species were used to examine this problem. Glass cracking during either cooling or warming did not produce visible damage to shoot tips. Viability of shoot tips from tubes that cracked during cooling was not different from those that did not crack; however, shoot formation was slightly reduced. Cracking upon warming did not reduce viability nor shoot formation. Very slow warming reduced viability, but warming in either water or air (room temperature) gave higher levels of survival.

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Brewer’s spent yeast as wall material for microencapsulation of food compounds

Revista dos Trabalhos de Iniciação Científica da UNICAMP ◽

10.20396/revpibic2620181175 ◽

2019 ◽

Author(s):

Rafaela Polessi Saturno ◽

Miriam Dupas Hubinger ◽

Gabriela Vollet Marson

Keyword(s):

Ascorbic Acid ◽

Glass Transition ◽

Transition Temperature ◽

Glass Transition Temperature ◽

Room Temperature ◽

Core Material ◽

Wall Material ◽

Operational Conditions ◽

Particle Stability ◽

Brewer’S Spent Yeast

The brewer's spent yeast hydrolyzed precipitate was used as wall material for microencapsulation of ascorbic acid by the spray drying technique. The wall material had its centesimal composition determined as well as some physicochemical aspects: surface charge, surface tension and glass transition temperature, in order to study the behavior of the material after being atomized and to identify the most suitable core material. Operational conditions were also studied in the spray dryer. After microencapsulation, a 64% yield and a microencapsulation efficiency of 100% were achieved. Microparticle analyses showed low values of water activity and high glass transition temperature, indicating absence of microbiological activity and great particle stability at room temperature, respectively, suggesting that this wall material is suitable for protecting the ascorbic acid.

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