High-operating-temperature MWIR photodetector based on a InAs/GaSb superlattice grown by MOCVD

2022 ◽  
Vol 43 (1) ◽  
pp. 012303
Author(s):  
Xiujun Hao ◽  
Yan Teng ◽  
He Zhu ◽  
Jiafeng Liu ◽  
Hong Zhu ◽  
...  
Keyword(s):  
Lattice Mismatch ◽  
Operating Temperature ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Cutoff Wavelength ◽  
X Ray Diffraction ◽  
High Crystalline Quality ◽  
High Operating Temperature ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Abstract We demonstrate a high-operating-temperature (HOT) mid-wavelength InAs/GaSb superlattice heterojunction infrared photodetector grown by metal–organic chemical vapor deposition. High crystalline quality and the near-zero lattice mismatch of a InAs/GaSb superlattice on an InAs substrate were evidenced by high-resolution X-ray diffraction. At a bias voltage of –0.1 V and an operating temperature of 200 K, the device exhibited a 50% cutoff wavelength of ~ 4.9 μm, a dark current density of 0.012 A/cm2, and a peak specific detectivity of 2.3 × 109 cm·Hz1/2 /W.

scholarly journals High Operating Temperature InAs/GaSb Superlattice Based Mid Wavelength Infrared Photodetectors Grown by MOCVD

Photonics ◽  
2021 ◽  
Vol 8 (12) ◽  
pp. 564
Author(s):  
He Zhu ◽  
Jiafeng Liu ◽  
Hong Zhu ◽  
Yunlong Huai ◽  
Meng Li ◽  
...  
Keyword(s):  
Operating Temperature ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Infrared Photodetectors ◽  
Cutoff Wavelength ◽  
Fully Depleted ◽  
High Operating Temperature ◽  
Diffusion Limited ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

High operating temperature mid-wavelength InAs/GaSb superlattice infrared photodetectors with a single heterojunction structure grown by metal–organic chemical vapor deposition are reported. By inserting a fully-depleted wider-gap barrier layer between the absorber and the p-contact, “diffusion-limited” behavior has been achieved for the heterojunction “PNn” device, in contrast to the conventional pin homojunction device. The PNn device with a 50% cutoff wavelength of 4.5 μm exhibited a dark current of 2.05 × 10−4 A/cm2 and a peak specific detectivity of 1.28 × 1011 cm·Hz·W−1 at 150 K and a reverse bias of −0.1 V.

scholarly journals Properties and Orientation of Antiferroelectric Lead Zirconate Thin Films Grown by MOCVD

1998 ◽  
Vol 541 ◽  
Author(s):  
Nan Chen ◽  
G. R. Bai ◽  
O. Auciello ◽  
R. E. Koritala ◽  
M. T. Lanagan
Keyword(s):  
Thin Films ◽  
Chemical Vapor ◽  
Lead Zirconate ◽  
Dielectric Constants ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Si Substrates ◽  
Antiferroelectric Phase ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

AbstractSingle-phase polycrystalline PbZrO3 (PZ) thin films, 3000-6000 A thick, have been grown by metal-organic chemical vapor deposition (MOCVD) on (111)Pt/Ti/SiO2/Si substrates at ≍525°C. X-ray diffraction analysis indicated that the PZ films grown on (111)Pt/Ti/SiO2/Si (Pt/Tgi/Si) showed preferred pseudocubic (110) orientation. In contrast, PZ films grown on 150 A thick PbTiO3 (PT) template layers exhibited a pseudocubic (100) preferred orientation, and PZ films deposited on TiO2 template layers consisted of randomly oriented grains. The PZ films grown on Pt/Ti/Si with or without templates exhibited dielectric constants of 120-200 and loss tangents of 0.01-0.0. The PZ films with (110) orientation exhibited an electric-field-inducedtransformation from the antiferroelectric phase to the ferroelectric phase with a polarization of ≍34 µC/cm2, and the energy that was stored during switching was 7.1 J/cm3. The field needed to excite the ferroelectric state and that needed to revert to the antiferroelectric state were 50 and 250 kV/cm, respectively. Relationships between the MOCVD processing and the film microstructure and properties are discussed.

MOCVD of SnSx thin films for solar cell application

2015 ◽  
Vol 1738 ◽  
Author(s):  
Andrew J. Clayton ◽  
Stuart J. C. Irvine ◽  
Vincent Barrioz ◽  
Alessia Masciullo
Keyword(s):  
Chemical Vapor ◽  
Organic Chemical ◽  
Sulfur Source ◽  
Tin Sulfide ◽  
X Ray Diffraction ◽  
Phase Growth ◽  
Solar Cell Application ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

ABSTRACTAn inline metal organic chemical vapor deposition system was used to deposit tin sulfide at temperatures >500 °C. Tetramethyltin was used as the tin source and diethyldisulfide as the sulfur source. An overhead injector configuration was used delivering both precursors directly over the substrate. The tin and sulfur precursors were premixed before injection to improve chemical reaction in the gas phase. Growth temperatures 500 – 540 °C were employed producing films with approximate 1:1 stoichiometry of Sn and S detected by energy dispersive x-ray spectroscopy. X-ray diffraction showed there to be mixed phases with Sn2S3 present with SnS.

Variant structure in metal-organic-chemical-vapor-deposition-derived SnO2 thin films on sapphire (0001)

1995 ◽  
Vol 10 (6) ◽  
pp. 1516-1522 ◽  
Author(s):  
Donhang Liu ◽  
Q. Wang ◽  
H.L.M. Chang ◽  
Haydn Chen
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Lattice Mismatch ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Metal Organic ◽  
Film Substrate ◽  
Organic Chemical Vapor Deposition

Tin oxide (SnO2) thin films were deposited on sapphire (0001) substrate by metal-organic chemical vapor deposition (MOCVD) at temperatures of 600 and 700 °C. The microstructure of the deposited films was characterized by x-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). At the growth conditions studied, films were single-phase rutile and epitaxial, but showed variant structures. Three distinct in-plane epitaxial relationships were observed between the films and the substrate. A crystallographic model is proposed to explain the film morphology. This model can successfully predict the ratio of the width to the length of an averaged grain size based upon the lattice mismatch of the film-substrate interface.

Study of Depth-Dependent Tetragonal Distortion of GaN Epilayer with Tri-Layer AlGaN Interlayer Growth on Si(111)

2011 ◽  
Vol 413 ◽  
pp. 11-17 ◽  
Author(s):  
Bin Feng Ding ◽  
Yong Quan Chai
Keyword(s):  
Chemical Vapor ◽  
Crystal Quality ◽  
Tetragonal Distortion ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Near Surface ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

A GaN epilayer with tri-layer AlGaN interlayer grown on Si (111) by metal-organic chemical vapor deposition (MOCVD) method was discussed by synchrotron radiation x-ray diffraction (SRXRD) and Rutherford backscattering (RBS)/C. The crystal quality of the epilayer is very good with a χmin=2.1%. According to the results of the θ-2θ scan of GaN(0002) and GaN(1122), the epilayer elastic strains in perpendicular and parallel directions were calculated respectively to be-0.019% and 0.063%. By the angular scan using RBS/C around a symmetric [0001] axis and an asymmetric [1213] axis in the (1010) plane of the GaN layer, the tetragonal distortion (eT ) were determined to be 0.09%. This result coincides with that from SRXRD perfectly. The strain decreases gradually towards the near-surface layer, which will avoid the film cracks efficiently and improve the crystal quality of the GaN epilayer remarkably.

Effect of Graded AlxGa1-xN Interlayer Buffer on the Strain of GaN Grown on Si (111) Using MOCVD Method

2008 ◽  
Vol 1068 ◽  
Author(s):  
KungLiang Lin ◽  
Edward-Yi Chang ◽  
Tingkai Li ◽  
Wei-Ching Huang ◽  
Yu-Lin Hsiao ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Buffer Layers ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
X Ray ◽  
Metal Organic ◽  
Proper Design ◽  
Organic Chemical Vapor Deposition ◽  
Gan Film

ABSTRACTGaN film grown on Si substrate with AlN/AlxGa1−xN buffer is studied by low pressure metal organic chemical vapor deposition (MOCVD) method. The AlxGa1−xN film with Al composition varying from 0∼ 0.66 was used. The correlation of the Al composition in the AlxGa1−xN film with the stress of the GaN film grown was studied using high resolution X-ray diffraction including symmetrical and asymmetrical ω/2θscans and reciprocal space maps. It is found that with proper design of the Al composition in the AlxGa1−xN buffer layer, crack-free GaN films can be successfully grown on Si (111) substrates using AlN and AlxGa1−xN buffer layers.

Effects of Cu/Ba Ratio in Precursor on MOCVD-Deposited YBa2Cu3O7-x Films on YYC Buffered Ni-W Alloy Tape

2014 ◽  
Vol 1082 ◽  
pp. 95-99
Author(s):  
Fei Zhang ◽  
Jie Xiong ◽  
Rui Peng Zhao ◽  
Yan Xue ◽  
Bo Wan Tao
Keyword(s):  
Vapor Deposition ◽  
Ybco Film ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Ybco Films ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
Alloy Tape

To study the effects of Cu/Ba ratio of precursor on YBa2Cu3O7-x (YBCO) film, we have employed the technique of metal-organic chemical vapor deposition to prepare 500 nm thick YBCO films on CeO2/YSZ/Y2O3 (YYC) buffered Ni-W alloy tapes at series of Cu/Ba ratios of precursor. The analysis obtained from X-ray diffraction and scanning electron microscope revealed that the YBCO films crystallized better and became more continuous and denser as Cu/Ba ratio increased from 0.81 to 1.00, yielding that the critical current density (Jc) of YBCO films at 77K and 0T rose from 1.0 MA/cm2 to 1.4 MA/cm2. Moreover, the energy dispersive spectroscopy indicated that the increase in Cu/Ba ratio of precursor made the Cu/Ba ratio of the YBCO film matrix closer to the theoretical value of 1.5. However, for the Cu/Ba ratio of precursor in the range of 1.00~1.21, the crystallization and texture deteriorated severely and many unexpected precipitates of Ba-Cu-O and Cu-O arose, resulting in the dramatic drop of Jc from 1.4 MA/cm2 to 0.1 MA/cm2.

Internal Stress and Grain Size Effect on the Phase Stabilization of ZrO2 Deposited by MOCVD

2011 ◽  
Vol 675-677 ◽  
pp. 1201-1204
Author(s):  
Zhe Chen ◽  
Bin Wang ◽  
Nathalie Prud’homme ◽  
Sheng Li Ma ◽  
Vincent Ji ◽  
...  
Keyword(s):  
Grain Size ◽  
Internal Stress ◽  
Tetragonal Phase ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Phase Stabilization ◽  
Different Temperatures ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Zirconia (ZrO2) films were deposited by metal-organic chemical vapor deposition (MOCVD) on {1 0 0} Si single crystal using Zr(thd)4 precursors. The thickness of obtained films is typically of 3.5 μm. The samples have been characterized by Field-Emission-Gun Scanning Electron Microscopy (FEG-SEM) for morphologic and microstructure study, and by X-ray Diffraction (XRD) for crystalline structure. The microstructure analysis showed that unexpected stable single tetragonal phase preferentially grew in low temperature area. According to the literature, the tetragonal phase stabilization is related to the crystalline size and the internal compressive stress. To analyze the effect of grain size and internal stress on the phase transformation, the thermal annealing were carried out in different temperatures and internal stress was measured by XRD method.

Thermal Stability of Pt, Pd, and Ni on GaN

1996 ◽  
Vol 449 ◽  
Author(s):  
K. J. Duxstad ◽  
E. E. Haller ◽  
K.M. Yu ◽  
M. T. Hirsch ◽  
W. R. Imler ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Structural Changes ◽  
Rutherford Backscattering Spectrometry ◽  
Chemical Vapor ◽  
Contact Structures ◽  
Organic Chemical ◽  
X Ray Diffraction ◽  
Surface Behavior ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

ABSTRACTThe development of reliable Ohmic and Schottky contacts on GaN will require an understanding of the thermal stability and metallurgy of metal-GaN contact structures. We investigated the behavior of Pt, Pd, and Ni on GaN as a function of annealing temperature. Rutherford backscattering spectrometry, x-ray diffraction, and scanning electron microscopy were used to characterize the interface and surface behavior. 800Å thin metal films were deposited by sputtering on 2μm GaN films grown by metal organic chemical vapor deposition on sapphire substrates. No reactions occur in the Pt, Pd, and Ni systems with annealing up to 800°C. The Pt film begins to form submicron spheres and islands after annealing above 600°C. The Pd and Ni films begin to island with annealing above 700°C. Below these temperatures no structural changes were observed.

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