scholarly journals The effect of polarity on the molecular exchange dynamics in imine-based covalent adaptable networks

2021 ◽  
Author(s):  
Sybren K. Schoustra ◽  
Timo Groeneveld ◽  
Maarten M. J. Smulders

Polarity-induced effects in dynamic covalent polyimine CANs were studied, revealing a three-step stress relaxation process.

2018 ◽  
Vol 33 ◽  
pp. 02075 ◽  
Author(s):  
Tatyana Matseevich

The theme of the research is important because it allows to use hybrid materials as finishing in the high-rise constructions. The aim of the study was the development of producing coloured hybrid materials based on liquid glass, a polyisocyanate, epoxy resin and 2.4-toluylenediisocyanate. The detailed study of the process of stress relaxation at different temperatures in the range of 20-100°C was provided. The study found that the obtained materials are subject to the simplified technology. The materials easy to turn different colors, and dyes (e.g. Sudan blue G) are the catalysts for the curing process of the polymeric precursors. The materials have improved mechanical relaxation properties, possess different color and presentable, can be easily combined with inorganic base (concrete, metal). The limit of compressive strength varies from 32 to 17.5 MPa at a temperature of 20 to 100°C. The values σ∞ are from 20.4 to 7.7 MPa within the temperature range from 20 to 100°C. The physical parameters of materials were evaluated basing on the data of stress relaxation: the initial stress σ0, which occurs at the end of the deformation to a predetermined value; quasi-equilibrium stress σ∞, which persists for a long time relaxation process. Obtained master curves provide prediction relaxation behavior for large durations of relaxation. The study obtained new results. So, the addition of epoxy resin in the composition of the precursor improves the properties of hybrid materials. By the method of IR spectroscopy identified chemical transformations in the course of obtaining the hybrid material. Evaluated mechanical performance of these materials is long-time. Applied modern physically-based memory functions, which perfectly describe the stress relaxation process.


1972 ◽  
Vol 45 (1) ◽  
pp. 82-93 ◽  
Author(s):  
G. M. Bartenev ◽  
N. M. Lyalina

Abstract 1. In vulcanized rubbers containing blacks a multi-stage mechanism for stress relaxation was observed. It was discovered that the stress relaxation process consists of five fundamental processes: the first three relaxation processes, related to the slow stages of physical relaxation within the bulk of the rubber, have no connection with the fillers (“soft” domains); the fourth process has to do with the relaxation in the black-rubber domain; the fifth process involves the chemical relaxation of vulcanizates. 2. The fundamental mechanisms of the first 3 relaxation processes in the soft domains have the same activation energy values and the same segmental mechanism as the rearranged domains found in supermolecular weight structures, which are also present in unfilled vulcanizates. 3. In the investigated stress range of up to 200% elongation, the activation energy for the first 3 relaxation processes in the soft domains of filled vulcanizates is not a function of the deformation strain, whereas the activation energy of the fourth relaxation process in the black-rubber domains of filled rubbers is a function of the deformation and of the filler content. For these reasons, rubber loaded with carbon blacks, in contrast to unfilled rubbers, possess the typical nonlinearity of viscoelastic materials. 4. The activation energies of the relaxation processes in the black-rubber domains decrease in a linear fashion with the value for the initial tensile stress in filled vulcanizates, and decrease in like manner for vulcanizates containing different proportions of fillers. The kinetic units, determined from the activation energies of these processes, appeared to be segments of chains with activation energies of up to 40% more than the activation energies of the physical relaxation processes in the soft domains. The other kinetic units of the processes proved to be black particles, the dimensions of which were calculated from the values for the coefficients in the formula for relaxation time.


2001 ◽  
Vol 16 (4) ◽  
pp. 938-944 ◽  
Author(s):  
V. L. Tellkamp ◽  
S. Dallek ◽  
D. Cheng ◽  
E. J. Lavernia

A nanostructured 5083 Al–Mg alloy powder was subjected to various thermal heat treatments in an attempt to understand the fundamental mechanisms of recovery, recrystallization and grain growth as they apply to nanostructured materials. A low-temperature stress relaxation process associated with reordering of the grain boundaries was found to occur at 158 °C. A bimodal restructuring of the grains occurred at 307 °C for the unconstrained grains and 381 °C for the constrained grains. An approximate activation energy of 5.6 kJ/mol was found for the metastable nanostructured grains, while an approximate activation energy of 142 kJ/mol was found above the restructuring temperature.


2000 ◽  
Vol 2000.49 (0) ◽  
pp. 243-244
Author(s):  
Kiyomoto Ito ◽  
Sigeo Kotake ◽  
Yasuyuki Suzuki ◽  
Masafumi Senoo

1986 ◽  
Vol 18 (12) ◽  
pp. 947-954 ◽  
Author(s):  
Kunihiro Osaki ◽  
Eiichi Takatori ◽  
Michio Kurata ◽  
Hiroshi Ohnuma ◽  
Tadao Kotaka

2016 ◽  
Vol 684 ◽  
pp. 335-345
Author(s):  
Valentin Dmitrievich Yushin ◽  
Valery Ivanovich Tregub ◽  
Sergey V. Voronin

The aim of the presented work is to establish relationship of behavior of stress relaxation process in 5056 alloy in vacuum conditions for stress levels of 116 MPa, 83 MPa and 50 MPa and temperatures of 293 K and 353 K. Method of circular specimens with equal flexural strength was used as the main method for stress relaxation testing. Results of the studies allowed to develop the advanced methodology for evaluation of stress relaxation, which increases measurement accuracy up to 0.04 MPa. Increase of accuracy was achieved using the proposed new shape of a specimen of equal flexural strength, its manufacturing technology and developed design of accessories for precision marking. It was established that for studied temperatures stress relaxation in vacuum is occurring more intensively independently from level of initial stress. That fact can be explained by increase of influence of dislocation mechanism on stress relaxation. The results of the presented studies serve as a basis for increase of reliability and consistency of dimensions of elements of aircraft's structure and their parts and components, which are operating in vacuum conditions.


2018 ◽  
Vol 924 ◽  
pp. 176-179
Author(s):  
Jian Qiu Guo ◽  
Yu Yang ◽  
Balaji Raghothamachar ◽  
Michael Dudley ◽  
Swetlana Weit ◽  
...  

During 4H silicon carbide (4H-SiC) homoepitaxy and post-growth processes, the development of stress relaxation has been observed, in which interfacial dislocations (IDs) are formed at the epilayer/substrate interface, relaxing the misfit strain induced by the nitrogen doping concentration difference between the epilayer and substrate. It is widely believed that an interfacial dislocation is created by the glide of a mobile segment of a basal plane dislocation (BPD) in the substrate or epilayer towards the interface, leaving a trailing edge component right at the interface. However, direct observation of such mechanisms has not been made in SiC before. In this work, we present an in situ study of the stress relaxation process, in which a specimen cut from a commercial 4H-SiC homoepitaxial wafer undergoes the stress relaxation process during a high-temperature heat treatment while sequential synchrotron white beam X-ray topographs were recorded simultaneously. Based on the dynamic observation of this process, it can be concluded that thermal stress plays a role in the relaxation process while the increased misfit strain at elevated temperature most likely drives the formation of an interfacial dislocation.


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