A Study of Sn-Pb-Re Solder

1993 ◽  
Vol 323 ◽  
Author(s):  
Zhu Ying ◽  
Fang Hongyuan ◽  
Qian Yiyu
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Creep Rupture ◽  
Solder Microstructure ◽  
Long Life

AbstractOne of the important way to improve the property of solder joints is to improve the property of solders, This paper is about a study of Sn-Pb-RE solder(RE-Rear Earth, mainly contains Ce and La). It has been shown that the final form of RE in SnPb60/40 solder is Sn-RE intermetallic compound, and a very little RE can change the solder microstructure greatly. The influence of RE on solder life of creep rupture is that Sn-Pn-RE solder has much long life than that of SnPb60/40, and the solder life increases with the increase of RE content.

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

2008 ◽  
Vol 580-582 ◽  
pp. 243-246 ◽  
Author(s):  
Hiroshi Nishikawa ◽  
Akira Komatsu ◽  
Tadashi Takemoto
Keyword(s):  
Intermetallic Compound ◽  
Interfacial Reaction ◽  
Fracture Mode ◽  
Joint Strength ◽  
Solder Bump ◽  
Solder Joints ◽  
Pull Strength ◽  
Electroless Ni

The reaction between Sn-Ag (-Co) solder and electroless Ni-P plating was investigated in order to clarify the effect of the addition of Co to Sn-Ag solder on the formation of intermetallic compound (IMC) at the interface and the joint strength at the interface. Sn-Ag-Co solder was specially prepared. The results show that there is little effect of the addition of Co to the Sn-Ag solder on the IMC formation and the thickness of the IMC at the interface. For the pull strength of the solder bump joint, the addition of Co to the solder didn’t strongly affect the pull strength of the solder joints, but it affected the fracture mode of the solder joints.

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

2011 ◽  
Vol 23 (1) ◽  
pp. 124-129 ◽  
Author(s):  
Chun Yu ◽  
Yang Yang ◽  
Kaiyun Wang ◽  
Jijin Xu ◽  
Junmei Chen ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Kirkendall Voids

scholarly journals Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 936 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Paste ◽  
Shear Tests ◽  
Sac305 Solder ◽  
Epoxy Solder ◽  
The Relationship ◽  
Bonding Characteristics ◽  
Preventive Effects

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

2006 ◽  
Author(s):  
Mohd F. Abdulhamid ◽  
Cemal Basaran ◽  
Douglas C. Hopkins
Keyword(s):  
Experimental Study ◽  
Intermetallic Compound ◽  
Thermal Gradient ◽  
Solder Joints ◽  
Lead Free ◽  
Cold Side ◽  
High Thermal Gradient

The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

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