New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages

2012 ◽  
Vol 2012 (1) ◽  
pp. 000991-000997 ◽  
Author(s):  
Yohei Tateishi ◽  
Makoto Fujimura ◽  
Takashi Iga ◽  
Toshihiko Jimbo
Keyword(s):  
Mobile Devices ◽  
Transmission Loss ◽  
Coefficient Of Thermal Expansion ◽  
Peel Strength ◽  
High Yield ◽  
Process Window ◽  
Tangent Loss ◽  
Film Material ◽  
Insulation Material ◽  
5 Ghz

A variety of mobile devices such as smart phones, ultra thin laptops, and tablet PCs have been introduced to the world wide market, and the demands are gaining momentum. In technological perspectives, the trend is going to increased amount of data transfer and further miniaturization of the devices for more comfortable browsing and convenience. With this trend, a build-up insulation film material that plays an important role in interposer substrates for semiconductor packaging, is required to have higher performance to cover 1) low transmission loss, 2) extremely small line and space (L/S) with an ultra-smooth copper surface, and 3) low coefficient of thermal expansion (CTE). It has been very challenging to develop build-up film materials to meet all requirements. We have developed a new build-up insulation film material based on a unique polymer, cyclo-olefin polymer (COP), which has much lower moisture absorption, Dk, and Df than standard epoxy-based materials. The COP-based build-up insulation material has shown outstanding performance; low tangent loss (0.0045 at 5 GHz), 4 um/4 um in L/S with ultra smooth surface for copper plating (Ra < 100 nm), copper peel strength (7 N/cm), and low CTE (17 ppm/deg.C). It has also been found that the COP-based material demonstrates a wide process window for semi-additive process (SAP) that could help ensure easy manufacturing of interposer substrates besides the outstanding performance. For instance, as the material has strong chemical resistance against desmear solution, it does not significantly alter/damage surface roughness, plated copper peel strength, and via morphology. The newly developed build-up insulation material can be promising not only for bearing high electric performance to more sophisticated mobile devices, but also for contributing to high yield manufacturing thanks to easy processability, based on the new polymer, COP.

Low Dk and Df Photosensitive Insulation Material for Low Transmission Loss Packages

2018 ◽  
Vol 2018 (1) ◽  
pp. 000415-000418 ◽  
Author(s):  
Shinichiro Abe ◽  
Kazuyuki Mitsukura ◽  
Yuki Imazu ◽  
Masaya Toba ◽  
Takashi Masuko ◽  
...  
Keyword(s):  
Transmission Lines ◽  
High Speed ◽  
Transmission Loss ◽  
Low Cost ◽  
Peel Strength ◽  
Insulation Material ◽  
Strip Line ◽  
High Frequency Signal ◽  
Line Space ◽  
Lower Loss

Abstract The interposer or fan-out packaging technology with ultra-fine line/space and high frequency signal has been required in order to achieve high speed interconnection between chips with low cost. In this paper, we have newly developed low Dk and Df photosensitive insulation material. The additional features of the developed materials are very low moisture absorptivity less than 0.3 wt%, low anion impurities and high resistance to hydrolysis. The micro-strip line was fabricated to evaluate the influence of developed material. The insertion loss from transmission lines on Material C shows much lower loss than the conventional reference material at higher frequencies. The peel strength to the sputtered Ti and Cu is over 0.7 kN/m. The material also demonstrated SAP fabrication compatibility with fine circuitry and passed insulation reliability by biased-HAST showing no copper migration measured by EDX.

Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness

2011 ◽  
Vol 2011 (1) ◽  
pp. 000813-000819
Author(s):  
Eita HORIKI ◽  
Isao SUZUKI ◽  
Toshiaki TANAKA ◽  
Akihiro UENISHI ◽  
Hiroshi KOUYANAGI
Keyword(s):  
Surface Roughness ◽  
Dielectric Loss ◽  
Loss Tangent ◽  
Dielectric Loss Tangent ◽  
High Frequency ◽  
Transmission Loss ◽  
Coefficient Of Thermal Expansion ◽  
Electrical Insulation ◽  
Insulation Material ◽  
Low Dielectric

With the increasing speed of information and communication equipments in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there is an increasing need for materials to have low-CTEs (Coefficient of Thermal Expansion) so as to ensure highly reliable substrates. With ou formulation technology, we have developed a next-generation film-shaped build-up electrical insulation material compatible with high-frequency signal transmission by using a composition of practical thermosetting epoxy resin, which has realized both a low-dielectric loss tangent and at the same time, a low-CTE. In addition, this material can show a low-surface roughness after the film desmear process. It is thus expected to help reduce not only dielectric loss by means of a low-dielectric loss tangent, but also conductor loss caused by the skin effect, and will promote fine line formation by means of SAP (Semi Additive Process).

Cryogenic thermal insulating and mechanical properties of rigid polyurethane foams blown with hydrofluoroolefin: Effect of perfluoroalkane

2021 ◽  
pp. 0021955X2110626
Author(s):  
Tae Seok Kim ◽  
Yeongbeom Lee ◽  
Chul Hyun Hwang ◽  
Kwang Ho Song ◽  
Woo Nyon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Cell Size ◽  
Thermal Insulation ◽  
Coefficient Of Thermal Expansion ◽  
Lower Surface ◽  
Polyurethane Foams ◽  
Insulation Material ◽  
Pu Foams

The effect of perfluoroalkane (PFA) on the morphology, thermal conductivity, mechanical properties and thermal stability of rigid polyurethane (PU) foams was investigated under ambient and cryogenic conditions. The PU foams were blown with hydrofluorolefin. Morphological results showed that the minimum cell size (153 μm) was observed when the PFA content was 1.0 part per hundred polyols by weight (php). This was due to the lower surface tension of the mixed polyol solution when the PFA content was 1.0 php. The thermal conductivity of PU foams measured under ambient (0.0215 W/mK) and cryogenic (0.0179 W/mK at −100°C) conditions reached a minimum when the PFA content was 1.0 php. The low value of thermal conductivity was a result of the small cell size of the foams. The above results suggest that PFA acted as a nucleating agent to enhanced the thermal insulation properties of PU foams. The compressive and shear strengths of the PU foams did not appreciably change with PFA content at either −170°C or 20°C. However, it shows that the mechanical strengths at −170°C and 20°C for the PU foams meet the specification. Coefficient of thermal expansion, and thermal shock tests of the PU foams showed enough thermal stability for the LNG carrier’s operation temperature. Therefore, it is suggested that the PU foams blown by HFO with the PFA addition can be used as a thermal insulation material for a conventional LNG carrier.

scholarly journals Kajian Eksperimental Koefisien Redaman Akustik Bahan Pelapis Plat Dek Kapal

2018 ◽  
Vol 3 (1) ◽  
pp. 41
Author(s):  
Wibowo Harso Nugroho ◽  
Nanang J.H. Purnomo ◽  
Hardi Zen ◽  
Andi Rahmadiansah
Keyword(s):  
Absorption Coefficient ◽  
High Frequency ◽  
Transmission Loss ◽  
Base Material ◽  
Sound Insulation ◽  
Insulation Material ◽  
Base Materials ◽  
Specimen Material ◽  
Ship Classification ◽  
Technical Assessment

With the increasingly strict requirements of the ship classification bureau for permissible noise limits to allow passengers and crew to be more comfortable and secure a technical assessment is required to address the characteristics of the noise. A noise beyond the standard allowed in the vessel can be a problem to the ship operators. This noise problem will greatly affects the crews' comfort and passengers. One method to reduce the noise on a ship is to use sound insulation. This paper describes the method for determining the absorption coefficient α and the transmission loss (TL) through an acoustic test of a concrete insulation in the laboratory. The test was conducted by using the method of impedance tube where a speciment response measured by a microphone. In general, the properties of this insulation material remains as the main base material which is concrete. it has been found that the transmission loss value (TL) is in the range of 10 - 50 dB whereas for the base material the concrete is around 22 - 49 dB but the absorption coefficient α of the specimen material is much higher than the material of the base material especially in high frequency, which ranges from 0.15 to 0.97, whereas for concrete base materials have absorbent coefficient α ranges from 0.01 to 0.02.

Development of High Density RDL Technologies for Panel Level Processing

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000284-000313
Author(s):  
Lars Böttcher ◽  
S. Karaszkiewicz ◽  
F. Schein ◽  
R. Kahle ◽  
A. Ostmann
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
High Density ◽  
Organic Films ◽  
High Yield ◽  
Wafer Level ◽  
Final Size ◽  
Process Yield ◽  
Cu Pillar ◽  
Thin Organic Films ◽  
Advanced Packaging

Advanced packaging technologies like wafer-level fan-out and 3D System-in-Packages (SIPs) are rapidly penetrating the market of electronic components. A recent trend to reduce cost is the extension of processes to large manufacturing formats, called Panel Level Packaging (PLP). In a consortium of German partners from industry and research advanced technologies for PLP are developed. The project aims for an integrated process flow for SIPs with chips embedded into an organic laminate matrix. At first dies with Cu pillar structures are placed into openings of a laminate frame layer with very low coefficient of thermal expansion (CTE). They are embedded by vacuum lamination of thin organic films, filling the very small gap down to 15 μm between chips and frame. The frame provides alignment marks for a local registration of following processes. The ridged frame limits die shift during embedding and gives a remarkable handling robustness. Developments are initially performed on a 305×256mm2 panel format, aiming for a final size of 610×615 mm2. On the top side of embedded chips, a 20μm dielectric film is applied. The goal is to avoid additional via formation and to realize a direct connection between the Cu pillar of the die and the RDL The RDL formation is based on semi-additive processing. Therefore a Ti or TiW barrier and Cu seed layer is sputtered. Subsequently a 7μm photoresist is applied and exposed by a newly developed Direct Imaging (DI) system. Lines and spaces of 4μm were achieved with high yield. In the following, Cu is simultaneously electroplated for the via contacts and interconnects traces. Finally, the photo resist is stripped and the TiW barrier and Cu seed layers are etched. The goal of the development is to provide a technology for a high-density RDL formation on large panel sizes. The paper will discuss the new developments in detail, e.g. the influence of most significant process parameters, like lithographical resolution, minimum via diameter and the placement and alignment accuracy on overall process yield.

Advanced Build-up Materials for High Speed Transmission Application

2018 ◽  
Vol 2018 (1) ◽  
pp. 000305-000309 ◽  
Author(s):  
Shiro Tatsumi ◽  
Shohei Fujishima ◽  
Hiroyuki Sakauchi
Keyword(s):  
High Speed ◽  
Printed Circuit Boards ◽  
Transmission Loss ◽  
Coefficient Of Thermal Expansion ◽  
Strip Line ◽  
Circuit Boards ◽  
Additive Process ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Transmission Speed

Abstract Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. Our insulation materials are used in a semi-additive process (SAP) with low dielectric loss tangent, smooth resin surface after desmear, and good insulation reliability. Actually, the transmission loss of strip line substrates and Cu surface roughness impact on transmission loss were measured using our materials. Furthermore, low dielectric molding film with low coefficient of thermal expansion (CTE) and low Young's modulus are introduced.

Microstructure and performance characteristics of acoustic insulation materials from post-consumer recycled denim fabrics

2020 ◽  
pp. 152808372094074
Author(s):  
Shafiqul Islam ◽  
Magdy El Messiry ◽  
Partha Pratim Sikdar ◽  
Joshua Seylar ◽  
Gajanan Bhat
Keyword(s):  
Transmission Loss ◽  
Value Added ◽  
Areal Density ◽  
Vital Role ◽  
Sound Insulation ◽  
Insulation Material ◽  
Human Beings ◽  
Insulation Materials ◽  
Sustainable Products ◽  
Acoustic Insulation

One of the key issues of the 21st century is to reduce the rate of continuously increasing environmental pollution from waste generated by human beings. Use of recycled materials and environmentally friendly approaches to manufacturing can be a good way to deal with these challenges. Similarly, sound pollution has been increasing at an alarming rate due to industrialization and modernization. Use of acoustic insulation materials produced from recycled textile waste can play a vital role in reduction of sound pollution while simultaneously helping reduce municipal solid waste. The goal of this study was to evaluate the recycling of used apparels to produce commercially feasible sustainable products using nonwoven fabrication techniques with a biodegradable thermoplastic binder fiber for possible use as acoustic insulation panels. Recycled denim fibers were used with Sorona® or a PLA binder fiber to successfully produce sound insulation with good performance properties. Maximum transmission loss of about 24 dB and transmission coefficient close to zero at around 1000 Hz were observed. The data indicated that there is a direct correlation between loss of sound transmission with increase in thickness, areal density and decrease in air permeability. When compared with commercially available acoustic insulation material (gypsum board), these products had better insulation properties, indicating that recycled textile products can be used to produce such value-added materials, giving them another useful life before safely disposing in composting environments.

Optimization of mechanical properties of thin free-standing metal films for RF-MEMS

2004 ◽  
Vol 820 ◽  
Author(s):  
Jaap M.J. den Toonder ◽  
Auke R. van Dijken
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Yield Strength ◽  
Rf Mems ◽  
High Yield ◽  
Film Material ◽  
X Ray Diffraction ◽  
Free Standing ◽  
Aluminum Films ◽  
Materials Used

AbstractThe mechanical properties of the thin film materials used in RF-MEMS are crucial for the reliability and proper functioning of the devices. In this paper we study a large number of aluminum alloys as possible RF-MEMS thin film materials. The yield strength and creep properties are measured using nano-indentation. The results show that the mechanical properties of thin aluminum films can be improved substantially by alloying elements. Of the alloys studied in this paper, AlCuMgMn in particular seems quite promising as a thin film material for RF MEMS, having both high yield strength and little creep. Using X-ray diffraction and electron microscopy, the observed effects are partly explained.

scholarly journals A Low Profile Wideband Log Periodic Microstrip Antenna Design for C-Band Applications

2019 ◽  
Vol 8 (2) ◽  
pp. 48-52 ◽  
Author(s):  
M. Yerlikaya ◽  
S. S. Gültekin ◽  
D. Uzer
Keyword(s):  
Dielectric Constant ◽  
Microstrip Antenna ◽  
Microstrip Line ◽  
Ground Plane ◽  
Antenna Design ◽  
Tangent Loss ◽  
Low Profile ◽  
Measurement Results ◽  
Simulation Results ◽  
5 Ghz

In this study, a wideband low profile microstrip antenna design for C-band applications is presented. The proposed antenna consists of a monopol log periodic patch in the equilateral triangular dimensions with the microstrip line fed and a rectangular ground plane. The antenna has 9×19.8 mm2 overall size, thickness of 1.6 mm and 4.3 dielectric constant. According to the simulation results, the proposed antenna has a very wide bandwidth while operating in the frequency band of 4.25-7.95 GHz and 5 GHz resonance frequency. The proposed antenna was also prototyped on FR4 substrate with the 0.02 tangent loss and the measurement results were quite similar by the simulated results.

scholarly journals Assessment of the Physical, Mechanical and Acoustic Properties of Arundo donax L. Biomass in Low Pressure and Temperature Particleboards

Polymers ◽  
2020 ◽  
Vol 12 (6) ◽  
pp. 1361
Author(s):  
Maria Teresa Ferrandez-García ◽  
Antonio Ferrandez-Garcia ◽  
Teresa Garcia-Ortuño ◽  
Clara Eugenia Ferrandez-Garcia ◽  
Manuel Ferrandez-Villena
Keyword(s):  
Particle Size ◽  
Absorption Coefficient ◽  
Transmission Loss ◽  
Raw Material ◽  
Acoustic Properties ◽  
Giant Reed ◽  
Sound Insulation ◽  
New Mineral ◽  
Particle Sizes ◽  
Insulation Material

Traditionally, plant fibres have been used as a raw material for manufacturing construction materials; however, in the last century, they have been replaced by new mineral and synthetic materials with manufacturing processes that consume a large amount of energy. The objective of this study was to determine the mechanical, physical and acoustic properties of panels made from giant reed residues. The article focuses on evaluating the acoustic absorption of the boards for use in buildings. The materials used were reed particles and urea–formaldehyde was used as an adhesive. The panels were produced with three particle sizes and the influence that this parameter had on the properties of the board was evaluated. To determine the absorption coefficient, samples were tested at frequencies ranging from 50 to 6300 Hz. The results showed that the boards had a medium absorption coefficient for the low and high frequency range, with significant differences depending on the particle size. The boards with 2–4 mm particles could be classified as Class D sound absorbers, while boards with particle sizes of 0.25–1 mm showed the greatest sound transmission loss. Unlike the acoustic properties, the smaller the particle size used, the better the mechanical properties of the boards. The results showed that this may be an appropriate sound insulation material for commercial use.

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