Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials

2015 ◽  
Vol 118 (16) ◽  
pp. 164101 ◽  
Author(s):  
Y. Li ◽  
A. Leśniewska ◽  
O. Varela Pedreira ◽  
J.-F. de Marneffe ◽  
I. Ciofi ◽  
...  
Keyword(s):  
Leakage Current ◽  
Stress Induced Leakage Current ◽  
Low K ◽  
Dielectric Degradation

Degradation and SILC Effects of RPECVD sub-2.0nm Oxide/Nitride and Oxynitride Dielectrics Under Constant Current Stress

2002 ◽  
Vol 716 ◽  
Author(s):  
Yi-Mu Lee ◽  
Yider Wu ◽  
Joon Goo Hong ◽  
Gerald Lucovsky
Keyword(s):  
Leakage Current ◽  
Electrical Performance ◽  
Constant Current ◽  
Continuous Increase ◽  
Current Stress ◽  
Thermal Oxide ◽  
Stress Induced Leakage Current ◽  
Boron Penetration ◽  
Soft Breakdown ◽  
Induced Defects

AbstractConstant current stress (CCS) has been used to investigate the Stress-Induced Leakage Current (SILC) to clarify the influence of boron penetration and nitrogen incorporation on the breakdown of p-channel devices with sub-2.0 nm Oxide/Nitride (O/N) and oxynitride dielectrics prepared by remote plasma enhanced CVD (RPECVD). Degradation of MOSFET characteristics correlated with soft breakdown (SBD) and hard breakdown (HBD), and attributed to the increased gate leakage current are studied. Gate voltages were gradually decreased during SBD, and a continuous increase in SILC at low gate voltages between each stress interval, is shown to be due to the generation of positive traps which are enhanced by boron penetration. Compared to thermal oxides, stacked O/N and oxynitride dielectrics with interface nitridation show reduced SILC due to the suppression of boron penetration and associated positive trap generation. Devices stressed under substrate injection show harder breakdown and more severe degradation, implying a greater amount of the stress-induced defects at SiO2/substrate interface. Stacked O/N and oxynitride devices also show less degradation in electrical performance compared to thermal oxide devices due to an improved Si/SiO2 interface, and reduced gate-to-drain overlap region.

Transient effects of positive oxide charge on stress-induced leakage current in tunnel oxides

1999 ◽  
Vol 75 (5) ◽  
pp. 734-736 ◽  
Author(s):  
Nian-Kai Zous ◽  
Tahui Wang ◽  
Chih-Chich Yeh ◽  
C. W. Tsai ◽  
Chimoon Huang
Keyword(s):  
Leakage Current ◽  
Transient Effects ◽  
Oxide Charge ◽  
Stress Induced Leakage Current ◽  
Tunnel Oxides

Ultra-Low-K dielectric degradation before breakdown

2010 ◽  
Author(s):  
T. Breuer ◽  
U. Kerst ◽  
C. Boit ◽  
E. Langer ◽  
H. Ruelke
Keyword(s):  
Low K ◽  
Dielectric Degradation

Mechanism of stress induced leakage current in Si3N4

2019 ◽  
Vol 6 (7) ◽  
pp. 076401
Author(s):  
V A Gritsenko ◽  
A A Gismatulin ◽  
A P Baraban ◽  
A Сhin
Keyword(s):  
Leakage Current ◽  
Stress Induced Leakage Current

Stress induced leakage current at low field in ultra thin oxides

2001 ◽  
Vol 41 (9-10) ◽  
pp. 1421-1425 ◽  
Author(s):  
F. Lime ◽  
G. Ghibauda ◽  
G. Guégan
Keyword(s):  
Leakage Current ◽  
Low Field ◽  
Stress Induced Leakage Current

Profiling Different Kinds of Generated Defects at Elevated Temperature in Both SiO2 and High-k Dielectrics

2010 ◽  
Vol 1252 ◽  
Author(s):  
Sahar Sahhaf ◽  
Robin Degraeve ◽  
Mohammed Zahid ◽  
Guido Groeseneken
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Low Temperature ◽  
Leakage Current ◽  
Charge Injection ◽  
Constant Voltage ◽  
High K ◽  
Voltage Stress ◽  
Stress Induced Leakage Current ◽  
High K Dielectric

AbstractIn this work, the effect of elevated temperature on the generated defects with constant voltage stress (CVS) in SiO2 and SiO2/HfSiO stacks is investigated. Applying Trap Spectroscopy by Charge Injection and Sensing (TSCIS) to 6.5 nm SiO2 layers, different kinds of generated traps are profiled at low and high temperature. Also the Stress-Induced Leakage Current (SILC) spectrum of high-k dielectric stack is different at elevated temperature indicating that degradation and breakdown at high temperature is not equivalent to that at low temperature and therefore, extrapolation of data from high to low T or vice versa is challenging.

Sign in / Sign up

Export Citation Format

Share Document