scholarly journals Temperature and band gap dependence of GaAsBi p-i-n diode current–voltage behaviour

2021 ◽  
Vol 54 (19) ◽  
pp. 195102
Author(s):  
R D Richards ◽  
F Harun ◽  
M R M Nawawi ◽  
Y Liu ◽  
T B O Rockett ◽  
...  
Keyword(s):  
Band Gap ◽  
Current Voltage ◽  
Diode Current

scholarly journals Production and Electrical Properties of a CuZnAlMn(SMA)/p-Si Diode

2021 ◽  
Author(s):  
EMINE ALDIRMAZ ◽  
M. Güler ◽  
E. Güler
Keyword(s):  
Room Temperature ◽  
Schottky Contact ◽  
Phase Identification ◽  
Frequency Interval ◽  
Electrical Measurements ◽  
X Ray ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
Type Semiconductor ◽  
Diode Current

Abstract In this study, the Cu-23.37%Zn-13.73%Al-2.92%Mn (at.%) alloy was used. Phase identification was performed with the Scanning electron microscope (SEM), and energy-dispersive X-ray (EDX). We observed in the austenite phase in Cu-23.37%Zn-13.73%Al-2.92%Mn (at.%) alloy. To produce a new Schottky diode, CuZnAlMn alloy was exploited as a Schottky contact on p-type semiconductor silicon substrate. To calculate the characteristics of the produced diode, current-voltage (I-V), capacitance-voltage (C-V) and conductance-voltage (G-V) analyzes were taken at room temperature (300 K), in the dark and under various lights. Using electrical measurements, the diode's ideality factor (n), barrier height (Φb), and other diode parameters were calculated. Besides, the conductance / capacitance-voltage (G/C-V) characteristics of the diode were studied and in a wide frequency interval at room temperature. Also, the capacitance and conductance values strongly ​​ rely on the frequency. From the present experimental results, the obtained diode can be used for optoelectronic devices.

Efficient Cu(In, Ga)Se2 Based Solar Cells Prepared by Electrodeposition

2003 ◽  
Vol 763 ◽  
Author(s):  
D. Guimard ◽  
N. Bodereau ◽  
J. Kurdi ◽  
J.F. Guillemoles ◽  
D. Lincot ◽  
...  
Keyword(s):  
Band Gap ◽  
Room Temperature ◽  
Open Circuit Voltage ◽  
Spectral Response ◽  
Deposition Process ◽  
Open Circuit ◽  
Response Analysis ◽  
Cell Parameters ◽  
Current Voltage ◽  
Capacitance Voltage

AbstractCuInSe2 and Cu(In, Ga)Se2 precursor layers have been prepared by electrodeposition, with morphologies suitable for device completion. These precursor films were transformed into photovoltaic quality films after thermal annealing without any post-additional vacuum deposition process. Depending on the preparation parameters annealed films with different band gaps between 1eV and 1.5 eV have been prepared. The dependence of resulting solar cell parameters has been investigated. The best efficiency achieved is about 10,2 % for a band gap of 1.45 eV. This device presents an open circuit voltage value of 740 mV, in agreement with the higher band gap value. Device characterisations (current-voltage, capacitance-voltage and spectral response analysis) have been performed. Admittance spectroscopy at room temperature indicates the presence of two acceptor traps at 0.3 and 0.43 eV from the valance band with density of the order of 2. 1017 cm-3 eV-1.

Superfast Drift Step Recovery Diodes (DSRDs) and Vacuum Field Emission Diodes Based on 4H-SiC

2013 ◽  
Vol 740-742 ◽  
pp. 1010-1013 ◽  
Author(s):  
Alexey V. Afanasyev ◽  
Boris V. Ivanov ◽  
Vladimir A. Ilyin ◽  
Alexey F. Kardo-Sysoev ◽  
Maria A. Kuznetsova ◽  
...  
Keyword(s):  
Field Emission ◽  
Wide Bandgap ◽  
Voltage Characteristic ◽  
Vacuum Field ◽  
Current Voltage ◽  
Capacitor Voltage ◽  
Current Densities ◽  
Current Voltage Characteristics ◽  
Manufacturing Methods ◽  
Diode Current

This paper presents the results of research and development of two types diode structures based on wide bandgap 4H-SiC: drift step recovery diodes (DSRDs) and field emission diodes (FED). Diodes’ structure and manufacturing methods are reviewed. Diode’s characteristics were obtained (static current-voltage characteristics and capacitor-voltage characteristic, switching properties’ characteristics for DSRDs). Field emission 4H-SiC structures illustrated high (≥102 А/сm2) current densities at electric field intensity of approximately 10V/um. 4H-SiC DSRDs in the generator structure with a single oscillating contour allowed to form sub nanosecond impulses at a load 50 Ohm and 1,5-2kV amplitude for a single diode (current density at V=2kV J= 4•103 А/сm2),what is significantly higher than similar DSRD’s parameters obtained for silicon.

scholarly journals Optimization of p-type contacts to InGaN-based laser diodes and light emitting diodes grown by plasma assisted molecular beam epitaxy

2020 ◽  
Vol 50 (2) ◽  
Author(s):  
Krzesimir Nowakowski-Szkudlarek ◽  
Grzegorz Muziol ◽  
Mikolaj Żak ◽  
Mateusz Hajdel ◽  
Marcin Siekacz ◽  
...  
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Contact Layer ◽  
Light Emitting ◽  
Mg Doping ◽  
Current Voltage ◽  
Type Contact ◽  
Current Voltage Characteristics ◽  
P Type ◽  
Diode Current

We investigated the influence of the In0.17Ga0.83N:Mg contact layer grown by plasma assisted molecular beam epitaxy on the resistivity of p-type Ni/Au contacts. We demonstrate that the Schottky barrier width for p-type contact is less than 5 nm. We compare circular transmission line measurements with a p-n diode current-voltage characteristics and show that discrepancies between these two methods can occur if surface quality is deteriorated. It is found that the most efficient contacts to p-type material consist of In0.17Ga0.83N:Mg contact layer with Mg doping level as high as 2 × 1020 cm–3.

scholarly journals Hafnium dioxide effect on the electrical properties of M/n-GaN structure

2020 ◽  
Vol 38 (1) ◽  
pp. 165-173
Author(s):  
Sadoun Ali ◽  
Mansouri Sedik ◽  
Chellali Mohammed ◽  
Lakhdar Nacereddine ◽  
Hima Abdelkader ◽  
...  
Keyword(s):  
Barrier Height ◽  
Series Resistance ◽  
Hafnium Dioxide ◽  
Electrical Parameters ◽  
Semiconductor Interface ◽  
Metal Insulator ◽  
Current Voltage ◽  
Equation Versus ◽  
Diode Current ◽  
Numerical Simulator

AbstractIn the present paper, using of SILVACO-TCAD numerical simulator for studying the enhancement in Pt/n-GaN Schottky diode current–voltage (I-V) characteristics by introduction of a layer of hafnium dioxide (HfO2) (with a thickness e = 5 nm) between the Pt contact and semiconductor interface of GaN is reported. The simulation of I-V characteristics of Pt/n-GaN was done at a temperature of 300 K. However, the simulation of Pt/HfO2/n-GaN structure was performed in a temperature range of 270 – 390 K at steps of 30 K. The electrical parameters: barrier height (Φb), ideality factor and series resistance have been calculated using different methods: conventional I-V, Norde, Cheung, Chattopadhyay and Mikhelashvili. Statistical analysis showed that the metal-insulator-semiconductor (Pt/HfO2/n-GaN) structure has a barrier height of 0.79 eV which is higher compared with the (Pt/n-GaN) structure (0.56 eV). The parameters of modified Richardson (\left( {\ln \left( {{{{{\rm{I}}_0}} \over {{{\rm{T}}^{\rm{2}}}}}} \right) - \left( {{{{{\rm{q}}^2}\sigma _{{\rm{s}}0}^2} \over {2{\rm{k}}{{\rm{T}}^2}}}} \right) = \ln \left( {{\rm{AA*}}} \right) - {{{\rm{q}}{\emptyset _{{\rm{B}}0}}} \over {{\rm{kT}}}}} \right) equation versus ({1 \over {{\rm{kT}}}}) have been extracted using the mentioned methods. The following values: {\rm{A}}_{{\rm{Simul}}}^* = 22.65\,{\rm{A/c}}{{\rm{m}}^{\rm{2}}} \cdot {{\rm{K}}^2}, 14.29 A/cm2 K2, 25.53 A/cm2 K2 and 21.75 A/cm2 K2 were found. The Chattopadhyay method occurred the best method for estimation the theoretical values of Richardson constant.

Current Analysis of Ion Implanted p+/n 4H-SiC Junctions: Post-Implantation Annealing in Ar Ambient

2006 ◽  
Vol 527-529 ◽  
pp. 815-818 ◽  
Author(s):  
Roberta Nipoti ◽  
Fabio Bergamini ◽  
Francesco Moscatelli ◽  
Antonella Poggi ◽  
Mariaconcetta Canino ◽  
...  
Keyword(s):  
Reverse Bias ◽  
Annealing Process ◽  
Current Analysis ◽  
Selective Area ◽  
Current Voltage ◽  
Current Voltage Characteristics ◽  
Implantation Process ◽  
Voltage Breakdown ◽  
Post Implantation ◽  
Diode Current

An n-type 8° off-axis <0001> 4H-SiC epitaxial wafer was processed. The n-type epilayer had doping and thickness of, respectively, ~3 × 1015 cm-3 and ~5 μm. p+/n diodes with not terminated junctions were constructed by a selective area implantation process of 9.2 × 1014 cm-2 Al+ ions at 400°C. The diodes had areas in the range 2×10-4 -1×10-3 cm2. The Al depth profile was 6×1019 cm-3 high and 164 nm thick. The post implantation annealing process was done in a high purity Ar ambient at 1600°C for 30 min. The diode current-voltage characteristics were measured in the temperature range 25-290°C. Statistics of 50-100 measurements per device type were done. The fraction of diodes that could be modeled as abrupt junctions within the frame of the Shockley theory decreased with increasing area value, but was always > 75%. The ideality factor was > 2 only at temperatures > 200°C and bias values < 1 V. The leakage current was extremely weak and remained of the order of 10-9 Acm-2 at 70°C and 500 V reverse bias. 4% of the diodes reached the theoretical voltage breakdown that was 1030 V. The surface roughness of un-implanted and implanted regions after diode processing was, respectively, 2 nm and 12 nm.

Revisiting single photon avalanche diode current-voltage modeling and transient characteristics

2014 ◽  
Vol 115 (20) ◽  
pp. 204503 ◽  
Author(s):  
M. Javitt ◽  
V. Savuskan ◽  
T. Merhav ◽  
Y. Nemirovsky
Keyword(s):  
Single Photon ◽  
Transient Characteristics ◽  
Avalanche Diode ◽  
Current Voltage ◽  
Diode Current
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