Catastrophic failure of power silicon PN junctions at high temperature induced by the surface leakage reverse current

Author(s):  
V.V.N. Obreja ◽  
O. Buiu ◽  
K.I. Nuttall ◽  
C. Codreanu ◽  
M.L. Sung ◽  
...  
2014 ◽  
Vol 43 (6) ◽  
pp. 2376-2383 ◽  
Author(s):  
R. Chavez ◽  
S. Angst ◽  
J. Hall ◽  
J. Stoetzel ◽  
V. Kessler ◽  
...  

2006 ◽  
Vol 527-529 ◽  
pp. 1339-1342 ◽  
Author(s):  
Michael E. Levinshtein ◽  
Pavel A. Ivanov ◽  
Mykola S. Boltovets ◽  
Valentyn A. Krivutsa ◽  
John W. Palmour ◽  
...  

Steady-state and transient characteristics of packaged 6-kV 4H-SiC junction diodes have been investigated in the temperature range Т = 300 – 773 К. Analysis of the forward current-voltage characteristics and reverse current recovery waveforms shows that the lifetimeτ of non-equilibrium carriers in the base of the diodes steadily increases with temperature across the entire temperature interval. The rise in τ and decrease in carrier mobilities and diffusion coefficients with increasing temperature nearly compensate each other as regards their effect on the differential resistance of the diode, Rd. As a result, Rd is virtually temperature independent. An appreciable modulation of the base resistance takes place at room temperature even at a relatively small current density j of 20 A/cm2. At T = 800 K and j = 20 A/cm2, a very deep level of the base modulation has been observed. The bulk reverse current is governed by carrier generation in the space-charge region via a trap with activation energy of 1.62 eV. The surface leakage current of packaged structures does not exceed 2×10-6 А at T = 773 K and a reverse bias of 300 V.


2009 ◽  
Vol 615-617 ◽  
pp. 683-686 ◽  
Author(s):  
Ryouji Kosugi ◽  
T. Sakata ◽  
Y. Sakuma ◽  
K. Suzuki ◽  
Tsutomu Yatsuo ◽  
...  

We have fabricated the four pn-type junction TEGs (Test Element Groups) having different structure. Those TEGs are close to the double-implanted (Di) MOSFETs, step by step from the simple pn diode. Voltage-current (V-I) characteristics of the hundred TEGs having p-well structure show similar blocking characteristics of those of simple pn diodes on the same wafer. This indicates that the p-well structure itself does not cause a significant deterioration on the blocking yield. On the other hand, the yield is significantly influenced by the annealing condition for ion-implanted layer. The oxide-related hard breakdown on the JFET region dominates the blocking yield. The reach-through breakdown of the TEGs having the n+ region within each p-well becomes largely suppressed by the high-temperature and short-time annealing.


1992 ◽  
Vol 283 ◽  
Author(s):  
Sunwoo Lee ◽  
Thuong Ton ◽  
D. Zych ◽  
P. A. Dowben

ABSTRACTPlasma-enhanced chemical vapor deposited boron carbide (B1-xCx) thin films are shown to be a potential electronic material suitable for high temperature devices. The boron carbide films make excellent p-n heteroj unction diodes with /i-type silicon substrates. The B1-xCx/Si heteroj unction diodes are demonstrated to have rectifying properties at temperatures above 200°C and reverse current is strongly dependent on the energy of the band gap of the boron carbide films.


2020 ◽  
Vol 20 (2) ◽  
pp. 429-435
Author(s):  
M. Buffolo ◽  
E. Davanzo ◽  
C. De Santi ◽  
N. Trivellin ◽  
G. Meneghesso ◽  
...  

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