Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging

2010 ◽  
Author(s):  
Jian Zou ◽  
Liping Mo ◽  
Fengshun Wu ◽  
Bo Wang ◽  
Hui Liu ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Thermal Aging ◽  
Solder Joints ◽  
Cu Substrate ◽  
Kirkendall Voids

scholarly journals Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4240
Author(s):  
Qingfeng Wang ◽  
Hong Chen ◽  
Fengjiang Wang
Keyword(s):  
Interfacial Reaction ◽  
Thermal Aging ◽  
Solder Joints ◽  
Depressing Effect ◽  
Aging Condition ◽  
Obvious Effect ◽  
Cu Substrate ◽  
Zn Addition ◽  
Reliability Of Solder Joints ◽  
Interfacial Evolution

Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

2011 ◽  
Author(s):  
Wedianti Shualdi ◽  
Badariah Bais ◽  
Ibrahim Ahmad ◽  
Ghazali Omar ◽  
Aishah Isnin
Keyword(s):  
Thermal Aging ◽  
Cu Substrate

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

2007 ◽  
Vol 47 (12) ◽  
pp. 2161-2168 ◽  
Author(s):  
Weiqun Peng ◽  
Eduardo Monlevade ◽  
Marco E. Marques
Keyword(s):  
Thermal Aging ◽  
Solder Joints ◽  
Interfacial Structure ◽  
Snagcu Solder

scholarly journals Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

2015 ◽  
Vol 20 ◽  
pp. 9-14 ◽  
Author(s):  
Mohd Faizul Mohd Sabri ◽  
Suhana Binti Mohd Said ◽  
Dhafer Abdulameer Shnawah
Keyword(s):  
Solder Alloy ◽  
Cu Substrate ◽  
Spread Area

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

2011 ◽  
Vol 23 (1) ◽  
pp. 124-129 ◽  
Author(s):  
Chun Yu ◽  
Yang Yang ◽  
Kaiyun Wang ◽  
Jijin Xu ◽  
Junmei Chen ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Kirkendall Voids

Suppression of Kirkendall voiding in Sn-3.5Ag/Cu solder joints by pre-annealing process

2011 ◽  
Vol 2011 (1) ◽  
pp. 000337-000340
Author(s):  
S. H. Kim ◽  
Jin Yu
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Annealing Process ◽  
Schematic Diagram ◽  
Cu Films ◽  
Joint Reliability ◽  
Organic Impurities ◽  
Solder Reflow ◽  
Kirkendall Voids ◽  
Annealing Method

In this study, electroplated Cu films were pre-annealed at T (T = 673, 773, 873 K) for varying times. Sn-3.5Ag solder reflowed over the Cu films and subsequently aged at 150°C for 240 hrs. Effects of pre-annealing on the microstructure of Cu films, as well as contents of organic impurities incorporated in the Cu films were investigated. After solder reflow, the formation of Kirkendall voids at Cu3Sn/Cu interface was observed from SEM micrographs. Results show that the pre-annealing process significantly suppressed Kirkendall void formation in the Sn-3.5Ag/Cu solder joints. A line fraction of voids at the Cu3Sn/Cu interface was definitely suppressed in the case of 500°C and 600°C pre-annealed samples compared to as-deposited Cu sample. SIMS analyses revealed that pre-annealing reduced the level of impurities in the Cu films, especially S and C. The mechanism of suppressing Kirkendall voids at the Cu3Sn/Cu interface was presented by schematic diagram, and it could be seen that pre-annealing method has a potential to enhance solder joint reliability.

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder Joints

2010 ◽  
Vol 2010 (1) ◽  
pp. 000294-000297 ◽  
Author(s):  
S. H. Kim ◽  
Jin Yu
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Void Formation ◽  
Kirkendall Void ◽  
Fe Content ◽  
Kirkendall Voids

Ternary Sn-3.5Ag-xFe solders with varying amount of Fe; 0.1, 0.5, 1.0, and 2.0 wt. % were reacted with Cu UBM which was electroplated using SPS additive and characteristics of Kirkendall void formation at the solder joints were investigated. Results indicate that the propensity to form Kirkendall voids at the solder joint decreased with the Fe content. It showed that Fe dissolved in the Cu UBM and reduced the segregation of S atoms to the Cu3Sn/Cu interface, which suppressed the nucleation of Kirkendall voids at the interface.

scholarly journals Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

Metals ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 791 ◽  
Author(s):  
Kaipeng Wang ◽  
Fengjiang Wang ◽  
Ying Huang ◽  
Kai Qi
Keyword(s):  
Tensile Strength ◽  
Shear Strength ◽  
Low Temperature ◽  
Strain Rate ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Matrix ◽  
Interfacial Structure ◽  
Solder Alloys ◽  
Cu Substrate

Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag3Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu6Sn5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.

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