Improved Damage Modeling for Solder Joints under Combined Vibration and Temperature Cycling Loading

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Download Full-text

Effective Thermal-Mechanical Modeling of Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology ◽

10.1115/imece2002-39678 ◽

2002 ◽

Cited By ~ 1

Author(s):

Hsien-Chie Cheng ◽

Chin-Yin Yu ◽

Wen-Hwa Chen

Keyword(s):

Solder Joints ◽

Global Analysis ◽

Temperature Cycling ◽

Constitutive Law ◽

Modeling Technique ◽

Fe Model ◽

Fe Modeling ◽

Mechanical Behaviors ◽

Fine Mesh ◽

Modeling Strategy

An effective, two-staged global/local finite element (FE) modeling technique is proposed for characterizing the thermal-mechanical behaviors of solder joints in area array type packages under the temperature cycling. It consists of two essential features: the employment of a compact global FE model in the global analysis, and a two-staged, hybrid constitutive modeling strategy for solder materials, which is to apply the elastoplasticity constitutive law for solder joints in the global analysis during the first temperature rise while utilize the viscoelasticity in the rest of periods. To substantiate the proposed modeling technique, a large-scaled, 3-D FE model with a very fine mesh is constructed as a baseline model. The result derived from the proposed approach is then accordingly compared with those of the baseline solution. From these comparing results, it turns out that the proposed 3-D global/local FE modeling technique is an effective mean for simulating the thermal-mechanical behaviors of solder joints.

Download Full-text

Damage based PoF model of solder joints under temperature cycling and electric coupling condition

Microelectronics Reliability ◽

10.1016/j.microrel.2020.113814 ◽

2020 ◽

Vol 114 ◽

pp. 113814

Author(s):

Jiaxin Yuan ◽

Sujuan Zhang ◽

Bo Wan ◽

Guicui Fu ◽

Maogong Jiang

Keyword(s):

Solder Joints ◽

Temperature Cycling ◽

Coupling Condition ◽

Electric Coupling

Download Full-text

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

Journal of Microelectronics and Electronic Packaging ◽

10.4071/1551-4897-4.3.112 ◽

2007 ◽

Vol 4 (3) ◽

pp. 112-120 ◽

Cited By ~ 2

Author(s):

John Lau ◽

Todd Castello ◽

Dongkai Shangguan ◽

Walter Dauksher ◽

Joe Smetana ◽

...

Keyword(s):

Failure Analysis ◽

Surface Finish ◽

Failure Modes ◽

Solder Joints ◽

Temperature Cycling ◽

Lead Free ◽

Lead Free Solder ◽

Organic Solderability Preservative ◽

Solder Pastes ◽

Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

Download Full-text

Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint

International Symposium on Microelectronics ◽

10.4071/isom-2013-ta43 ◽

2013 ◽

Vol 2013 (1) ◽

pp. 000109-000114

Author(s):

Hao Zhang ◽

Qing-Sheng Zhu ◽

Zhi-Quan Liu ◽

Li Zhang ◽

Hongyan Guo ◽

...

Keyword(s):

High Temperature ◽

Solder Joint ◽

Solder Joints ◽

Temperature Cycling ◽

Growth Speed ◽

Fe Content ◽

Ball Shear Test ◽

High Temperature Storage ◽

Interfacial Reliability ◽

Temperature Storage

Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, as well as temperature cycling. The shear strength for Fe-75Ni, Fe-50Ni, and Fe-30Ni solder joints after reflow were 42.57, 53.94, 53.98 MPa respectively, which are all satisfied with the requirement of industrialization (>34.3 MPa ). High temperature storage was conducted at 150°C and 200°C respectively. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region at 150°C, and the growth speed of intermetallic compound (IMC) decreased with the increase of Fe concentration. When stored at 200°C, the thickness of IMC would reach a limitation for all these three films after 4 days, and cracks occurred at the interface between IMC and Fe-Ni layer. Temperature cycling tests revealed that SnAgCu/Fe-50Ni solder joint had the lowest failure rate (less than 10%), which has the best interfacial reliability among three compositions.

Download Full-text

Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.

International Symposium on Microelectronics ◽

10.4071/isom-2011-tp6-paper3 ◽

2011 ◽

Vol 2011 (1) ◽

pp. 000409-000417 ◽

Cited By ~ 3

Author(s):

Natalja Schafet ◽

Bruno Schrempp ◽

Manfred Spraul ◽

Ulrich Becker ◽

Herbert Güttler

Keyword(s):

Solder Joints ◽

Mechanical Strain ◽

Temperature Cycling ◽

System Level ◽

Transient Temperature ◽

Snagcu Solder ◽

System Level Simulation ◽

Solder Balls ◽

Board Level ◽

Sac Solder

PBGAs with SnPb and SnAgCu (SAC) solder joints were stressed with temperature cycles on board- and system-level. A significant influence of the different solder materials on the location of the most damaged PBGA solder balls was observed in the experiment. The reason for this experimental finding was investigated and explained by FE–simulation. The simulations of the PBGAs were done on package-, board- and system-level (PCB within a metal housing). For the system level simulation a 2-step sub-model technique described in [1] was used. Through such an approach the transient PCB deformation and the transient temperature field within the ECU-housing can be incorporated into a creep simulation of the PBGA solder joints. The creep results for both SnPb and SnAgCu solder joints from the board- and system-level simulation were compared. The calculated damage factor due to the ECU-housing influence is different for PBGA with SnPb and SAC solder joints. The simulation results were validated step by step with measurements and experiments: warpage of the non-soldered PBGA, mechanical strain and temperature on the mounted PCB, crack length evaluation of all PBGA solder joints.

Download Full-text