Processing Glass Substrate for Advanced Packaging using Laser Induced Deep Etching

Author(s):  
Rafael Santos ◽  
Jean-Pol Delrue ◽  
Norbert Ambrosius ◽  
Roman Ostholt ◽  
Stephan Schmidt
2018 ◽  
Vol 2018 (1) ◽  
pp. 000264-000269 ◽  
Author(s):  
Charles Woychik ◽  
John Lauffer ◽  
David Bajkowski ◽  
Michael Gaige ◽  
Robert Edwards ◽  
...  

Abstract In recent years new applications for RF and MEMS devices require the insulating properties of glass. In order to realize these applications using a glass substrate, it becomes necessary to be able to deposit a metalized layer on both surfaces as well as create vias through the glass substrate. In this paper we will present results of glass interposers that have fine line circuitry on both sides of the substrate and that have through glass vias (TGVs). One major challenge is creating TGVs, using either electrically conductive adhesives (ECAs) or Cu plating methods, to achieve high conductivity and reliable via connections. In addition, it is important to have the capability to produce fine line metallization on the surface of the glass substrate. We employ a semi-additive plating (SAP) method to produce the fine line metallization. The combination of a robust process to create a TGV and the ability to use SAP to do fine line circuitry are the fundamental building blocks to generate advanced carriers for these new future electronic packaging applications.


Author(s):  
A. C. Faberge

Benzylamine tartrate (m.p. 63°C) seems to be a better and more convenient substrate for making carbon films than any of those previously proposed. Using it in the manner described, it is easy consistently to make batches of specimen grids as open as 200 mesh with no broken squares, and without individual handling of the grids. Benzylamine tartrate (hereafter called B.T.) is a viscous liquid when molten, which sets to a glass. Unlike polymeric substrates it does not swell before dissolving; such swelling of the substrate seems to be a principal cause of breakage of carbon film. Mass spectroscopic examination indicates a vapor pressure less than 10−9 Torr at room temperature.


Author(s):  
Takeshi Baba ◽  
Nobuki Shiozawa ◽  
Masao Hotch ◽  
Shinichi Ohno

Endosomes are vesicular or tubular organelles that play important roles in transports of receptors and receptor―bound ligands during receptor-mediated endocytosis. The mechanisms of endocytic transports from clathrin-coated pits to lysosomes have been studied by many investigators. However, few studies were reported about the interactions between endosomes and cytoskeletons. In this study, Fc-receptor-mediated endocytosis in macrophages are investigated by quick-freezing and deep-etching (QF-DE) method combined with gold-labeled immune complex and “replica scraping method”.


Author(s):  
Barry Bonnell ◽  
Carolyn Larabell ◽  
Douglas Chandler

Eggs of many species including those of echinoderms, amphibians and mammals exhibit an extensive extracellular matrix (ECM) that is important both in the reception of sperm and in providing a block to polyspermy after fertilization.In sea urchin eggs there are two distinctive coats, the vitelline layer which contains glycoprotein sperm receptors and the jelly layer that contains fucose sulfate glycoconjugates which trigger the acrosomal reaction and small peptides which act as chemoattractants for sperm. The vitelline layer (VL), as visualized by quick-freezing, deep-etching, and rotary-shadowing (QFDE-RS), is a fishnet-like structure, anchored to the plasma membrane by short posts. Orbiting above the VL are horizontal filaments which are thought to anchor the thicker jelly layer to the egg. Upon fertilization, the VL elevates and is transformed by cortical granule secretions into the fertilization envelope (FE). The rounded casts of microvilli in the VL are transformed into angular peaks and the envelope becomes coated inside and out with sheets of paracrystalline protein having a quasi-two dimensional crystalline structure.


2016 ◽  
Vol 12 (6) ◽  
pp. 4127-4133
Author(s):  
Nazmul Kayes ◽  
Jalil Miah ◽  
Md. Obaidullah ◽  
Akter Hossain ◽  
Mufazzal Hossain

Photodegradation of textile dyes in the presence of an aqueous suspension of semiconductor oxides has been of growing interest. Although this method of destruction of dyes is efficient, the main obstacle of applying this technique in the industry is the time and cost involving separation of oxides from an aqueous suspension. In this research, an attempted was made to develop ZnO films on a glass substrate by simple immobilization method for the adsorption and photodegradation of a typical dye, Remazol Red R (RRR) from aqueous solution. Adsorption and photodegradation of  RRR were performed in the presence of glass supported ZnO film. Photodegradation of the dye was carried out by varying different parameters such as the catalyst dosage, initial concentrations of RRR, and light sources. The percentage of adsorption as well as photodegradation increased with the amount of ZnO, reaches a maximum and then decreased. Maximum degradation has been found under solar light irradiation as compared to UV-light irradiation. Removal efficiency was also found to be influenced by the pre-sonication of ZnO suspension.


2018 ◽  
Vol 1 (1) ◽  
pp. 26-31 ◽  
Author(s):  
B Babu ◽  
K Mohanraj ◽  
S Chandrasekar ◽  
N Senthil Kumar ◽  
B Mohanbabu

CdHgTe thin films were grown onto glass substrate via the Chemical bath deposition technique. XRD results indicate that a CdHgTe formed with a cubic polycrystalline structure. The crystallinity of CdHgTe thin films is gradually deteriorate with increasing the gamma irradiation. EDS spectrums confirms the presence of Cd, Hg and Te elements. DC electrical conductivity results depicted the conductivity of CdHgTe increase with increasing a gamma ray dosage


Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.


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