scholarly journals Thermal conductivity of titanium slags

2019 ◽  
Vol 116 (6) ◽  
pp. 635 ◽  
Author(s):  
Juhani Heimo ◽  
Ari Jokilaakso ◽  
Marko Kekkonen ◽  
Merete Tangstad ◽  
Anne Støre

In ilmenite smelting furnaces, a freeze lining of solidified slag is used to protect the furnace refractories against the aggressive titanium slag. Freeze lining thickness cannot be measured directly due to harshness of conditions inside the process, thus process modelling is required. Several parameters influence the thickness of the freeze-lining, one of them being thermal conductivity of the frozen slag. However, there is a lack of thermal conductivity values for high titanium slags −especially as a function of temperature. In this study, thermal conductivity of three titanium slag samples and an additional sample of freeze-lining was measured from room temperature to 1100/1400 °C with the laser flash analysis method. In addition, thermal expansion and microstructures of the samples were studied to provide an extensive understanding of how microstructure will affect thermal conductivity. The thermal conductivity of the slag samples was found to increase from 1.2 to a maximum of 2.4 W/(m K) when increasing temperature from room temperature to 1100 °C. An additional experiment at 1400 °C showed that the thermal conductivity increased further as the temperature increased. The freeze-lining sample behaves differently, with conductivity being the highest at room temperature, 2.2 W/(m K).

1989 ◽  
Vol 167 ◽  
Author(s):  
R. C. Enck ◽  
R. D. Harris

AbstractThe thermal conductivity of ceramic materials used for IC substrates and packages has increased in importance as chip sizes have decreased and heat loads have risen. AIN which has a room temperature (RT) thermal conductivity (λ) greater than 200 W/m·K and BeO with λ(RT) ∼260 W/m·K are the major candidates for applications demanding high conductivity. Conflicting reports of the temperature dependences of λ for these materials over the range of interest for packaging use (≤200°C) have been published, with some reports suggesting a crossover in λ. These reported differences may be due to the reported problems in measuring λ in AIN using the flash diffusivity method. For the present experiments, we have used a new long wavelength laser flash diffusivity system which has been shown to determine thermal diffusivity to better than ± 3% for AIN with sample thicknesses ranging from 0.3 mm to 5 mm. No absorbinq coatings are required and no correction factors are needed to fit the data to theory. We report λ from room temperature to 400°C for AIN from a number of commercial sources, and for BeO and SiC. At room temperature, BeO has the highest thermal conductivity, but as the temperature is raised, the values for BeO and AIN approach one another, with crossover observed at about 350°C for the highest conductivity AIN sample studied. Recent steady state heat flow measurements agree with our thermal conductivity values rather than with previous literature values.


2014 ◽  
Vol 35 (3) ◽  
pp. 3-16 ◽  
Author(s):  
Monika Kosowska-Golachowska ◽  
Władysław Gajewski ◽  
Tomasz Musiał

Abstract In this study, a new laser flash system was proposed for the determination of the thermal conductivity of brown coal, hard coal and anthracite. The main objective of the investigation was to determine the effect of coal rank, composition, physical structure and temperature on thermal conductivity. The solid fuels tested were medium conductors of heat whose determined thermal conductivities were in the range of 0.09 to 0.23W/(mK) at room temperature. The thermal conductivity of the solid fuels tested typically increased with the rank of coal and the measurement temperature. The results of this study show that the physical structure of solid fuels and temperature have a dominant effect on the fuels’ thermal conductivity.


2006 ◽  
Vol 321-323 ◽  
pp. 1695-1698 ◽  
Author(s):  
Migaku Kobayashi ◽  
Hirohisa Sato ◽  
Yoshihiko Hiyoshi ◽  
Naoki Kamegashira ◽  
Doh Jae Lee ◽  
...  

Thermal diffusivity of nonstoichiometric PrMnO3 and NdMnO3 phases were measured by laser flash method from room temperature to 1100 K, in addition to the data of electrical conductivity, thermal analysis and high temperature X-ray diffractometry to detect the phase transition. The thermal diffusivity curve varied with increasing temperature and showed a clear anomaly with a sudden dip at the phase transition temperature. The transition temperature decreases with oxygen nonstoichiometry in each phase.


Polymers ◽  
2018 ◽  
Vol 10 (10) ◽  
pp. 1131 ◽  
Author(s):  
Matthias Morak ◽  
Philipp Marx ◽  
Mario Gschwandl ◽  
Peter Filipp Fuchs ◽  
Martin Pfost ◽  
...  

Abstract: For the design of the next generation of microelectronic packages, thermal management is one of the key aspects and must be met by the development of polymers with enhanced thermal conductivity. While all polymer classes show a very low thermal conductivity, this shortcoming can be compensated for by the addition of fillers, yielding polymer-based composite materials with high thermal conductivity. The inorganic fillers, however, are often available only in submicron- and micron-scaled dimensions and, consequently, can sediment during the curing reaction of the polymer matrix. In this study, an epoxy/amine resin was filled with nano- and submicron-scaled alumina particles, yielding a gradient composite. It was found that the thermal conductivity according to laser flash analysis of a sliced specimen ranged from 0.25 to 0.45 W·m−1·K−1 at room temperature. If the thermal conductivity of an uncut specimen was measured with a guarded heat flow meter, the ‘averaged’ thermal conductivity was measured to be only 0.25 W·m−1·K−1. Finite element analysis revealed that the heat dissipation through a gradient composite was of intermediate speed in comparison with homogeneous composites exhibiting a non-gradient thermal conductivity of 0.25 and 0.45 W·m−1·K−1.


2015 ◽  
Vol 22 (4) ◽  
pp. 521-530 ◽  
Author(s):  
Jerzy Szałapak ◽  
Konrad Kiełbasiński ◽  
Jakub Krzemiński ◽  
Anna Młożniak ◽  
Elżbieta Zwierkowska ◽  
...  

AbstractThe Low Temperature Joining Technique(LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint.The Laser Flash Analysis(LFA) is a non-intrusive method of measuring the temperature rise of one surface of a specimen after excitation with a laser pulse of its other surface. The main limitation of the LFA method is its standard computer software, which assumes the dimensions of a bonded component to be similar to those of the substrate, because it uses the standard Parker’s formula dedicated for one-dimensional heat flow. In the paper a special design of measured specimen was proposed, consisting of two copper plates of different size joined with the sintered silver layer. It was shown that heat properties of these specimens can also be measured after modifying the LFA method. The authors adapted these specimens by masking the false heat signal sourced from the uncovered plate area. Another adaptation was introducing a correcting factor of the heat travel distance, which was calculated with heat-flow simulations and placed into the Parker’s formula. The heat-flow simulated data were compared with the real LFA measurement results, which enabled estimation of the joint properties,e.g.its porosity.


2011 ◽  
Vol 1344 ◽  
Author(s):  
V. Goyal ◽  
D Teweldebrhan ◽  
A.A. Balandin

ABSTRACTIt was recently suggested theoretically that atomically thin films of Bi2Te3 topological insulators have strongly enhanced thermoelectric figure of merit. We used the “graphene-like” exfoliation process to obtain Bi2Te3 thin films. The films were stacked and subjected to thermal treatment to fabricate pseudo-superlattices of single crystal Bi2Te3 films. Thermal conductivity of these structures was measured by the “hot disk” and “laser flash” techniques. The room temperature in-plane and cross-plane thermal conductivity of the stacks decreased by a factor of ∼2.4 and 3.5 respectively as compared to that of bulk. The strong decrease of thermal conductivity with preserved electrical properties translates to ∼140-250% increase in the thermoelectric figure if merit. It is expected that the film thinning to few-quintuples, and tuning of the Fermi level can lead to the topological insulator surface transport regime with the theoretically predicted extraordinary thermoelectric efficiency.


Author(s):  
Huaqing Xie ◽  
An Cai ◽  
Xinwei Wang

A laser flash technique was applied to measure the thermal diffusivity along a multi-walled carbon nanotube (CNT) array in temperature range of −55∼200 °C. In the measurements, a nanosecond pulsed laser was used to realize noncontact heating and the temperature variations were recorded by an infrared detector. The experimental results show that the thermal diffusivity of the CNT array increases slightly with temperature in the −55∼70 °C temperature range and exhibits no obvious change in the −75∼200 °C temperature range. The CNT array has much larger thermal diffusivity than several known excellent thermal conductors, reaching about 4.6 cm2s−1 at room temperature. The mean thermal conductivity (λ) of individual CNTs was further estimated from the thermal diffusivity, specific heat (Cp), and density (ρ) by using the correlation of λ = αρCp. The thermal conductivity of individual CNTs increases smoothly with the temperature increase, reaching about 750 Wm−1K−1 at room temperature.


2003 ◽  
Vol 793 ◽  
Author(s):  
A. Yamamoto ◽  
S. Yamaguchi

ABSTRACTAn attempt was made to obtain bulk III-nitride semiconductors such as InN, GaN and InxGa1−xN alloy using hot-press method in order to test their high temperature thermoelectric properties. The Seebeck coefficient and the resistivity were –10μV/K and 1.8×10−6Ωm for InN, and –50μV/K and 1.9×10−4Ωm for GaN at 300K, respectively. Thermal conductivity determined by laser flash method with porosity correction was 17W/mK for InN and 2.6W/mK for GaN. For InN the Seebeck coefficient and the resistivity increased monotonously with increasing temperature, which indicates that InN is a metal or a degenerately doped semiconductor. The power factor and the figure of merit were 2.1 × 10−4W/mK2and 1.5×10−5K−1for InN and 6.9 × 10−5W/mK2and 2.6×10−5K−1for GaN at 650K, respectively.


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