ICP Etching Process Development based on Cl2/H2 Chemistry and Adapted to Non-Thermalized InP Wafers for the Realization of High Aspect Ratio and Vertical Sidewall Deep Ridge Waveguides and Buried Heterostructures

2006 ◽  
Author(s):  
S. Guilet ◽  
S. Bouchoule ◽  
C. Jany ◽  
C.S. Corr ◽  
P. Chabert
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Process Development ◽  
Etching Process ◽  
Vertical Sidewall ◽  
Icp Etching ◽  
Ridge Waveguides

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

2008 ◽  
Author(s):  
Gang Zhao ◽  
Qiong Shu ◽  
Yue Li ◽  
Jing Chen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Inductively Coupled Plasma ◽  
Etching Rate ◽  
Sidewall Roughness ◽  
Inductively Coupled ◽  
Icp Etching ◽  
Novel Technology ◽  
Micro Parts ◽  
Etching Mask

A novel technology is developed to fabricate high aspect ratio bulk titanium micro-parts by inductively coupled plasma (ICP) etching. An optimized etching rate of 0.9 μm/min has been achieved with an aspect ratio higher than 10:1. For the first time, SU-8 is used as titanium etching mask instead of the traditional hard mask such as TiO2 or SiO2. With an effective selectivity of 3 and a spun-on thickness beyond 100 μm, vertical etching sidewall and low sidewall roughness are obtained. Ultra-deep titanium etching up to 200 μm has been realized, which is among the best of the present reports. Titanium micro-springs and planks are successfully fabricated with this approach.

Simulation and Fabrication of Novel Polymeric Tunneling Sensor by Hot Embossing Technique

2002 ◽  
Author(s):  
Tianhong Cui ◽  
Kody Varahramyan ◽  
Yongjun Zhao ◽  
Jing Wang
Keyword(s):  
Aspect Ratio ◽  
Silicon Wafer ◽  
Optimum Design ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Anodic Bonding ◽  
Glass Disk ◽  
Icp Etching ◽  
Sensor Platform ◽  
Polymer Microfabrication

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.

scholarly journals High aspect ratio lithium niobate ridge waveguides fabricated by optical grade dicing

2011 ◽  
Vol 44 (30) ◽  
pp. 305101 ◽  
Author(s):  
Nadège Courjal ◽  
Blandine Guichardaz ◽  
Gwenn Ulliac ◽  
Jean-Yves Rauch ◽  
Benattou Sadani ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Lithium Niobate ◽  
High Aspect Ratio ◽  
Ridge Waveguides

Extremely high aspect ratio GaAs and GaAs/AlGaAs nanowaveguides fabricated using chlorine ICP etching with N2-promoted passivation

2010 ◽  
Vol 21 (13) ◽  
pp. 134014 ◽  
Author(s):  
Maïté Volatier ◽  
David Duchesne ◽  
Roberto Morandotti ◽  
Richard Arès ◽  
Vincent Aimez
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Icp Etching
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