System-Level Flip-Chip Ball Grid Array Solder Joint Reliability Assessment Under Different Methodologies and Correlation with Accelerated Thermal Cycling Experimental Data

A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, accidentally or by design, in the processing of flip chip solder bumps, or in surface mounted Ball Grid Array modules. Excessive squashing can have ramifications for subsequent processing or for joint reliability. The proposed method, while involving an extremely simple algorithm, has been found to agree well with experimental data, and is very general in its applicability.

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Solder Joint Reliability Performance of Flip Chip Molded Ball Grid Array (BGA) Package for Network/Communication Application

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456452 ◽

2006 ◽

Author(s):

Kang Eu Ong ◽

Seong Ling Too ◽

Wei Keat Loh ◽

Christopher Peralta ◽

LayLing Ong ◽

...

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Ball Grid Array ◽

Network Communication ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Bga Package ◽

Reliability Performance

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Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)

Journal of Microelectronics and Electronic Packaging ◽

10.4071/1551-4897-5.4.180 ◽

2008 ◽

Vol 5 (4) ◽

pp. 180-187

Author(s):

Sang Ha Kim ◽

Chika Kakegawa ◽

Hiroshi Tabuchi ◽

Han Park

Keyword(s):

Solder Joint ◽

Case Studies ◽

Flip Chip ◽

Compressive Force ◽

System Level ◽

Mechanical Shock ◽

Heat Spreader ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball

The major concerns posed by system-in-package (SiP) designs for network applications are the interconnection reliability between the memory plastic ball grid array (PBGA) package and the SiP module, which we refer to as 2nd-level interconnection, and between the SiP module and the system board, which we refer to as 3rd-level interconnection, induced by thermomechanical stress to the large SiP module, i.e., 55 × 55 mm2 package body size. In this paper, finite element analysis (FEA) and design of experiment (DOE) case studies were used to evaluate the 2803-pin flip chip SiP (FCSiP) and to determine the best construction of the SiP module and optimize the assembly material set. Heat spreader (lid) thickness, heat spreader material, and under-fill implementation were considered in the stress and fatigue lifetime FEA case studies and long-term solder joint reliability, which was accelerated thermal cycle (ATC) tested at operating temperatures from 0 to 100°C. Another important factor in the system-level reliability is an external heat sink, and its compressive force effect was also investigated in the ATC test. In addition, short-term mechanical reliability tests, such as the 4-point monotonic bend test based on the IPC-9702 specification and mechanical shock test based on the JESD22-B110A standard, were also evaluated for the 2803-pin FCSiP qualification. Finally, the results of these experiments were compared with the FEA data in a correlation process.

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