Calibration of atomic force microscope for nanoscale friction measurements

Author(s):  
Agata Masalska ◽  
Krzysztof Kolanek ◽  
Miroslaw Woszczyna ◽  
Pawel Zawierucha ◽  
Yvonne Ritz ◽  
...  
2015 ◽  
Vol 642 ◽  
pp. 8-12
Author(s):  
William W.F. Chong ◽  
Miguel de La Cruz

The paper introduces an alternative approach to predict boundary friction for rough surfaces at micros-scale through the empirical integration of asperity-like nanoscale friction measurements. The nanoscale friction is measured using an atomic force microscope (AFM) tip sliding on a steel plate, confining the test lubricant, i.e. base oil for the fully formulated SAE grade 10w40. The approach, based on the Greenwood and Tripp’s friction model, is combined with the modified Elrod’s cavitation algorithm in order to predict the friction generated by a slider-bearing test rig. The numerical simulation results, using an improved boundary friction model, showed good agreement with the measured friction data.


Nature ◽  
1992 ◽  
Vol 359 (6391) ◽  
pp. 133-135 ◽  
Author(s):  
R. M. Overney ◽  
E. Meyer ◽  
J. Frommer ◽  
D. Brodbeck ◽  
R. Lüthi ◽  
...  

2007 ◽  
Vol 353-358 ◽  
pp. 742-745
Author(s):  
Fei Wang ◽  
Xue Zeng Zhao

The cantilevers of atomic force microscope (AFM) are mounted under a certain tilt angle, which is commonly assumed to have negligible effect on friction measurements in AFM. We present a theoretical study of the effect of the tilt angle on AFM based friction measurements. A method for correcting the friction coefficient between sample surfaces and AFM tips is also presented to minimize the effects of the tilt. The frictional forces between a silicon tip and a silicon surface at tilt angles ranging from 5 degrees to 25 degrees were measured. The results show that the measured friction coefficient increases with the tilt angle effectively, whereas the variation range of the corrected friction coefficient is within 10%.


Author(s):  
Joo Hoon Choi ◽  
Yangro Lee ◽  
Louis E. DeMarco ◽  
Richard T. Leveille ◽  
Joseph A. Levert ◽  
...  

The feature sizes on Integrated Circuits (ICs) continue to decrease to provide higher device densities and smaller chip designs. To accomplish this, current fabrication and processing technology must be advanced to achieve these goals. In particular, Chemical Mechanical Polishing (CMP), which is used for planarization of wafers and logic circuit components during IC fabrication, can cause severe surface damage to components in the form of delamination or distortion of surface features. CMP utilizes polishing particles suspended between a polymeric pad and the substrate to be polished. To control the process with higher precision the fundamentals of friction between CMP surfaces need to be analyzed. To investigate the friction contributions of the polishing particles in the CMP process, individual CMP abrasive particles are modeled by a silica atomic force microscope (AFM) probe with a radius of curvature on the order of 200 nm that is utilized in a scanning probe microscope (SPM). Lateral forces are measured that occur in simulated polishing of silica substrates and polyurethane pad material in a liquid environment. Results are obtained as a function of pH and environment and are compared with macroscopic friction results obtained using a high precision tribometer with a glass ball.


Sign in / Sign up

Export Citation Format

Share Document