scholarly journals The influence of target film material and coating on neutron yield and sputtering yield

2021 ◽  
Author(s):  
Jiaxi Liu ◽  
Jingbin Lu ◽  
Xu Xu ◽  
Chengqian Li ◽  
Yu Wang ◽  
...  
Keyword(s):  
Heavy Water ◽  
Target Material ◽  
Aluminum Carbide ◽  
High Yield ◽  
Film Material ◽  
Coating Materials ◽  
Neutron Tube ◽  
Long Life ◽  
Sputtering Yield ◽  
Deuterated Polyethylene

Abstract The long-life, high yield deuterium-deuterium (D-D) neutron tube has become one of the research hotspots. Here, deuterated polyethylene target, heavy water target and titanium target were investigated by Stopping and Range of Ions in Matter (SRIM). The calculation showed that the deuterated polyethylene target, which was a potential target material, had the highest yield at an incident energy of 120 keV. Further, considering the unfavorable factors such as impurity ions and high temperature, the coating was used to protect the target material. Diamond, boron carbide, boron nitride, silicon carbide, and aluminum carbide were selected. The simulation results showed that the diamond composite deuterated polyethylene film had the best sputtering resistance, and the aluminum nitride composite heavy water target film had the lowest sputtering yield. The two coating materials shield the target, reduced the energy loss of incident ions, and provided a new method for the research of high yield and long life neutron tube.

scholarly journals High yield production of C2–C3 olefins and para-xylene from methanol using a SiO2-coated FeOx/ZSM-5 catalyst

RSC Advances ◽  
2017 ◽  
Vol 7 (46) ◽  
pp. 28940-28944 ◽  
Author(s):  
Qiongfang Hu ◽  
Xiaofan Huang ◽  
Yu Cui ◽  
Tengfa Luo ◽  
Xiaoping Tang ◽  
...  
Keyword(s):  
Life Time ◽  
High Yield ◽  
Yield Production ◽  
Para Xylene ◽  
Long Life ◽  
High Yield Production

SiO2-coated FeOx/ZSM-5 catalyst exhibited long life time to produce C2–C3 olefins and para-xylene in high yield.

Optimization of mechanical properties of thin free-standing metal films for RF-MEMS

2004 ◽  
Vol 820 ◽  
Author(s):  
Jaap M.J. den Toonder ◽  
Auke R. van Dijken
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Yield Strength ◽  
Rf Mems ◽  
High Yield ◽  
Film Material ◽  
X Ray Diffraction ◽  
Free Standing ◽  
Aluminum Films ◽  
Materials Used

AbstractThe mechanical properties of the thin film materials used in RF-MEMS are crucial for the reliability and proper functioning of the devices. In this paper we study a large number of aluminum alloys as possible RF-MEMS thin film materials. The yield strength and creep properties are measured using nano-indentation. The results show that the mechanical properties of thin aluminum films can be improved substantially by alloying elements. Of the alloys studied in this paper, AlCuMgMn in particular seems quite promising as a thin film material for RF MEMS, having both high yield strength and little creep. Using X-ray diffraction and electron microscopy, the observed effects are partly explained.

Bambusa vulgaris (common bamboo).

2021 ◽  
Author(s):  
Julissa Rojas-Sandoval ◽  
Pedro Acevedo-Rodríguez
Keyword(s):  
Genetic Variability ◽  
Life Expectancy ◽  
Vegetative Propagation ◽  
New World ◽  
High Yield ◽  
Asian Species ◽  
Se Asia ◽  
Bambusa Vulgaris ◽  
Long Life ◽  
Biomass For Energy

Abstract Bambusa vulgaris is the most commonly encountered bamboo in cultivation in SE Asia but is rarely found in natural forest (although possibly natural, or escaped, naturalized populations exist). It is grown pantropically, and is the only Asian species that is common in the New World. Ease of propagation is the main reason for its success, culms and branches rooting very readily indeed. Infrequency of flowering, failure to produce seed and divert resources away from culm production, and recovery of clumps after flowering are other assets, and may be a result of repeated selection and cloning (Stapleton, 1990). Although not very straight, not easy to split, and inflexible, the culms are thick-walled and initially strong although relatively susceptible to powder-post beetle attack. They find many uses, although structural use is not recommended without preservation to protect against beetles. The ease of propagation, long life expectancy, and high yield make this species better suited to production of pulp and biomass for energy. Susceptibility to bamboo blight is of concern, especially on sites with impeded drainage. Repeated vegetative propagation has resulted in reduced genetic variability. Ornamental clones with all yellow, or yellow striped culms, or shortened, swollen culm internodes ('Wamin') are widely cultivated.

New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages

2012 ◽  
Vol 2012 (1) ◽  
pp. 000991-000997 ◽  
Author(s):  
Yohei Tateishi ◽  
Makoto Fujimura ◽  
Takashi Iga ◽  
Toshihiko Jimbo
Keyword(s):  
Mobile Devices ◽  
Transmission Loss ◽  
Coefficient Of Thermal Expansion ◽  
Peel Strength ◽  
High Yield ◽  
Process Window ◽  
Tangent Loss ◽  
Film Material ◽  
Insulation Material ◽  
5 Ghz

A variety of mobile devices such as smart phones, ultra thin laptops, and tablet PCs have been introduced to the world wide market, and the demands are gaining momentum. In technological perspectives, the trend is going to increased amount of data transfer and further miniaturization of the devices for more comfortable browsing and convenience. With this trend, a build-up insulation film material that plays an important role in interposer substrates for semiconductor packaging, is required to have higher performance to cover 1) low transmission loss, 2) extremely small line and space (L/S) with an ultra-smooth copper surface, and 3) low coefficient of thermal expansion (CTE). It has been very challenging to develop build-up film materials to meet all requirements. We have developed a new build-up insulation film material based on a unique polymer, cyclo-olefin polymer (COP), which has much lower moisture absorption, Dk, and Df than standard epoxy-based materials. The COP-based build-up insulation material has shown outstanding performance; low tangent loss (0.0045 at 5 GHz), 4 um/4 um in L/S with ultra smooth surface for copper plating (Ra < 100 nm), copper peel strength (7 N/cm), and low CTE (17 ppm/deg.C). It has also been found that the COP-based material demonstrates a wide process window for semi-additive process (SAP) that could help ensure easy manufacturing of interposer substrates besides the outstanding performance. For instance, as the material has strong chemical resistance against desmear solution, it does not significantly alter/damage surface roughness, plated copper peel strength, and via morphology. The newly developed build-up insulation material can be promising not only for bearing high electric performance to more sophisticated mobile devices, but also for contributing to high yield manufacturing thanks to easy processability, based on the new polymer, COP.

Magnetron Sputtering Yield and Relative Factors

2011 ◽  
Vol 361-363 ◽  
pp. 1655-1663 ◽  
Author(s):  
Li Feng Wang ◽  
Ze Yan Wu ◽  
Zhi Jun Meng
Keyword(s):  
Thin Film ◽  
Magnetron Sputtering ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Target Material ◽  
Angle Of Incidence ◽  
Magnetron Sputter Deposition ◽  
Sputtering Yield ◽  
Energy And Momentum ◽  
Relative Factors

In this work, we mainly summarize the influence of the ion bombardment cathode (target) and relative factors of magnetron sputtering yield in production thin film. Magnetron sputter deposition permits a much wider selection of film materials, produces films with higher purity and better controlled composition, provides films with greater adhesive strength and homogeneity, and permits better control of deposit thickness. Unlike most other work described about sputtering yield, sputtering for thin-film production is performed using the plasma rather than a focused ion beam. When an ion with the energy hits a surface of the target, a small fraction of the energy and momentum of the incoming ion will, through lattice collisions, be reversed and may cause ejection of surface atoms (sputtering). The average number of the atoms ejected from the cathode surface per incident ion is called the sputtering yield. The sputtering yield varies with the target material, the kind of impinging ion, and the energy of that ion. At a given ion energy, The sputtering yield increases with increasing angle of incidence up to a maximum at an angle between 55 ° and 85 ° with respect to the surface normal [1, 3].

Advanced U–Np–Pu fuel to achieve long-life core in heavy water reactor

1999 ◽  
Vol 26 (15) ◽  
pp. 1319-1329 ◽  
Author(s):  
K. Nikitin ◽  
M. Saito ◽  
V. Artisyuk ◽  
A. Chmelev ◽  
V. Apse
Keyword(s):  
Heavy Water ◽  
Water Reactor ◽  
Heavy Water Reactor ◽  
Long Life

A search for evidence of cold fusion in the direct implantation of palladium and indium with deuterium

1989 ◽  
Vol 67 (6) ◽  
pp. 624-631 ◽  
Author(s):  
J. J. G. Durocher ◽  
D. M. Gallop ◽  
C. B. Kwok ◽  
M. S. Mathur ◽  
J. K. Mayer ◽  
...  
Keyword(s):  
Heavy Water ◽  
Cross Sections ◽  
Cold Fusion ◽  
Target Material ◽  
Surface Region ◽  
Neutron Production ◽  
High Concentration ◽  
Low Energies ◽  
University Of Manitoba ◽  
The University

A high concentration of deuterium atoms was implanted into palladium and indium targets by means of a 60 keV, 100 μA [Formula: see text] beam. The motivation was to simulate the Utah electrolysis experiment in a nonequilibrium situation not involving heavy water as the intermediate material. The assumption was that the formation of a high concentration of deuterium nuclei in the surface region of the target material was a prerequisite for the demonstration of the so-called "cold fusion" effect. In experiments performed at the Accelerator Centre of the University of Manitoba, significant neutron production was observed for palladium and indium targets into which an excess of 1019 deuterons were implanted. Despite some initial surprise at the flux of neutrons generated at such low energies, the numbers observed seem consistent with known fusion cross sections and warm fusion calculations.

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