Process-based cost modeling of photonics manufacture: the cost competitiveness of monolithic integration of a 1550-nm DFB laser and an electroabsorptive modulator on an InP platform

Purpose This study aims to provide a comprehensive treatment of the various issues surrounding the concept of the cost competitiveness, competitiveness and sustainability of the hospitality industry. We also investigate how innovations in the Indian hospitality industry can optimize costs without compromising the quality of the product or the services offered. Design/methodology/approach The methodology used is mainly survey-based with the use of both structured and unstructured questionnaires. In addition, some interviews were conducted with policy-makers and academics to explore from their perspectives what might be the innovations and sustainability issues in the next decade. Findings The paper helps to identify the essential aspects of cost competitiveness, competitiveness and sustainability in the hospitality industry and to better understand if cost optimization can be accomplished simply by realigning process or cost. These issues have become very important in India in the present context of globalization. Practical implications With growing competition on a global level, the hospitality industry needs to proactively manage its internal operations and focus on reducing costs and raising service quality. In this context, the paper helps to reveal sustainable cost effective practices that are geared to today’s competitive environment. Originality/value The inspiration to write this paper arises from the recent global economic slowdown and the fact that the hospitality industry is confronted with growing competition on a global level. This study highlights how value can be created for customers by applying suitable strategies.

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Cost Modeling and Range Estimation for Top-k Retrieval in Relational Databases

Theoretical and Practical Advances in Information Systems Development ◽

10.4018/978-1-60960-521-6.ch012 ◽

2011 ◽

pp. 295-315

Author(s):

Anteneh Ayanso ◽

Paulo B. Goes ◽

Kumar Mehta

Keyword(s):

Relational Databases ◽

Estimation Method ◽

Synthetic Data ◽

Cost Modeling ◽

Data Sets ◽

Range Estimation ◽

Mapping Techniques ◽

The Cost ◽

Query Estimation ◽

Query Mapping

Relational databases have increasingly become the basis for a wide range of applications that require efficient methods for exploratory search and retrieval. Top-k retrieval addresses this need and involves finding a limited number of records whose attribute values are the closest to those specified in a query. One of the approaches in the recent literature is query-mapping which deals with converting top-k queries into equivalent range queries that relational database management systems (RDBMSs) normally support. This approach combines the advantages of simplicity as well as practicality by avoiding the need for modifications to the query engine, or specialized data structures and indexing techniques to handle top-k queries separately. This paper reviews existing query-mapping techniques in the literature and presents a range query estimation method based on cost modeling. Experiments on real world and synthetic data sets show that the cost-based range estimation method performs at least as well as prior methods and avoids the need to calibrate workloads on specific database contents.

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Cost Comparison of Panel Level and Wafer Level Fan-out Packaging

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2380-4491-2019-dpc-presentation_ta2_001 ◽

2019 ◽

Vol 2019 (DPC) ◽

pp. 000141-000164

Author(s):

Amy Lujan

Keyword(s):

Cost Reduction ◽

Cost Comparison ◽

Cost Modeling ◽

Cost Models ◽

Wafer Level ◽

Process Flow ◽

Total Cost ◽

Large Panels ◽

The Cost ◽

The Impact

In recent years, the possibility of panels replacing wafers in some fan-out applications has been a topic of interest. Questions of cost and yield continue to arise even as the industry appears to be full steam ahead. While large panels allow for more packages to be produced at once, the cost does not scale simply based on how many more packages can be generated from a panel over a wafer. This analysis begins by breaking down the types of cost and will discuss how those types of cost are impacted (or not) by the shift from wafer to panel. Activity based cost modeling is used; this is a detailed, bottom-up approach that takes into account each type of cost for each activity in a process flow. Two complete cost models were constructed for this analysis. A variety of package sizes are analyzed, and multiple panel sizes are included as well. For each set of activities in the fan-out process flow, there is an explanation of how the process changes with the move to panel, including assumptions related to throughput, equipment price, and materials. The cost reduction that may be achieved at each package and panel size will be presented for each processing segment. The focus of this analysis is on the details of each segment of the process flow, but results for the total cost of various packages will also be presented. There is also a section of analysis related to the impact of yield on the competitiveness of panel processing.

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Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2017dpc-ta2_presentation3 ◽

2017 ◽

Vol 2017 (DPC) ◽

pp. 1-37 ◽

Cited By ~ 1

Author(s):

Amy Lujan

Keyword(s):

Flip Chip ◽

Cost Effective ◽

Cost Comparison ◽

Cost Modeling ◽

Wafer Level ◽

Design Features ◽

Wafer Level Packaging ◽

Flip Chip Packaging ◽

The Right ◽

The Cost

In recent years, there has been increased focus on fan-out wafer level packaging with the growing inclusion of a variety of fan-out wafer level packages in mobile products. While fan-out wafer level packaging may be the right solution for many designs, it is not always the lowest cost solution. The right packaging choice is the packaging technology that meets design requirements at the lowest cost. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer level packaging. It is important for many in the electronic packaging industry to be able to determine whether flip chip or fan-out wafer level packaging is the most cost-effective option. This paper will compare the cost of flip chip and fan-out wafer level packaging across a variety of designs. Additionally, the process flows for each technology will be introduced and the cost drivers highlighted. A variety of package sizes, die sizes, and design features will be covered by the cost comparison. Yield is a key component of cost and will also be considered in the analysis. Activity based cost modeling will be used for this analysis. With this type of cost modeling, a process flow is divided into a series of activities, and the total cost of each activity is accumulated. The cost of each activity is determined by analyzing the following attributes: time required, labor required, material required (consumable and permanent), capital required, and yield loss. The goal of this cost comparison is to determine which design features drive a design to be packaged more cost-effectively as a flip chip package, and which design features result in a lower cost fan-out wafer level package.

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Analysis and Comparison of Road Freight Transport Cost in 20 European Countries

International Journal of Applied Logistics ◽

10.4018/ijal.2020010102 ◽

2020 ◽

Vol 10 (1) ◽

pp. 13-26 ◽

Cited By ~ 1

Author(s):

Panagiotis Kotsios ◽

Dimitrios Folinas

Keyword(s):

Road Transport ◽

Freight Transport ◽

European Countries ◽

Transport Cost ◽

Road Freight ◽

Cost Competitiveness ◽

Cost Categories ◽

The Uk ◽

The Cost ◽

Cost Factors

Road transport is one of the most popular and practical means of freight transport in the world today. However, the cost of road freight transport may differ from one country to the next due to variances in a number of cost factors, including fuels, wages, taxation, tolls, insurance, maintenance, tyres, repairs, parking spaces, etc. The goal of this research was to measure and compare the cost of road freight transport in the 20 European countries with the highest recorded volume of tonne-kilometres, in order to draw conclusions about the cost competitiveness of road freight transport among them. Cost competitiveness in the sample was measured by 4 main cost categories: fuels, drivers' wages, tyres, and tolls. The results show large cost variations between countries. The countries found to have the lowest road freight transport cost were Lithuania, Poland and Bulgaria, and those with the highest costs were Norway, Austria, and the UK. The largest differences in costs were met in tolls and other road taxes, followed by drivers' wages, fuels, and finally tyres.

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Highly Stretchable Interconnects for Flexible Electronics Applications

Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales ◽

10.1115/ipack2015-48130 ◽

2015 ◽

Author(s):

Yeasir Arafat ◽

Rahul Panat ◽

Indranath Dutta

Keyword(s):

Flexible Electronics ◽

Large Strain ◽

Repeated Loading ◽

Manufacturing Method ◽

New Class ◽

Commercial Viability ◽

Highly Stretchable ◽

Cost Competitiveness ◽

Stretchable Interconnects ◽

The Cost

Interconnects that can deform under monotonous and/or repeated loading are increasingly important to a new class of electronic devices used for wearable applications. Such interconnects integrate different material sets such as polymers and metallic conductors and are subjected to large strain levels. A typical method to overcome the material incompatibility involves the conductor in the form of a serpentine or an out-of-the plane buckled geometry. In this paper, we demonstrate a novel combination of interconnect materials that enables significant improvement in the interconnect stretchability using Indium over the state-of-the-art without affecting the system performance. This was achieved without the necessity of the serpentine interconnects geometry that significantly improves the routing density. The manufacturing method used for this approach is also described. Finally, we discuss the cost competitiveness of the materials and the manufacturing method to assess the commercial viability of this approach. (5nm)

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Rural electrification through village grids—Assessing the cost competitiveness of isolated renewable energy technologies in Indonesia

Renewable and Sustainable Energy Reviews ◽

10.1016/j.rser.2013.01.049 ◽

2013 ◽

Vol 22 ◽

pp. 482-496 ◽

Cited By ~ 88

Author(s):

Nicola U. Blum ◽

Ratri Sryantoro Wakeling ◽

Tobias S. Schmidt

Keyword(s):

Renewable Energy ◽

Rural Electrification ◽

Renewable Energy Technologies ◽

Energy Technologies ◽

Cost Competitiveness ◽

The Cost

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Clustering approaches to improve the performance of low cost air pollution sensors

Faraday Discussions ◽

10.1039/c7fd00020k ◽

2017 ◽

Vol 200 ◽

pp. 621-637 ◽

Cited By ~ 16

Author(s):

Katie R. Smith ◽

Peter M. Edwards ◽

Mathew J. Evans ◽

James D. Lee ◽

Marvin D. Shaw ◽

...

Keyword(s):

Air Pollution ◽

Supply Voltage ◽

Low Cost ◽

Linear Interpolation ◽

External Reference ◽

Single Chemical ◽

Cost Competitiveness ◽

Sensor Signals ◽

Co Sensor ◽

The Cost

Low cost air pollution sensors have substantial potential for atmospheric research and for the applied control of pollution in the urban environment, including more localized warnings to the public. The current generation of single-chemical gas sensors experience degrees of interference from other co-pollutants and have sensitivity to environmental factors such as temperature, wind speed and supply voltage. There are uncertainties introduced also because of sensor-to-sensor response variability, although this is less well reported. The sensitivity of Metal Oxide Sensors (MOS) to volatile organic compounds (VOCs) changed with relative humidity (RH) by up to a factor of five over the range of 19–90% RH and with an uncertainty in the correction of a factor of two at any given RH. The short-term (second to minute) stabilities of MOS and electrochemical CO sensor responses were reasonable. During more extended use, inter-sensor quantitative comparability was degraded due to unpredictable variability in individual sensor responses (to either measurand or interference or both) drifting over timescales of several hours to days. For timescales longer than a week identical sensors showed slow, often downwards, drifts in their responses which diverged across six CO sensors by up to 30% after two weeks. The measurement derived from the median sensor within clusters of 6, 8 and up to 21 sensors was evaluated against individual sensor performance and external reference values. The clustered approach maintained the cost competitiveness of a sensor device, but the median concentration from the ensemble of sensor signals largely eliminated the randomised hour-to-day response drift seen in individual sensors and excluded the effects of small numbers of poorly performing sensors that drifted significantly over longer time periods. The results demonstrate that for individual sensors to be optimally comparable to one another, and to reference instruments, they would likely require frequent calibration. The use of a cluster median value eliminates unpredictable medium term response changes, and other longer term outlier behaviours, extending the likely period needed between calibration and making a linear interpolation between calibrations more appropriate. Through the use of sensor clusters rather than individual sensors, existing low cost technologies could deliver significantly improved quality of observations.

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