The thermal conductivity of solder joint material with plastic core

2005 ◽  
Author(s):  
A. Hasegawa ◽  
M. Okuda ◽  
N. Okinaga
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Joint Material

scholarly journals The Thermal Conductivity of Solder Joint Material with Plastic Core

2005 ◽  
Vol 8 (2) ◽  
pp. 140-143
Author(s):  
Masaki OKUDA ◽  
Kiyoto MATSUSHITA ◽  
Nobuyuki OKINAGA
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Joint Material

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

2011 ◽  
Author(s):  
Kanji Takagi ◽  
Masaki Wakabayashi ◽  
Junichi Inoue ◽  
Qiang Yu ◽  
Takahiro Akutsu
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Rupture Life ◽  
Metal Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Insulating Layer ◽  
Heating Device ◽  
Propagation Analysis ◽  
Free Solder

This paper proposes the high reliable design method for lead-free solder joint on metal substrate on chip component. First, the crack propagation analysis method for estimating rupture life of solder joint was constructed. And then, the effect of material properties of insulating layer on metal substrate and solder joint shape for rupture life of solder joint was evaluated using crack propagation analysis. As the result, the relation between young’s modulus of insulating layer and rupture life was indicated quantitatively. Also, the relation of filet length for rupture life of solder joint was evaluated. Secondary, evaluation method of heat dissipation for metal substrate was proposed. Because thermal conductivity of insulating layer affects temperature rise of heating device. And, the relation between thermal conductivity of insulating layer and temperature rise of heating device was indicated.

Cu Core Column Application for Fine Pitch 3D Mounting

2019 ◽  
Vol 2019 (1) ◽  
pp. 000338-000343 ◽  
Author(s):  
Hiroki SUDO ◽  
Daisuke SOMA ◽  
Hiroshi OKADA
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stress ◽  
Melting Behavior ◽  
Core Material ◽  
Cylindrical Shape ◽  
Next Generation ◽  
Fine Pitch ◽  
Solder Balls ◽  
Core Column ◽  
Joint Material

Abstract Cu core columns, a cylindrical-shaped copper core material with Ni and solder plating, are attracting attentions as next generation joint material instead of normal solder balls, Cu core balls, and even Cu plating pillars. Cu core columns have the ability to control and maintain a consistent stand-off height, and can achieve remarkable electric and thermal conductivity because of excellent physical properties of Cu. However, it is unclear whether it can be mounted stably like normal solder balls because of its cylindrical shape. Therefore, in this paper, we set our goal to establish Cu Core Column application for next generation bumping material by examining the melting behavior, wettability of Cu core column bumps, and reliability for drop impact and thermal stress.

Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

2019 ◽  
Vol 32 (1) ◽  
pp. 42-47 ◽  
Author(s):  
Ming-Yue Xiong ◽  
Liang Zhang ◽  
Peng He ◽  
Wei-Min Long
Keyword(s):  
Solder Joint ◽  
Optimization Design ◽  
Equivalent Stress ◽  
Great Influence ◽  
Chip Thickness ◽  
Von Mises Stress ◽  
Substrate Thickness ◽  
Original Design ◽  
Content Type ◽  
Joint Material

Purpose The transistor circuit based on Moore's Law is approaching the performance limit. The three-dimensional integrated circuit (3-D IC) is an important way to implement More than Moore. The main problems in the development of 3-D IC are Joule heating and stress. The stresses and strains generated in 3-D ICs will affect the performance of electronic products, leading to various reliability issues. The intermetallic compound (IMC) joint materials and structures are the main factors affecting 3-D IC stress. The purpose of this paper is to optimize the design of the 3-D IC. Design/methodology/approach To optimize the design of 3-D IC, the numerical model of 3-D IC was established. The Taguchi experiment was designed to simulate the influence of IMC joint material, solder joint array and package size on 3-D IC stress. Findings The simulation results show that the solder joint array and IMC joint materials have great influence on the equivalent stress. Compared with the original design, the von Mises stress of the optimal design was reduced by 69.96 per cent, the signal-to-noise ratio (S/N) was increased by 10.46 dB and the fatigue life of the Sn-3.9Ag-0.6Cu solder joint was increased from 415 to 533 cycles, indicating that the reliability of the 3-D IC has been significantly improved. Originality/value It is necessary to study the material properties of the bonded structure since 3-D IC is a new packaging structure. Currently, there is no relevant research on the optimization design of solder joint array in 3-D IC. Therefore, the IMC joint material, the solder joint array, the chip thickness and the substrate thickness are selected as the control factors to analyze the influence of various factors on the 3-D IC stress and design. The orthogonal experiment is used to optimize the structure of the 3-D IC.

scholarly journals The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)

2021 ◽  
Vol 11 (12) ◽  
pp. 5583
Author(s):  
Adrian Pietruszka ◽  
Paweł Górecki ◽  
Sebastian Wroński ◽  
Balázs Illés ◽  
Agata Skwarek
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Bipolar Transistors ◽  
Thermal Parameters ◽  
Temperature Profiles ◽  
Insulated Gate Bipolar Transistors ◽  
Thermal Impedance ◽  
Soldering Process ◽  
Hot Air ◽  
Soldering Technology

The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 mm, covered with a 35 μm thick Cu layer, were used. A surface finish was prepared from a hot air leveling (HAL) Sn99Cu0.7Ag0.3 layer with a thickness of 1 ÷ 40 μm. IGBT transistors NGB8207BN were soldered with SACX0307 (Sn99Ag0.3Cu0.7) paste. The samples were soldered in different soldering ovens and at different temperature profiles. The thermal impedance Zth(t) and thermal resistance Rthof the samples were measured. Microstructural and voids analyses were performed. It was found that the differences for different samples reached 15% and 20% for Zth(t) and Rth, respectively. Although the ratio of the gas voids in the solder joints varied between 3% and 30%, no correlation between the void ratios and Rth increase was found. In the case of the different soldering technologies, the microstructure of the solder joint showed significant differences in the thickness of the intermetallic compounds (IMC) layer; these differences correlated well with the time above liquidus during the soldering process. The thermal parameters of IGBTs could be changed due to the increased thermal conductivity of the IMC layer as compared to the thermal conductivity of the solder bulk. Our research highlighted the importance of the soldering technology used and the thermal profile in the case of the assembly of IGBT components.

Damage mechanics characterization on the fatigue behaviour of a solder joint material

2001 ◽  
Vol 215 (8) ◽  
pp. 883-892 ◽  
Author(s):  
C. L. Chow ◽  
F Yang ◽  
H. E. Fang
Keyword(s):  
Solder Joint ◽  
Fatigue Damage ◽  
Damage Mechanics ◽  
Internal State ◽  
Damage Effect ◽  
Irreversible Processes ◽  
State Variables ◽  
Solder Material ◽  
Damage Initiation ◽  
Joint Material

This paper presents the first part of a comprehensive mechanics approach capable of predicting the integrity and reliability of solder joint material under fatigue loading without viscoplastic damage considerations. A separate report will be made to present the comprehensive damage model describing life prediction of the solder material under thermomechanical fatigue (TMF) loading. The method is based on the theory of damage mechanics, which makes possible a macroscopic description of the successive material deterioration caused by the presence of microcracks/voids in engineering materials. A damage mechanics model based on the thermodynamic theory of irreversible processes with internal state variables is proposed and used to provide a unified approach in characterizing the cyclic behaviour of a typical solder material. With the introduction of a damage effect tensor, the constitutive equations are derived to enable the formulation of a fatigue damage dissipative potential function and a fatigue damage criterion. The fatigue evolution is subsequently developed on the basis of the hypothesis that the overall damage is induced by the accumulation of fatigue and plastic damage. This damage mechanics approach offers a systematic and versatile means that is effective in modelling the entire process of material failure, ranging from damage initiation and propagation leading eventually to macrocrack initiation and growth. As the model takes into account the load history effect and the interaction between plasticity damage and fatigue damage, with the aid of a modified general-purpose finite element program, the method can readily be applied to estimate the fatigue life of solder joints under different loading conditions.

Experimental approach to thermal conductivity of macro solder joints with voids

2019 ◽  
Vol 31 (3) ◽  
pp. 181-191 ◽  
Author(s):  
Maciej Sobolewski ◽  
Barbara Dziurdzia
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Solder Joints ◽  
Copper Plate ◽  
Circuit Board ◽  
Solder Paste ◽  
Reflow Soldering ◽  
Content Type ◽  
Copper Cylinder ◽  
The Impact

Purpose The purpose of the paper is to experimentally evaluate the impact of voids on thermal conductivity of a macro solder joint formed between a copper cylinder and a copper plate by using reflow soldering. Design/methodology/approach A model of a surface mount device (SMD) was developed in the shape of a cylinder. A copper plate works as a printed circuit board (PCB). The resistor was connected to a power supply and the plate was cooled by a heat sink and a powerful fan. A macro solder joint was formed between a copper cylinder and a copper plate using reflow soldering and a lead-free solder paste SAC305. The solder paste was printed on a plate through stencils of various apertures. It was expected that various apertures of stencils will moderate the various void contents in solder joints. K-type thermocouples mounted inside cylinders and at the bottom of a plate underneath the cylinders measured the temperature gradient on both sides of the solder joint. After finishing the temperature measurements, the cylinders were thinned by milling to thickness of about 2 mm and then X-ray images were taken to evaluate the void contents. Finally the tablets were cross-sectioned to enable scanning electron microscopy (SEM) observations. Findings There was no clear dependence between thermal conductivity of solder joints and void contents. The authors state that other factors such as intermetallic layers, microcracks, crystal grain morfologyof the interface between the solder and the substrate influence on thermal conductivity. To support this observation, further investigations using metallographic methods are required. Originality/value Results allow us to assume that the use of SAC305 alloy for soldering of components with high thermal loads is risky. The common method for thermal balance calculation is based on the sum of serial thermal resistances of mechanical compounds. For these calculations, solder joints are represented with bulk SAC305 thermal conductivity parameters. Thermal conductivity of solder joints for high density of thermal energy is much lower than expected. Solder joints’ structure is not fully comparable with bulk SAC305 alloy. In experiments, the average value of the solder joint conductivity was found to be 8.1 W/m·K, which is about 14 per cent of the nominal value of SAC305 thermal conductivity.

Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint

2018 ◽  
Vol 8 (10) ◽  
pp. 1769-1776 ◽  
Author(s):  
Aravindhan Surendar ◽  
Linar G. Akhmetov ◽  
Lubov K. Ilyashenko ◽  
Andino Maseleno ◽  
Vahid Samavatian
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Solder Joint ◽  
Thermal Cycle ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
Sign in / Sign up

Export Citation Format

Share Document