Direct Numerical Simulation of Heat Transfer in Spray Cooling Through 3D Multiphase Flow Modeling Using Parallel Computing

2009 ◽  
Vol 131 (12) ◽  
Author(s):  
Suranjan Sarkar ◽  
R. Panneer Selvam

Thermal management issues have become a major bottleneck for further miniaturization and increased power consumption of electronics. Power electronics require more increasing use of high heat flux cooling technologies. Spray cooling with phase change has the advantage of large amount of heat transfer from the hot surface of many power electronics. Spray cooling is a complex phenomenon due to the interaction of liquid, vapor, and phase change at small length scale. A good understanding of the underlying physics and the heat removal process in spray cooling through numerical modeling is needed to design efficient spray cooling system. A computational fluid dynamics based 3D multiphase model for spray cooling is developed here in parallel computing environment using multigrid conjugate gradient solver. This model considers the effect of surface tension, gravity, phase change, and viscosity. The level set method is used to capture the movement of the liquid-vapor interface. The governing equations are solved using finite difference method. Spray cooling is studied using this model, where a vapor bubble is growing in a thin liquid film on a hot surface and a droplet is impacting on the thin film. The symmetry boundary condition considered on four sides of the domain effectively represents a large spray made up of multiple equally sized droplets and bubbles and their interaction. Studies have also been performed for different wall superheats in the absence of vapor bubble to compare the effect of two-phase heat transfer compared to single-phase in spray cooling. The computed interface, temperature, and heat flux distributions at different times over the domain are visualized for better understanding of the heat removal mechanism.

Author(s):  
J. Torres ◽  
A. Perdones ◽  
A. Garcia ◽  
F. J. Diez

Thermal control is a major constraint in spacecraft development as increased demand on electronics performance requires large heat dissipation from smaller surfaces which has led to increased challenges for thermal control. Spray cooling has a great amount of application in industrial processes as a heat removal method. It is thought to be the future in thermal management systems in space because of its capability for ‘close’ and accurate control of heat removal. Spray cooling is based on phase change heat transfer generating high heat transfer rates for low superheats. This last term is used to describe the difference in temperature between the heated surface and the cooling fluid. When the temperature of the surface to be cooled rises above the saturation temperature of the fluid splashed to the surface, a phase change occurs at the solid liquid interface during the boiling regime. However, the most interesting phase (regime) is the nucleating boiling where the critical heat flux, CHF, is reached. The CHF is then achieved due to the vapor generation is such as great that the liquid cannot still be in contact with the surface. Thus the heat is transferred through the vapor if there is not enough cold fluid. The thermal conductivity of vapor is lower and so the efficient of the cooling process. This turns out in a decrease on heat flux. Nowadays it is being taken more into account nanofluids as a technique capable of enhancing heat transfer. Nanofluids, a mix of nano-size particles in a base fluid, have been found to have a very high thermal conductivity as compared to the base fluid. In You et al., 2003; Kim et al., 2004a; Moreno et al., 2005 water was used with various Al2O3 particle concentration in a flat plate nucleate pool boiling system. They came across with no change in the heat transfer coefficient but a dramatic enhancement in CHF. They also found that high concentrations can degrade nucleate boiling. The aim of this project is study the effects of spray cooling with suspended nano-particles as an enhanced method for heat transfer removal. The working fluid was water with different concentrations of alumina-oxide particles added. The alumina oxide particles were supplied by Nanophase Technologies (Nano Tek® Alumina Oxide AL-01000-003-025) which had a mean diameter of 60 nm. Three different concentrations were used and the following: .5 g/L, 1 g/L, 2 g/L. Since clumping of particles can affect the heat transfer properties of the droplets, the solution was placed on inside an ultrasonic bath and left there for at least 24 hrs and immediately used in the experiments. Two nozzles were used in this experiment to study a wide range of sauter diameter of droplets. The experiment was carried out using three experimental techniques which looked into different characteristics of spray cooling. In the first mode, the fluid was sprayed onto a copper block heater surface while it was imaged with a high speed camera and synchronized with a high speed Nd-YAG laser. 9 thermocouples were positioned inside the copper block heater, as seen on Figure 1, to measure critical heat flux, while a camera was used to record different impact properties and the influence of nano-particles. Some of these properties were pool buildup size, spread, and duration of pool. For the second imaging technique, the spray on the heated surface was also considered to be an impinging jet, so to visualize the flow of this jet and how the heated surface affected it, PIV (Particle Image Velocimetry) was used in the study. A third imaging technique was used to study the droplet behavior when in contact with a heated surface. A transparent glass heater made of aluminum silicate glass and coated with an ITO (indium tin oxide) film was used as the heater. The size of the drops had an average diameter of 2.38 mm. When compared to the copper block study, this method allows images to be taken from directly below the clear glass heater. Furthermore, these images allow for a clear edge detection of drops as they spread on the surface and what characteristics they develop when the droplets have different concentrations of nanoparticles, as seen on Figure 2. The experiment used a pulsed laser to provide the background illumination. This project is a continuing research project.


Author(s):  
R. Panneer Selvam ◽  
Sandya Bhaskara ◽  
Juan C. Balda ◽  
Fred Barlow ◽  
Aicha Elshabini

Spray cooling is a high flux heat removal technique considered for systems dissipating high power within small areas such as advanced lasers. Recently Selvam and Ponnappan (2004 & 2005) identified the importance of modeling heat transfer in a thin liquid film on a hot surface at the micro level and illustrated how this micro level modeling could help to improve the macro level spray cooling. The goal of this research is to advance the theoretical understanding of spray cooling to enable efficient system level hardware designs. Two-phase flow modeling is done using the level set method to identify the interface of vapor and liquid. The modifications made to the incompressible Navier-Stokes equations to consider surface tension and phase change are presented. The equations are solved using the finite difference method. The effect of liquid droplet impact on a 40 μm thick liquid film containing vapor bubble and the consequent heat removal is explained with a sequence of temperature vs. time contours. From that, the importance of fast transient conduction in the liquid film leading to high heat flux in a short time is illustrated. The optimum positioning of the droplet with respect to the vapor bubble for effective heat removal is also systematically investigated. This information is expected to help in proper positioning of the droplet in three-dimensional modeling.


2003 ◽  
Vol 125 (2) ◽  
pp. 333-338 ◽  
Author(s):  
Qiang Cui ◽  
Sanjeev Chandra ◽  
Susan McCahan

The effect of adding one of three salts (NaCl, Na2SO4 or MgSO4) to water sprayed on a hot surface was studied experimentally. A copper test surface was heated to 240°C and quenched with a water spray. The variation of surface temperature during cooling was recorded, and the surface heat flux calculated from these measurements. Surface heat flux during cooling with pure water sprays was compared with that obtained using salt solutions. Dissolved NaCl or Na2SO4 increased nucleate boiling heat transfer, but had little effect on transition boiling during spray cooling. MgSO4 increased both nucleate and transition boiling heat flux. Enhanced nucleate boiling was attributed to foaming in the liquid film generated by the dissolved salts. MgSO4 produced the largest increase in nucleate boiling heat transfer, Na2SO4 somewhat less and NaCl the least. A concentration of 0.2 mol/l of MgSO4 produced the greatest heat flux enhancement; higher salt concentrations did not result in further improvements. During transition boiling particles of MgSO4 adhered to the heated surface, raising surface roughness and increasing heat transfer. Addition of MgSO4 reduced the time required to cool a hot surface from 240°C to 120°C by an order of magnitude.


Author(s):  
R. Panneer Selvam ◽  
Suranjan Sarkar

Spray cooling with phase change has the advantage of relatively large amount of heat transfer from the hot surface of many power electronics system. In our previous works in 2-D model of spray cooling, the importance of moving the cooler liquid quickly to heated dry surface which causes the high heat flux due to transient conduction is recognized to be the main reason for high heat transfer. In reality the phenomena of spray cooling are three dimensional in nature. The major draw back in extending the 2-D model to 3-D model is huge computing time in serial computer. Here the 3-D model is developed in parallel computing environment to reduce the turn around time. The 3-D multiphase model used here considers the effect of surface tension between liquid and vapor, gravity, phase change and viscosity. The level set method is used to capture the movement of the liquid vapor interface. The governing equations of multiphase flow are solved using the finite difference method. In this work the spray cooling phenomena is studied in 3-D multiphase model where a vapor bubble is growing in a thin liquid film on a hot surface and a droplet is impacting on the thin liquid film. This study has been done for different droplet velocities and for different wall superheats with our 3-D multiphase model to understand the high heat removal mechanism in spray cooling for different velocities and wall superheat situations.


1992 ◽  
Vol 114 (4) ◽  
pp. 965-971 ◽  
Author(s):  
H. Shimaoka ◽  
Y. H. Mori

The evaporation of isolated drops (2.1−3.0 mm diameter) of nonazeotropic n-pentane/n-hexane mixtures in the medium of water was observed under pressures of 0.11−0.46 MPa and temperature differences up to 27 K. The mole fractions of n-pentane, x, in the mixtures were set at 0.9, 0.5, 0.1, and 0, to be completed by the condition x = 1 set in a preceding work (Shimaoka and Mori, 1990). Experimental results are presented in terms of the instantaneous rise velocity of, and an expression of instantaneous heat transfer to, each drop evaporating and thereby transforming into a liquid/vapor two-phase bubble and finally into a vapor bubble. The dependencies of the heat transfer characteristics on the pressure, the temperature difference, and x are discussed.


Author(s):  
Muhsincan Sesen ◽  
Ali Kosar ◽  
Ebru Demir ◽  
Evrim Kurtoglu ◽  
Nazli Kaplan ◽  
...  

In this paper, the results of a series of heat transfer experiments conducted on a compact electronics cooling device based on single phase jet impingement techniques are reported. Deionized-water is propelled into four microchannels of inner diameter 685 μm which are used as nozzles and located at a nozzle to surface distance of 2.5mm. The generated jet impingement is targeted through these channels towards the surface of a nanostructured plate. This plate of size 20mmx20mm consisted of ∼600 nm long copper nanorod arrays with an average nanorod diameter of ∼150 nm, which were integrated on top of a silicon wafer substrate coated with a copper thin film layer (i.e. Cu-nanorod/Cu-film/Silicon-wafer). Heat removal characteristics induced through jet impingement are investigated using the nanostructured plate and compared to results obtained from a flat plate of copper thin film coated on silicon wafer surface. Enhancement in heat transfer up to 15% using the nanostructured plate has been reported in this paper. Heat generated by small scale electronic devices is simulated using a thin film heater placed on an aluminum base. Surface temperatures are recorded by a data acquisition system with the thermocouples integrated on the surface at various locations. Constant heat flux provided by the film heater is delivered to the nanostructured plate placed on top of the base. Volumetric flow rate and heat flux values were varied in order to better characterize the potential enhancement in heat transfer by nanostructured surfaces.


Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.


Author(s):  
Solomon Adera ◽  
Rishi Raj ◽  
Evelyn N. Wang

Thermal management is increasingly becoming a bottleneck for a variety of high power density applications such as integrated circuits, solar cells, microprocessors, and energy conversion devices. The performance and reliability of these devices are usually limited by the rate at which heat can be removed from the device footprint, which averages well above 100 W/cm2 (locally this heat flux can exceed 1000 W/cm2). State-of-the-art air cooling strategies which utilize the sensible heat are insufficient at these large heat fluxes. As a result, novel thermal management solutions such as via thin-film evaporation that utilize the latent heat of vaporization of a fluid are needed. The high latent heat of vaporization associated with typical liquid-vapor phase change phenomena allows significant heat transfer with small temperature rise. In this work, we demonstrate a promising thermal management approach where square arrays of cylindrical micropillar arrays are used for thin-film evaporation. The microstructures control the liquid film thickness and the associated thermal resistance in addition to maintaining a continuous liquid supply via the capillary pumping mechanism. When the capillary-induced liquid supply mechanism cannot deliver sufficient liquid for phase change heat transfer, the critical heat flux is reached and dryout occurs. This capillary limitation on thin-film evaporation was experimentally investigated by fabricating well-defined silicon micropillar arrays using standard contact photolithography and deep reactive ion etching. A thin film resistive heater and thermal sensors were integrated on the back side of the test sample using e-beam evaporation and acetone lift-off. The experiments were carried out in a controlled environmental chamber maintained at the water saturation pressure of ≈3.5 kPa and ≈25 °C. We demonstrated significantly higher heat dissipation capability in excess of 100 W/cm2. These preliminary results suggest the potential of thin-film evaporation from microstructured surfaces for advanced thermal management applications.


Author(s):  
Jungho Lee ◽  
Cheong-Hwan Yu ◽  
Sang-Jin Park

Water spray cooling is an important technology which has been used in a variety of engineering applications for cooling of materials from high-temperature nominally up to 900°C, especially in steelmaking processes and heat treatment in hot metals. The effects of cooling water temperature on spray cooling are significant for hot steel plate cooling applications. The local heat flux measurements are introduced by a novel experimental technique in which test block assemblies with cartridge heaters and thermocouples are used to measure the heat flux distribution on the surface of hot steel plate as a function of heat flux gauge. The spray is produced from a fullcone nozzle and experiments are performed at fixed water impact density of G and fixed nozzle-to-target spacing. The results show that effects of water temperature on forced boiling heat transfer characteristics are presented for five different water temperatures between 5 to 45°C. The local heat flux curves and heat transfer coefficients are also provided to a benchmark data for the actual spray cooling of hot steel plate cooling applications.


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