Finite element-based lifetime modelling of SAC solder joints in LED applications

2021 ◽  
Author(s):  
M. Shaygi ◽  
M. Li ◽  
K.J. Lang ◽  
H. Laux ◽  
B. Wunderle
Keyword(s):  
Finite Element ◽  
Solder Joints ◽  
Sac Solder

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Fatigue Crack Initiation in Solder Joints

1996 ◽  
Vol 118 (2) ◽  
pp. 41-44 ◽  
Author(s):  
Z. Zhang ◽  
Daping Yao ◽  
J. K. Shang
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Fatigue Crack ◽  
Crack Initiation ◽  
Solder Joints ◽  
Fatigue Crack Initiation ◽  
Lap Joints ◽  
Stress Cycle ◽  
Fatigue Lifetime ◽  
Peak Value

A backface strain technique is introduced to examine fatigue crack initiation in solder lap joints. The technique detects the fatigue crack initiation by monitoring the backface strain at the end of the overlap. Variation of the backface strain with the development of a crack was simulated by finite element method. The simulation indicated that the backface strain at the end of the overlap reached a peak value when a fatigue crack initiated. Experimental verification was carried out in 63Sn-37Pb solder joints. The backface strain was recorded as a function of stress cycle to demonstrate the applicability of this technique. Experimental results showed that fatigue crack initiation took about half of the fatigue lifetime of the solder joints.

Predicting Thermal Fatigue Lifetimes for SMT Solder Joints

1992 ◽  
Vol 114 (4) ◽  
pp. 472-476 ◽  
Author(s):  
J. Sauber ◽  
J. Seyyedi
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Finite Element Models ◽  
Creep Tests ◽  
Creep Equation ◽  
Joint Behavior ◽  
Creep Strains

A power-law type creep equation has been added to finite element models to calculate solder joint response to time, temperature, and stress level. The ability of the models to predict solder joint behavior was verified by running a series of creep tests. The models were then solved to determine the solder joint creep strains which occur during thermal cycling. These creep strains were used to predict the degradation of pull strength resulting from thermal cycling. More than 8,600 solder joints were thermally cycled and then individually pull tested to verify the accuracy of the method.

A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling

1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Free Edge ◽  
Time Dependent ◽  
Element Analysis ◽  
Finite Element Program ◽  
Element Program ◽  
Peel Stress

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.

Sign in / Sign up

Export Citation Format

Share Document