scholarly journals Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

2016 ◽  
Vol 59 ◽  
pp. 01011
Author(s):  
Jacqueline Ann L. Lee ◽  
Ivan B. Culaba
Keyword(s):  
Thin Films ◽  
Relative Humidity ◽  
Humidity Sensor ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Relative Humidity Sensor

Development of embedded capacitor with bismuth-based pyrochlore thin films at low temperatures for printed circuit board applications

2007 ◽  
Vol 47 (4-5) ◽  
pp. 755-758 ◽  
Author(s):  
Jong-Hyun Park ◽  
Cheng-Ji Xian ◽  
Nak-Jin Seong ◽  
Soon-Gil Yoon ◽  
Seung-Hyun Son ◽  
...  
Keyword(s):  
Thin Films ◽  
Low Temperatures ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Embedded Capacitor

Relative Humidity Sensor Based on Rough Polysilicon Thin Films

2019 ◽  
Vol 4 (1) ◽  
pp. 107-114
Author(s):  
P. Zambrozi ◽  
R. C. Teixeira ◽  
F. Fruett
Keyword(s):  
Thin Films ◽  
Relative Humidity ◽  
Humidity Sensor ◽  
Relative Humidity Sensor

Utilization of Natural Porphyrin Thin Films as a Photosensitizer for Photodetectors

2014 ◽  
Vol 896 ◽  
pp. 187-191 ◽  
Author(s):  
Utari ◽  
Atmanto Heru Wibowo ◽  
Budi Purnama ◽  
Kamsul Abraha
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Spin Coating ◽  
Printed Circuit Board ◽  
Energy Gap ◽  
Circuit Board ◽  
Printed Circuit ◽  
Number Of Layers ◽  
Maximum Current ◽  
Sensitive Characteristics

In this study, photodetectors were assembled using natural porphyrin as a sensitizer, and their energy gap properties were investigated. The natural porphyrin thin film layered devices used in the experiments were deposited by spin coating on a patterned electrode of Cu printed circuit board substrates. The photo sensitive characteristics were measured both with and without illumination by white light. The photo sensitive effect increased with the number of layers. A maximum current of 2.6 nA was obtained when the films consisted of three layers and the current increased to 7.9 nA for seven layers. To clarify the results, the dependence of the number of layers on the energy gap was evaluated. The experiment results showed that the energy gap decreased linearly with increasing number of layers. The mutual combination of the photo sensitive effect and energy gap indicated that it is possible to apply natural porphyrin as a sensitizer for photodetector applications.

Joining of molybdenum thin films with copper printed circuit board by laser micro-riveting

2013 ◽  
Vol 49 ◽  
pp. 320-324 ◽  
Author(s):  
Klaus Zimmer ◽  
Martin Ehrhardt ◽  
Pierre Lorenz ◽  
Tino Stephan ◽  
Robby Ebert ◽  
...  
Keyword(s):  
Thin Films ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Ultra-sensitive electrical immunoassay biosensors using nanotextured zinc oxide thin films on printed circuit board platforms

2014 ◽  
Vol 55 ◽  
pp. 7-13 ◽  
Author(s):  
Michael Jacobs ◽  
Sriram Muthukumar ◽  
Anjan Panneer Selvam ◽  
Jon Engel Craven ◽  
Shalini Prasad
Keyword(s):  
Thin Films ◽  
Zinc Oxide ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Oxide Thin Films ◽  
Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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