Impact of Interfacial Roughness on Tensile vs. Shear Creep Rupture of Solder Joints

2021 ◽  
Author(s):  
Abhishek Deshpande ◽  
Qian Jiang ◽  
Ahijit Dasgupta ◽  
Ulrich Becker
Keyword(s):  
Solder Joints ◽  
Creep Rupture ◽  
Shear Creep ◽  
Interfacial Roughness

Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

2011 ◽  
Vol 687 ◽  
pp. 39-43
Author(s):  
Yao Li Wang ◽  
Gai Hong Dong ◽  
Chen Yang Li ◽  
Zhi Wei Wu ◽  
Jing Sun
Keyword(s):  
Rare Earth ◽  
Solder Alloy ◽  
Interfacial Layer ◽  
Solder Joints ◽  
Rupture Life ◽  
Creep Property ◽  
Creep Rupture ◽  
Sectional Area ◽  
Cross Sectional ◽  
Snagcu Solder

Creep property is one of the most important factors to affect the reliability of soldered joints. The effect of rare earth(RE) on the creep rupture life of Sn2.5Ag0.7Cu solder joints were investigated under constant temperature and stress using creep specimens with a 1mm2cross sectional area. The results show that adding tiny RE in Sn2.5Ag0.7Cu solder alloy can effectually affect the size and configuration of the intermetallic compound (IMC) of interfacial layer. The IMC of Sn2.5Ag0.7Cu interfacial layer is thinner and its thickness is homogeneous with adding 0.1% RE, and the creep rupture life of solder joints is longest, which is apparently superior to that of Sn2.5Ag0.7Cu and commercial used Sn3.8Ag0.7Cu solder alloy.

Creep Behavior of PB-Free Solders

2001 ◽  
Author(s):  
F. Hua ◽  
C. M. Garner ◽  
H. G. Song ◽  
J. W. Morris
Keyword(s):  
Activation Energy ◽  
Creep Behavior ◽  
Solder Joints ◽  
Creep Process ◽  
Diffusion Activation Energy ◽  
Air Cooling ◽  
Shear Creep ◽  
Self Diffusion ◽  
Intermetallic Particles ◽  
Stress Levels

Abstract This study reports results of shear creep behavior of four Pb-free solders, Sn-3Ag-0.5Cu, Sn-3.5Ag, Sn-0.7Cu and Sn-10In-3.1Ag at 95θC and 130θC. At the stress levels tested, all the four solders showed the stress components close or larger than 5, typical for matrix creep. The calculated activation energies for Sn-0.7Cu, Sn-3.5Ag and Sn-3Ag-0.5Cu are from 103kJ/mol to 117kJ/mol, which are very close to the pure Sn self-diffusion activation energy (107kJ/mol). It suggested that the creep process is controlled by Sn bulk self-diffusion rate. The creep activation energy for Sn-10In-3.1Ag is higher in the range of 173–193kJ/mol. The Sn-0.7Cu, Sn-3Ag-0.5Cu and Sn-10In-3.1Ag solder joints were also prepared with two different cooling rates, 3.5θC/min. (furnace-cooling) and 2.7θC/S (air-cooling) and tested at 130θC. It was observed that faster cooled solder joints have faster creep strain rates than slower cooled solder joints at the stress levels tested for all three solders, due to the fine and even distribution of intermetallic particles.

Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

2010 ◽  
Vol 650 ◽  
pp. 91-96 ◽  
Author(s):  
Ke Ke Zhang ◽  
Yao Li Wang ◽  
Yan Li Fan ◽  
Guo Ji Zhao ◽  
Yan Fu Yan ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Solder Joints ◽  
Rupture Life ◽  
Creep Rupture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Properties ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress.

Determination of Anand Parameters From Shear Creep Tests of Lead Free Solder Joints

2021 ◽  
Author(s):  
Mohammad Ashraful Haq ◽  
Mohd Aminul Hoque ◽  
Jeffrey Suhling ◽  
Pradeep Lall
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Tests ◽  
Shear Creep ◽  
Free Solder

A Study of Sn-Pb-Re Solder

1993 ◽  
Vol 323 ◽  
Author(s):  
Zhu Ying ◽  
Fang Hongyuan ◽  
Qian Yiyu
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Creep Rupture ◽  
Solder Microstructure ◽  
Long Life

AbstractOne of the important way to improve the property of solder joints is to improve the property of solders, This paper is about a study of Sn-Pb-RE solder(RE-Rear Earth, mainly contains Ce and La). It has been shown that the final form of RE in SnPb60/40 solder is Sn-RE intermetallic compound, and a very little RE can change the solder microstructure greatly. The influence of RE on solder life of creep rupture is that Sn-Pn-RE solder has much long life than that of SnPb60/40, and the solder life increases with the increase of RE content.

scholarly journals Creep in Shear of Experimental Solder Joints

1990 ◽  
Vol 112 (2) ◽  
pp. 87-93 ◽  
Author(s):  
D. Tribula ◽  
J. W. Morris
Keyword(s):  
Thermal Fatigue ◽  
Creep Deformation ◽  
Solder Joints ◽  
Shear Strain Rate ◽  
Creep Failure ◽  
Shear Creep ◽  
Binary Eutectic ◽  
Element Addition ◽  
Fatigue Failures ◽  
Operative Temperatures

Thermal fatigue failures of solder joints in electronic devices are a great concern in the electronics industry. Since the fatigue load is often in shear the details of thermal fatigue failure in shear are of particular interest. Recent work indicates that similar failure mechanisms operate in both thermal fatigue in shear and unidirectional creep in shear. Additionally, since the operative temperatures during thermal fatigue represent high solder homologous temperatures, creep deformation is certainly involved. These factors and the relative case of conducting creep experiments encourage the study of solder joints under shear creep conditions. This work presents steady state shear creep rate vs. shear stress data for several solder compositions, including the binary eutectic alloy and Pb-Sn alloyed with small amounts of Bi, Cd, In, and Sb, in a joint configuration. These data indicate that conventional creep mechanisms operate in the temperature and shear strain rate ranges studies. Extensive microstructural information is also reported. The microstructural evolution under creep conditions indicates that the instability of the as-cast binary Pb-Sn eutectic microstructure initiates creep failure. Changes of the as-solidified microstructure with the third element addition are reported as are the microstructural responses of each of these alloys to creep deformation. The efficacy of postponing the microstructural instability with the addition of small amounts of ternary elements is discussed.

Tensile Creep of Y-Si3N4: II. Cavitation

1991 ◽  
Vol 49 ◽  
pp. 972-973 ◽  
Author(s):  
B. J. Hockey ◽  
S. M. Wiederhorn
Keyword(s):  
Silicon Nitride ◽  
Creep Rupture ◽  
Tensile Creep ◽  
Sintering Aids ◽  
Microstructural Changes

ATEM has been used to characterize three different silicon nitride materials after tensile creep in air at 1200 to 1400° C. In Part I, the microstructures and microstructural changes that occur during testing were described, and consistent with that description the designations and sintering aids for these materials were: W/YAS, a SiC whisker reinforced Si3N4 processed with yttria (6w/o) and alumina (1.5w/o); YAS, Si3N4 processed with yttria (6 w/o) and alumina (1.5w/o); and YS, Si3N4 processed with yttria (4.0 w/o). This paper, Part II, addresses the interfacial cavitation processes that occur in these materials and which are ultimately responsible for creep rupture.

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