Low cost lift-off process optimization for MEMS applications

Abstract Impinging circular free-surface water jets are used in challenging cooling and cleaning tasks. In order to develop simulation models for process optimization, validation data are required, which are currently not available. Therefore, the flow field of these jets is studied for the first time with the novel laser Doppler velocity profile sensor. The mean velocity field and fluctuations are measured within the stagnation and adjacent redirection region for radial coordinates up to three times the nozzle diameter. In the examined parameter range with jet velocities up to 17 m/s and nozzle diameters up to 5.2 mm, i.e., Reynolds numbers up to 69 500, thin films of a few hundred micrometers are formed, which hinder the measurement with common optical measuring systems. Based on the measurement results, a comparatively low-cost volume of fluid simulation model is developed and validated that presumes a relaminarized film flow. The profiles measured and the simulated flow show very good agreement. In the future, the simulation model provides a basis for process optimization and the innovative measurement technology used will prospectively provide further detailed insights into other flows with high velocity gradients.

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Lithography Process Challenges for 3D and 2.5D Applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2013dpc-ta14 ◽

2013 ◽

Vol 2013 (DPC) ◽

pp. 000398-000424

Author(s):

Doug Shelton ◽

Tomii Kume

Keyword(s):

High Resolution ◽

Process Optimization ◽

Mass Production ◽

Low Cost ◽

High Density ◽

Through Silicon Via ◽

Key Technology ◽

Lithography Process ◽

Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.

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Lithography Process Optimization for 3D and 2.5D Applications

International Symposium on Microelectronics ◽

10.4071/isom-2013-thp11 ◽

2013 ◽

Vol 2013 (1) ◽

pp. 000790-000793 ◽

Cited By ~ 1

Author(s):

Doug Shelton ◽

Tomii Kume

Keyword(s):

High Resolution ◽

Process Optimization ◽

Preliminary Data ◽

Mass Production ◽

Low Cost ◽

High Density ◽

Through Silicon Via ◽

Key Technology ◽

Lithography Process ◽

Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.

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Straight Long-Range Surface Plasmon Polariton Waveguide Sensor Operating at λ0 = 850 nm

Sensors ◽

10.3390/s20092507 ◽

2020 ◽

Vol 20 (9) ◽

pp. 2507 ◽

Cited By ~ 2

Author(s):

Yan Xu ◽

Fei Wang ◽

Yang Gao ◽

Daming Zhang ◽

Xiaoqiang Sun ◽

...

Keyword(s):

Long Range ◽

Surface Plasmon ◽

Surface Plasmon Polariton ◽

Optical Transmission ◽

Low Cost ◽

Refractive Index Sensor ◽

Optical Wavelength ◽

Plasmon Polariton ◽

Lift Off ◽

Waveguide Sensor

A bulk refractive index sensor based on a straight long-range surface plasmon polariton (LRSPP) waveguide is theoretically designed. The waveguide sensor consists of an Au stripe that is embedded in ultraviolet sensitive polymer SU-8. The geometric parameters are optimized by finite difference eigenmode method at the optical wavelength of 850 nm. The sensitivity of 196 dB/RIU/mm can be obtained with a 1.5 μm wide, 25 nm thick Au stripe waveguide. Straight LRSPP waveguides are fabricated by a double layer lift-off process. Its optical transmission is characterized to experimentally prove the feasibility of the proposed design. This sensor has potential for the realization of a portable, low-cost refractometer.

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Process optimization for aqueous extraction of reducing sugar from cashew apple bagasse: A potential, low cost substrate

LWT ◽

10.1016/j.lwt.2010.06.005 ◽

2011 ◽

Vol 44 (1) ◽

pp. 62-66 ◽

Cited By ~ 10

Author(s):

Arindam Kuila ◽

Anshu Singh ◽

Mainak Mukhopadhyay ◽

Rintu Banerjee

Keyword(s):

Process Optimization ◽

Low Cost ◽

Reducing Sugar ◽

Aqueous Extraction ◽

Cashew Apple Bagasse ◽

Cashew Apple ◽

Low Cost Substrate

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Kaizen Philosophy Application as Production Standardization and Process Optimization

International Journal for Innovation Education and Research ◽

10.31686/ijier.vol7.iss11.1936 ◽

2019 ◽

Vol 7 (11) ◽

pp. 808-816

Author(s):

Reissa Sousa Silva ◽

David Barbosa de Alencar ◽

Alexandra Priscilla Tregue Costa ◽

Antônio Estanislau Sanches

Keyword(s):

Human Resource Development ◽

Human Resource ◽

Process Optimization ◽

Continuous Improvement ◽

Low Cost ◽

Resource Development ◽

Scientific Article ◽

Market Competitiveness

Market competitiveness has increased and companies are increasingly looking for methodologies that enable them to have higher productivity and organization at work, at low cost. More flexible and innovative processes and products are key to the survival and success of many companies. The importance of a study of Kaizen philosophy is due to the fact that it is based on continuous efforts to improve the system. Therefore, the present study aims to clarify the process of continuous improvement through the implementation of the Kaizen tool so that it can guide the productive improvement of companies in the Manaus (AM) industrial hub. This scientific article was elaborated, based on the bibliographic research resulting from an analysis, which considered the two-axis cross perspective - Kaizen philosophy and continuous improvement. This article demonstrates the Kaizen continuous improvement tool as it emerged and the benefits generated in environments that encourage learning and cooperation among individuals, working on human resource development so that improvement initiatives are truly continuous.

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