A Simplicial PWL Integrated Circuit Realization

2007 ◽  
Author(s):  
Martin Di Federico ◽  
Pedro Julian ◽  
Tomaso Poggi ◽  
Marco Storace
Keyword(s):  
Integrated Circuit ◽  
Circuit Realization

Oscillators, modulators, and mixers suitable for integrated circuit realization

1967 ◽  
Vol 55 (3) ◽  
pp. 438-439
Author(s):  
B.D. Anderson ◽  
W. New ◽  
R.W. Newcomb
Keyword(s):  
Integrated Circuit ◽  
Circuit Realization

Synthesis Approach for Compact VDTA Quadrature Sine-Wave Oscillators with Orthogonal Control

2019 ◽  
Vol 28 (12) ◽  
pp. 1950205
Author(s):  
Yong-An Li
Keyword(s):  
Integrated Circuit ◽  
Experimental Analysis ◽  
Current Mode ◽  
Sine Wave ◽  
Oscillation Criterion ◽  
Circuit Realization ◽  
Admittance Matrix ◽  
Transconductance Amplifier ◽  
Paper And Pencil ◽  
Synthesis Approach

From the nodal admittance matrix (NAM) expansion approach and 16 pathological patterns of the voltage differencing transconductance amplifier (VDTA), two different categories, namely sort A and sort B, of the quadrature sine-wave oscillators-employed VDTAs and grounded capacitors in the current mode are synthesized. In all, four quadrature sine-wave oscillators with two sets of quadrature current outputs are attained. Because canonic number is used for component quantity, the oscillators are appropriate to integrated circuit realization and also provide electronic, linear, and orthogonal adjustments between the oscillation criterion and frequency by means of tuning bias currents of the VDTAs. The paper-and-pencil and simulation analyses as well as experimental analysis have been carried out to check the utilized synthesis approach.

A DVCC-Based Current-Mode First-Order Universal Filter

2021 ◽  
pp. 2150305
Author(s):  
Firat Yucel
Keyword(s):  
Integrated Circuit ◽  
Current Mode ◽  
Current Conveyors ◽  
Circuit Realization ◽  
Passive Element ◽  
Pass Filter ◽  
Typical Application ◽  
First Order ◽  
Low Pass ◽  
High Output Impedance

A current-mode first-order filter configuration simultaneously providing noninverting and inverting low-pass (LP) and high-pass (HP) responses depending on passive element choice is proposed. In addition, all-pass filter (APF) responses can be easily obtained with interconnection of LP and HP output currents. The proposed filter employs only two differential voltage current conveyors, a grounded resistor and a grounded capacitor, so it is suitable for integrated circuit realization. It provides the feature of high output impedance. It does not need any passive element matching constraints. A voltage-mode oscillator based on the inverting APF is presented as a typical application. The performance of the proposed configuration is verified through many SPICE simulation and experimental test results.

scholarly journals A Novel Thermal Modeling of Through Silicon Vias in 3-D IC structures

2021 ◽  
Vol 7 ◽  
pp. 104-110
Author(s):  
Chandrashekhar Patil
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Resistance ◽  
Integrated Circuit ◽  
Literature Survey ◽  
Circuit Realization ◽  
Major Purpose ◽  
Physical Behavior ◽  
Silicon Vias

Heat mitigation is a major challenge in 3-D IC (ThreeDimensional Integrated Circuit) realization. A study of the analytical thermal behavior of the TSV (Through Silicon Via) is very important. Simple and compact yet other models were found deficient to solve this problem in the literature survey. In this paper resistance networks are used to model the heat transfer of the TSVs, in both vertical and horizontal directions, in simpler and compact models. The accuracy of such models is compared with commercially available CFD (Computational Fluid Dynamics) tool. The error of corrections between the tool and developed models are corrected by multiplication factors, resulted within 4.18% accuracy. Varying the thicknesses of a liner, filer, soldering and substrate materials are studied concerning heat transfer physical behavior of three planar TSV stacked systems. The major purpose is to incorporate both vertical and horizontal thermal resistance networks captured more accurately in heat dissipated paths. Proposed models of TSVs can be used in the active interposer simulations or in the face2face fabrication stacked methods of the 3-D IC structures.

Current-Mode First-Order Universal Filter and its Voltage-Mode Transformation

2019 ◽  
Vol 29 (09) ◽  
pp. 2050149 ◽  
Author(s):  
Bhartendu Chaturvedi ◽  
Jitendra Mohan ◽  
Atul Kumar ◽  
Kirat Pal
Keyword(s):  
Integrated Circuit ◽  
Current Mode ◽  
Matching Condition ◽  
Universal Filter ◽  
Circuit Realization ◽  
Passive Components ◽  
Mode Transformation ◽  
First Order ◽  
Voltage Mode ◽  
Circuit Technology

This paper deals with the realization of current-mode first-order universal filter based on multiple output second generation current conveyor (MO-CCII). Two MO-CCIIs, one resistor and one capacitor are used in the circuit realization. The proposed work includes additional features such as ease of cascadability, easily implementable in modern integrated circuit technology and no requirement of passive components matching condition. The additional beauty of the proposed filter structure is that all three responses can also be realized by interchanging the positions of passive components as well. Moreover, a possible transformation of the proposed current-mode type universal filter into a voltage-mode type universal filter using network transpose method is also explored. The possibility of mode transformation further expands the scope of proposed idea. The theoretical aspects are verified using cadence VIRTUOSO simulation results.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

Characterization of RF Sputtered ZnO Piezoelectric Films Using Transmission Electron Microscope

1975 ◽  
Vol 33 ◽  
pp. 86-87
Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn
Keyword(s):  
Integrated Circuit ◽  
Acoustic Waves ◽  
New Technology ◽  
Surface Acoustic Waves ◽  
Electromechanical Properties ◽  
Leading Role ◽  
Saw Devices ◽  
Transmission Electron ◽  
High Degree

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.

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