Manufacturing process development of a precision rapid tooling with high-aspect-ratio micro-sized features

2016 ◽  
Vol 47 (1) ◽  
pp. 29-36 ◽  
Author(s):  
C.-C. Kuo ◽  
B.-C. Zhuang
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Manufacturing Process ◽  
Process Development ◽  
Rapid Tooling

Methodologies for Quantifying FIB “Milling Acuity”

2009 ◽  
Author(s):  
Chad Rue
Keyword(s):  
Aspect Ratio ◽  
Real World ◽  
High Aspect Ratio ◽  
Process Development ◽  
Spot Size ◽  
Performance Tests ◽  
Imaging Resolution ◽  
Measuring Scheme ◽  
Column Performance

Abstract FIB column performance can be difficult to evaluate, and the traditional metrics of imaging resolution and minimum spot size give little indication of how a FIB system will perform its intended daily tasks. A series of supplemental FIB performance tests is proposed to quantify “milling acuity” under real-world conditions. A quantitative measuring scheme for evaluating the quality of High Aspect Ratio (HAR) vias is proposed, and an example is shown in which the HAR measuring scheme can be used for process development.

High-Aspect Ratio Planarization using Self-Leveling Materials

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002567-002586
Author(s):  
Michelle Fowler ◽  
Dongshun Bai ◽  
Curt Planje ◽  
Xie Shao
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Process Development ◽  
Polymeric Materials ◽  
Polymeric Coating ◽  
Flat Panel Displays ◽  
New Materials ◽  
Coating Materials ◽  
3D Ics ◽  
Microelectronics Industry

There are an increasing number of applications in the microelectronics industry that require materials that can fill and planarize high-aspect ratio topography. These applications call for the formation of a flat coating surface without the use of high bake temperatures or high-pressure processes. Potential device markets include MEMS, 3D-ICs, LEDs, semiconductors, flat panel displays and related microelectronic and optoelectronic devices. Various polymeric coating materials have been developed that have intrinsic self-leveling properties and are able to fill deep trenches and holes found on microelectronic substrates without forming voids. These new materials are able to reflow at modest baking temperatures (50–100 °C) and can fill high-aspect ratio features (10:1) by spin coating single or multiple layers of material over the topography. Several of these polymeric materials remain soluble in TMAH (and other aqueous bases), some are photosensitive, and all materials are compatible with industry-accepted solvents. Results from extended process development work on self-leveling polymeric materials will be discussed and comparisons made to industry-accepted practices.

Manufacturing process for high aspect ratio metallic micro parts made by electroplating on partially conductive templates

2008 ◽  
Vol 14 (9-11) ◽  
pp. 1669-1674 ◽  
Author(s):  
J. Prokop ◽  
G. Finnah ◽  
J. Lorenz ◽  
V. Piotter ◽  
R. Ruprecht ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Manufacturing Process ◽  
Micro Parts

Process Development and Optimization for 3 $\mu \text{m}$ High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level

2015 ◽  
Vol 28 (4) ◽  
pp. 454-460 ◽  
Author(s):  
Dingyou Zhang ◽  
Daniel Smith ◽  
Gopal Kumarapuram ◽  
Rudy Giridharan ◽  
Shinichiro Kakita ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Process Development ◽  
Wafer Level ◽  
Through Silicon Vias ◽  
Silicon Vias
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