Thermoelectric properties and thermal stability of layered chalcogenides, TlScQ2, Q = Se, Te

2017 ◽  
Vol 46 (48) ◽  
pp. 17053-17060 ◽  
Author(s):  
Vijayakumar Sajitha Aswathy ◽  
Cheriyedath Raj Sankar ◽  
Manoj Raama Varma ◽  
Abdeljalil Assoud ◽  
Mario Bieringer ◽  
...  

The layered chalcogenides, TlScQ2 (Q = Se, Te), possess intriguing band structure characteristics and very low thermal conductivity.


2017 ◽  
Vol 5 (20) ◽  
pp. 9768-9774 ◽  
Author(s):  
G. Cerretti ◽  
M. Schrade ◽  
X. Song ◽  
B. Balke ◽  
H. Lu ◽  
...  

Engineering of nanoscaled structures allows to control the electrical and thermal transport in solids for thermoelectric applications where a combination of low thermal conductivity and low electrical resistivity is required.



2000 ◽  
Vol 626 ◽  
Author(s):  
Antje Mrotzek ◽  
Kyoung-Shin Choi ◽  
Duck-Young Chung ◽  
Melissa A. Lane ◽  
John R. Ireland ◽  
...  

ABSTRACTWe present the structure and thermoelectric properties of the new quaternary selenides K1+xM4–2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22. The compounds K1+xM4-2xBi7+xSe15 (M= Sn, Pb) crystallize isostructural to A1+xPb4-2xSb7+xSe15 with A = K, Rb, while K1-xSn5-xBi11+xSe22 reveals a new structure type. In both structure types fragments of the Bi2Te3-type and the NaCl-type are connected to a three-dimensional anionic framework with K+ ions filled tunnels. The two structures vary by the size of the NaCl-type rods and are closely related to β-K2Bi8Se13 and K2.5Bi8.5Se14. The thermoelectric properties of K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22 were explored on single crystal and ingot samples. These compounds are narrow gap semiconductors and show n-type behavior with moderate Seebeck coefficients. They have very low thermal conductivity due to an extensive disorder of the metal atoms and possible “rattling” K+ ions.



Polymer ◽  
2020 ◽  
Vol 206 ◽  
pp. 122912
Author(s):  
Naoya Yanagishima ◽  
Shinji Kanehashi ◽  
Hiromu Saito ◽  
Kenji Ogino ◽  
Takeshi Shimomura


Author(s):  
Chang'an Li ◽  
Xin Guan ◽  
Shizhong Yue ◽  
Xi Zu Wang ◽  
Jianmin Li ◽  
...  

Thermoelectric polymers have attracted great attention because of their unique merits including low thermal conductivity, low cost, non- or low toxicity and high mechanical flexibility. However, their thermoelectric properties particularly...



Author(s):  
Rizwan Akram ◽  
Jan Sher Khan ◽  
Zahid Qamar ◽  
Saima Rafique ◽  
Mozaffar Hussain ◽  
...  


Author(s):  
Ni Luo ◽  
Jing Xu ◽  
Xiyue Cheng ◽  
ZhenHua Li ◽  
Yidong Huang ◽  
...  

The good thermal stability of a phosphor is crucial for its practical applications. Unfortunately, in the past decades, only Gurney-Mott equation was available to describe the relation between the luminescence...



2021 ◽  
Vol 317 ◽  
pp. 28-34
Author(s):  
Joon Hoong Lim

Thermoelectric materials has made a great potential in sustainable energy industries, which enable the energy conversion from heat to electricity. The band structure and thermoelectric properties of Ni(x)Zn(1-x)Fe2O4 have been investigated. The bulk pellets were prepared from analytical grade ZnO, NiO and Fe2O3 powder using solid-state method. It was possible to obtain high thermoelectric properties of Ni(x)Zn(1-x)Fe2O4 by controlling the ratios of dopants and the sintering temperature. XRD analysis showed that the fabricated samples have a single phase formation of cubic spinel structure. The thermoelectric properties of Ni(x)Zn(1-x)Fe2O4 pellets improved with increasing Ni. The electrical conductivity of Ni(x)Zn(1-x)Fe2O4 pellets decreased with increasing Ni content. The electrical conductivity of Ni(x)Zn(1-x)Fe2O4 (x = 0.0) is (0.515 x10-3 Scm-1). The band structure shows that ZnxCu1-xFe2O4 is an indirect band gap material with the valence band maximum (VBM) at M and conduction band minimum (CBM) at A. The band gap of Ni(x)Zn(1-x)Fe2O4 increased with increasing Ni content. The increasing band gap correlated with the lower electrical conductivity. The thermal conductivity of Ni(x)Zn(1-x)Fe2O4 pellets decreased with increasing Ni content. The presence of Ni served to decrease thermal conductivity by 8 Wm-1K-1 over pure samples. The magnitude of the Seebeck coefficient for Ni(x)Zn(1-x)Fe2O4 pellets increased with increasing amounts of Ni. The figure of merit for Ni(x)Zn(1-x)Fe2O4 pellets and thin films was improved by increasing Ni due to its high Seebeck coefficient and low thermal conductivity.



2017 ◽  
Vol 5 (36) ◽  
pp. 19406-19415 ◽  
Author(s):  
Robin Lefèvre ◽  
David Berthebaud ◽  
Oleg Lebedev ◽  
Olivier Pérez ◽  
Célia Castro ◽  
...  

A new ternary layered compound In2Ge2Te6, belonging to the hexatellurogermanate family has been synthesized from the reaction of appropriate amounts of the pure elements at high temperature in sealed silica tubes.



Molecules ◽  
2018 ◽  
Vol 23 (12) ◽  
pp. 3192 ◽  
Author(s):  
Dong Chen ◽  
Xiaodong Wang ◽  
Wenhui Ding ◽  
Wenbing Zou ◽  
Qiong Zhu ◽  
...  

Owing to their ultra-low thermal conductivity, silica aerogels are promising thermal insulators; however, their extensive application is limited by their high production cost. Thus, scientists have started to explore low-cost and easy preparation processes of silica aerogels. In this work, a low-cost method was proposed to prepare silica aerogels with industrial silica hydrosol and a subsequent ambient pressure drying (APD) process. Various surfactants (cationic, amphoteric, or anionic) were added to avoid solvent exchange and surface modification during the APD process. The effects of various surfactants on the microstructure, thermal conductivity, and thermal stability of the silica aerogels were studied. The results showed that the silica aerogels prepared with a cationic or anionic surfactant have better thermal stability than that prepared with an amphoteric surfactant. After being heated at 600 °C, the silica aerogel prepared with a cationic surfactant showed the highest specific surface area of 131 m2∙g−1 and the lowest thermal conductivity of 0.038 W∙m−1∙K−1. The obtained low-cost silica aerogel with low thermal conductivity could be widely applied as a thermal insulator for building and industrial energy-saving applications.



2021 ◽  
Vol 5 (1) ◽  
pp. 324-332
Author(s):  
J. M. Li ◽  
H. W. Ming ◽  
B. L. Zhang ◽  
C. J. Song ◽  
L. Wang ◽  
...  

Cu3SbSe4-Based materials were fabricated through Sn-doping and AgSb0.98Ge0.02Se2 incorporation and their thermoelectric properties were investigated in the temperature range from 300 K to 675 K.



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