The electrical resistivity of gold films

We present measurements of the d.c. electrical resistance of three classes of pure epitaxial gold films in the thickness range 30 to 900 nm. The combination of diverse morphological techniques with temperature-dependent data from 2 to 300 K enables us to apply a new theory based on those of Mayadas and Shatzkes for grain-boundary scattering, and of Soffer for surface scattering. Gold, evaporated and annealed on mica substrates, produced (111) films which gave a mean microscopic surface roughness to Fermi wavelength ratio, r, of 0.05 and a grain-boundary reflexion coefficient, Rg, of 0.45. On KBr substrates, samples, prepared similarly, formed two distinct types of (100) film. Use of reflexion high energy electron diffraction and electron microscopy showed that the grain structure of these types of film differed; however, both gave an r of 0.1. An R g of 0.10 was determined for one type but remained unknown for the other. Our results show how previous workers, often relying on the validity of Fuchs’s theory and the misapplication thereof, have failed to present convincing evidence for specular surface scattering. We demonstrate the necessity for, experimentally, morphological observations and measurements over a wide temperature range, and, theoretically, the use of a method that combines the effects of both grain-boundary and angular-dependent surface scattering.

Author(s):  
Z. Horita ◽  
D. J. Smith ◽  
M. Furukawa ◽  
M. Nemoto ◽  
R. Z. Valiev ◽  
...  

It is possible to produce metallic materials with submicrometer-grained (SMG) structures by imposing an intense plastic strain under quasi-hydrostatic pressure. Studies using conventional transmission electron microscopy (CTEM) showed that many grain boundaries in the SMG structures appeared diffuse in nature with poorly defined transition zones between individual grains. The implication of the CTEM observations is that the grain boundaries of the SMG structures are in a high energy state, having non-equilibrium character. It is anticipated that high-resolution electron microscopy (HREM) will serve to reveal a precise nature of the grain boundary structure in SMG materials. A recent study on nanocrystalline Ni and Ni3Al showed lattice distortion and dilatations in the vicinity of the grain boundaries. In this study, HREM observations are undertaken to examine the atomic structure of grain boundaries in an SMG Al-based Al-Mg alloy.An Al-3%Mg solid solution alloy was subjected to torsion straining to produce an equiaxed grain structure with an average grain size of ~0.09 μm.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
Brian Ralph ◽  
Barlow Claire ◽  
Nicola Ecob

This brief review seeks to summarize some of the main property changes which may be induced by altering the grain structure of materials. Where appropriate an interpretation is given of these changes in terms of current theories of grain boundary structure, and some examples from current studies are presented at the end of this paper.


1993 ◽  
Vol 312 ◽  
Author(s):  
Richard Mirin ◽  
Mohan Krishnamurthy ◽  
James Ibbetson ◽  
Arthur Gossard ◽  
John English ◽  
...  

AbstractHigh temperature (≥ 650°C) MBE growth of AlAs and AlAs/GaAs superlattices on (100) GaAs is shown to lead to quasi-periodic facetting. We demonstrate that the facetting is only due to the AlAs layers, and growth of GaAs on top of the facets replanarizes the surface. We show that the roughness between the AlAs and GaAs layers increases with increasing number of periods in the superlattice. The roughness increases to form distinct facets, which rapidly grow at the expense of the (100) surface. Within a few periods of the initial facet formation, the (100) surface has disappeared and only the facet planes are visible in cross-sectional transmission electron micrographs. At this point, the reflection high-energy electron diffraction pattern is spotty, and the specular spot is a distinct chevron. We also show that the facetting becomes more pronounced as the substrate temperature is increased from 620°C to 710°C. Atomic force micrographs show that the valleys enclosed by the facets can be several microns long, but they may also be only several nanometers long, depending on the growth conditions.


1996 ◽  
Vol 441 ◽  
Author(s):  
Robert A. Bellman ◽  
Rishi Raj

AbstractSingle crystal heteroepitaxial ferroelectric films are desired for non-linear optical applications to maximize the electro-optic coefficient and minimize waveguide losses. In this study, lithium tantalate films were deposited on (0001) sapphire from lithium hexaethoxytantalate by chemical beam epitaxy. Characterization showed that films had nearly stoichiometric composition, epitaxial orientation, and a high degree of crystalline perfection. However, the films exhibited high optical waveguide losses. Additional characterization by TEM revealed that the films had a two dimensional grain structure with epitaxial variants related by translation and a twin orientation to the substrate. To better understand the nature of the heteroepitaxial growth of lithium tantalate on (0001) sapphire, a model was developed to explain the observed epitaxial orientations, misfit dislocation networks, and grain boundary structures of lithium tantalate on (0001) sapphire.


Metals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 159
Author(s):  
Nicholas Olynik ◽  
Bin Cheng ◽  
David J. Sprouster ◽  
Chad M. Parish ◽  
Jason R. Trelewicz

Exploiting grain boundary engineering in the design of alloys for extreme environments provides a promising pathway for enhancing performance relative to coarse-grained counterparts. Due to its attractive properties as a plasma facing material for fusion devices, tungsten presents an opportunity to exploit this approach in addressing the significant materials challenges imposed by the fusion environment. Here, we employ a ternary alloy design approach for stabilizing W against recrystallization and grain growth while simultaneously enhancing its manufacturability through powder metallurgical processing. Mechanical alloying and grain refinement in W-10 at.% Ti-(10,20) at.% Cr alloys are accomplished through high-energy ball milling with transitions in the microstructure mapped as a function of milling time. We demonstrate the multi-modal nature of the resulting nanocrystalline grain structure and its stability up to 1300 °C with the coarser grain size population correlated to transitions in crystallographic texture that result from the preferred slip systems in BCC W. Field-assisted sintering is employed to consolidate the alloy powders into bulk samples, which, due to the deliberately designed compositional features, are shown to retain ultrafine grain structures despite the presence of minor carbides formed during sintering due to carbon impurities in the ball-milled powders.


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