A Low-Cost Scalable 32-Element 28-GHz Phased Array Transceiver for 5G Communication Links Based on a $2\times 2$ Beamformer Flip-Chip Unit Cell

2018 ◽  
Vol 53 (5) ◽  
pp. 1260-1274 ◽  
Author(s):  
Kerim Kibaroglu ◽  
Mustafa Sayginer ◽  
Gabriel M. Rebeiz
Keyword(s):  
Flip Chip ◽  
Phased Array ◽  
Low Cost ◽  
Unit Cell ◽  
Communication Links ◽  
5G Communication

scholarly journals Realization of frequency hopping characteristics of an epsilon negative metamaterial with high effective medium ratio for multiband microwave applications

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Mohammad Tariqul Islam ◽  
Md. Moniruzzaman ◽  
Touhidul Alam ◽  
Md Samsuzzaman ◽  
Qutaiba A. Razouqi ◽  
...  
Keyword(s):  
Refractive Index ◽  
Low Cost ◽  
Frequency Hopping ◽  
Small Dimension ◽  
Effective Medium ◽  
Unit Cell ◽  
Negative Permittivity ◽  
Design System ◽  
Microwave Applications ◽  
Meander Line

AbstractIn this paper, a meander-lines-based epsilon negative (ENG) metamaterial (MTM) with a high effective medium ratio (EMR) and near-zero refractive index (NZI) is designed and investigated for multiband microwave applications. The metamaterial unit cell is a modification of the conventional square split-ring resonator in which the meander line concept is utilized. The meander line helps to increase the electrical length of the rings and provides strong multiple resonances within a small dimension. The unit cell of proposed MTM is initiated on a low-cost FR4 substrate of 1.5 mm thick and electrical dimension of 0.06λ × 0.06λ, where wavelength, λ is calculated at the lowest resonance frequency (2.48 GHz). The MTM provides four major resonances of transmission coefficient (S21) at 2.48, 4.28, 9.36, and 13.7 GHz covering S, C, X, and Ku bands. It shows negative permittivity, near-zero permeability, and near-zero refractive index in the vicinity of these resonances. The equivalent circuit is designed and modeled in Advanced Design System (ADS) software. The simulated S21 of the MTM unit cell is compared with the measured one and both show close similarity. The array performance of the MTM is also evaluated by using 2 × 2, 4 × 4, and 8 × 8 arrays that show close resemblance with the unit cell. The MTM offers a high effective medium ratio (EMR) of 15.1, indicating the design's compactness. The frequency hopping characteristics of the proposed MTM is investigated by open and short-circuited the three outer rings split gaps by using three switches. Eight different combinations of the switching states provide eight different sets of multiband resonances within 2–18 GHz; those give the flexibility of using the proposed MTM operating in various frequency bands. For its small dimension, NZI, high EMR, and frequency hopping characteristics through switching, this metamaterial can be utilized for multiband microwave applications, especially to enhance the gain of multiband antennas.

scholarly journals Fabrication and Compressive Behavior of a Micro-Lattice Composite by High Resolution DLP Stereolithography

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 785
Author(s):  
Chow Shing Shin ◽  
Yu Chia Chang
Keyword(s):  
High Resolution ◽  
Lattice Structure ◽  
Low Cost ◽  
Hierarchical Structures ◽  
Dip Coating ◽  
Unit Cell ◽  
Digital Light Processing ◽  
Unit Cell Size ◽  
Wide Range ◽  
And Performance

Lattice structures are superior to stochastic foams in mechanical properties and are finding increasing applications. Their properties can be tailored in a wide range through adjusting the design and dimensions of the unit cell, changing the constituent materials as well as forming into hierarchical structures. In order to achieve more levels of hierarchy, the dimensions of the fundamental lattice have to be small enough. Although lattice size of several microns can be fabricated using the two-photon polymerization technique, sophisticated and costly equipment is required. To balance cost and performance, a low-cost high resolution micro-stereolithographic system has been developed in this work based on a commercial digital light processing (DLP) projector. Unit cell lengths as small as 100 μm have been successfully fabricated. Decreasing the unit cell size from 150 to 100 μm increased the compressive stiffness by 26%. Different pretreatments to facilitate the electroless plating of nickel on the lattice structure have been attempted. A pretreatment of dip coating in a graphene suspension is the most successful and increased the strength and stiffness by 5.3 and 3.6 times, respectively. Even a very light and incomplete nickel plating in the interior has increase the structural stiffness and strength by more than twofold.

A High-Linearity 76–85-GHz 16-Element 8-Transmit/8-Receive Phased-Array Chip With High Isolation and Flip-Chip Packaging

2014 ◽  
Vol 62 (10) ◽  
pp. 2337-2356 ◽  
Author(s):  
Bon-Hyun Ku ◽  
Ozgur Inac ◽  
Michael Chang ◽  
Hyun-Ho Yang ◽  
Gabriel M. Rebeiz
Keyword(s):  
Flip Chip ◽  
Phased Array ◽  
High Isolation ◽  
High Linearity ◽  
Flip Chip Packaging

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals Fiber-optic Synchronization and Data Transmission Subsystem of Multichannel Phased Array

2020 ◽  
Vol 23 (3) ◽  
pp. 7-12
Author(s):  
Y. A. Svetlichniy ◽  
Keyword(s):  
Data Transmission ◽  
Phased Array ◽  
Fiber Optic ◽  
Low Cost ◽  
Digital Data ◽  
Processor Core ◽  
Analog Signals ◽  
Distribution Scheme ◽  
Optical Analog ◽  
Data Transferring

The article deals with the practical aspects of synchronization and data transferring in multichannel phased array systems, especially in systems with big antenna dimensions. In multichannel passed array antenna commonly used an optical analog signals distribution scheme for RF and heterodyne signals and wired interfaces for control and digital data. For modern digital antennas the data transferring and synchronization method, based on digital fiber optic channels, was presented. The schemes, constructions, and algorithms of the method are described. The method was realized as SDR system using FPGA with soft-processor core. For data transferring the 8b/10b code is used. The following result of experiment are discussed: digital optical lines are resistant to signals distortions, can transfer big data massive with minimal delay, have excellent synchronization capabilities at quite low cost.

scholarly journals Symmetrical Unit-Cell Numerical Approach for Flip-Chip Underfill Flow Simulation

CFD letters ◽  
2020 ◽  
Vol 12 (8) ◽  
pp. 55-63
Author(s):  
Ng Fei Chong ◽  
Mohd Hafiz Zawawi ◽  
Tung Lun Hao ◽  
Mohamad Aizat Abas ◽  
Mohd Zulkifly Abdullah
Keyword(s):  
Flip Chip ◽  
Flow Simulation ◽  
Numerical Approach ◽  
Unit Cell ◽  
Underfill Flow
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