Development of embedded capacitor with bismuth-based pyrochlore thin films at low temperatures for printed circuit board applications

2007 ◽  
Vol 47 (4-5) ◽  
pp. 755-758 ◽  
Author(s):  
Jong-Hyun Park ◽  
Cheng-Ji Xian ◽  
Nak-Jin Seong ◽  
Soon-Gil Yoon ◽  
Seung-Hyun Son ◽  
...  
Keyword(s):  
Thin Films ◽  
Low Temperatures ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Embedded Capacitor

Utilization of Natural Porphyrin Thin Films as a Photosensitizer for Photodetectors

2014 ◽  
Vol 896 ◽  
pp. 187-191 ◽  
Author(s):  
Utari ◽  
Atmanto Heru Wibowo ◽  
Budi Purnama ◽  
Kamsul Abraha
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Spin Coating ◽  
Printed Circuit Board ◽  
Energy Gap ◽  
Circuit Board ◽  
Printed Circuit ◽  
Number Of Layers ◽  
Maximum Current ◽  
Sensitive Characteristics

In this study, photodetectors were assembled using natural porphyrin as a sensitizer, and their energy gap properties were investigated. The natural porphyrin thin film layered devices used in the experiments were deposited by spin coating on a patterned electrode of Cu printed circuit board substrates. The photo sensitive characteristics were measured both with and without illumination by white light. The photo sensitive effect increased with the number of layers. A maximum current of 2.6 nA was obtained when the films consisted of three layers and the current increased to 7.9 nA for seven layers. To clarify the results, the dependence of the number of layers on the energy gap was evaluated. The experiment results showed that the energy gap decreased linearly with increasing number of layers. The mutual combination of the photo sensitive effect and energy gap indicated that it is possible to apply natural porphyrin as a sensitizer for photodetector applications.

Joining of molybdenum thin films with copper printed circuit board by laser micro-riveting

2013 ◽  
Vol 49 ◽  
pp. 320-324 ◽  
Author(s):  
Klaus Zimmer ◽  
Martin Ehrhardt ◽  
Pierre Lorenz ◽  
Tino Stephan ◽  
Robby Ebert ◽  
...  
Keyword(s):  
Thin Films ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Dielectric Properties of PCB Embedded Bismuth-Zinc-Niobium Films Prepared using RF Magnetron Sputtering

2006 ◽  
Vol 969 ◽  
Author(s):  
Seungeun Lee ◽  
Jung Won Lee ◽  
Inhyung Lee ◽  
Yul Kyo Chung
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Leakage Current ◽  
Printed Circuit Board ◽  
Pyrochlore Structure ◽  
Circuit Board ◽  
Oxygen Plasma Treatment ◽  
Capacitance Density ◽  
Embedded Capacitor

AbstractDielectric properties of bismuth-zinc-niobium oxide (Bi1.5Zn1.0Nb1.5O7, BZN) thin films have been investigated for embedded capacitor. Crystalline BZN has a pyrochlore structure in nature and shows a dielectric constant of ∼ 200 and very low leakage current when crystallized. Since the process temperature is limited to < 200 due to an organic based substrate in printed circuit board, as-deposited BZN film is composed of an amorphous phase, confirmed by XRD analysis. However, it shows remarkably high dielectric constant of 113. It makes BZN to be a proper candidate as a decoupling embedded capacitor in power delivery circuits. Effects of post treatment such as oxygen plasma treatment and low temperature thermal annealing on dielectric properties of BZN thin films are studied. By optimizing deposition conditions, amorphous BZN thin film is well processed in the current PCB process and provides a capacitance density as high as 218 nF/cm2 and leakage current less than 1 μA/cm2 at 3V.

Ultra-sensitive electrical immunoassay biosensors using nanotextured zinc oxide thin films on printed circuit board platforms

2014 ◽  
Vol 55 ◽  
pp. 7-13 ◽  
Author(s):  
Michael Jacobs ◽  
Sriram Muthukumar ◽  
Anjan Panneer Selvam ◽  
Jon Engel Craven ◽  
Shalini Prasad
Keyword(s):  
Thin Films ◽  
Zinc Oxide ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Oxide Thin Films ◽  
Printed Circuit

406. An Ergonomic Hazards Survey of Printed Circuit Board Factories

1999 ◽  
Author(s):  
C. Lu ◽  
S. Wang ◽  
C. Wei ◽  
S. In
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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