Variational thermodynamic and Finite Element analysis models of the Metal-Oxide-Semiconductor Capacitor

Author(s):  
John Rose Santiago ◽  
Krunal V. Patel ◽  
Md A Sattar ◽  
Norman G. Gunther ◽  
Mahmudur Rahman
2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Songlin Li ◽  
Min Zhang ◽  
Hai Wang

AbstractIn recent years, finite element analysis is increasingly adopted to simulate the mechanism of metal oxide semiconductor (MOS) resistive gas sensors. In this article, the chemical reaction engineering module in the COMSOL Multiphysics tool is used to describe the dynamic equilibrium process of oxygen ions in the sensor. The boundary conditions of temperature transfer, conductivity model, and mass transfer are applied to simulate the convection, diffusion, and penetration processes. The response of the sensor at different temperatures (445 K–521 K) and different target gas concentrations (1–500 ppm) is simulated. In this paper, the dynamic model of oxygen ions is used creatively as a bridge between gas concentration and sensor response instead of the traditional direct parameter fitting method. The simulated result of the surface oxygen ion control and permeability control model of the MOS gas sensor shows a good agreement with the real sensor. For explaining the principle of metal oxide semiconductor gas sensors simulations has been performed on COMSOL Multiphysics software. The proposed method in this paper is based on the underlying transfer logic of the sensor signal, it is expected to predict the sensor signal and assist the sensor design.


Author(s):  
Dong Gun Kim ◽  
Cheol Hyun An ◽  
Sanghyeon Kim ◽  
Dae Seon Kwon ◽  
Junil Lim ◽  
...  

Atomic layer deposited TiO2- and Al2O3-based high-k gate insulator (GI) were examined for the Ge-based metal-oxide-semiconductor capacitor application. The single-layer TiO2 film showed a too high leakage current to be...


1999 ◽  
Author(s):  
Rebecca Cragun ◽  
Larry L. Howell

Abstract Thermomechanical in-plane microactuators (TIMs) have been designed, modeled, fabricated, and tested. TIMs offer an alternative to arrays of smaller thermal actuators to obtain high output forces. The design is easily modified to obtain the desired output force or deflection for specific applications. The operational principle is based on the symmetrical thermal expansion of variable cross sections of the surface micromachined microdevice. Sixteen configurations of TIMs were fabricated of polysilicon. Finite element analysis models were used to predict the deflection and output force for the actuators. Experimental results were also recorded for all sixteen configurations, including deflections and output forces up to 20 micron and 35 dyne.


2019 ◽  
Vol 467-468 ◽  
pp. 1161-1169 ◽  
Author(s):  
Min Baik ◽  
Hang-Kyu Kang ◽  
Yu-Seon Kang ◽  
Kwang-Sik Jeong ◽  
Changmin Lee ◽  
...  

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