Hydrodynamics and Heat Transfer Characteristics of a Miniature Plate Pin-Fin Heat Sink Utilizing Al2O3–Water and TiO2–Water Nanofluids

2015 ◽  
Vol 7 (3) ◽  
Author(s):  
Majid Roshani ◽  
Seyed Ziaeddin Miry ◽  
Pedram Hanafizadeh ◽  
Mehdi Ashjaee
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Constant Heat Flux ◽  
Hydrodynamic Performance ◽  
Bottom Surface ◽  
Inlet Temperature ◽  
Transfer Coefficients ◽  
Pin Fin

In this paper, the hydrodynamic and thermal performance of a miniature plate pin-finned heat sink is investigated experimentally by utilizing two widely used nanofluids, Al2O3–water and TiO2–water. The heat sink base plate, which is used in the cooling process of electronic devices, has the dimensions of 42 mm (L) × 42 mm (W) × 14 mm (H) and is made of aluminum and placed in a plexiglass case which is isolated from the environment using an insulator foam. The thermal performance of the heat sink is investigated by passing the nanofluid at constant inlet temperature while applying a constant heat flux of 124.8 kW/m2 to the bottom surface of the heat sink. The nanofluids are prepared in volume concentrations of 0.5, 1, 1.5, and 2% and their performances are measured considering water as the base fluid. Measuring the pressure difference between the entrance and exit of the heat sink made it possible to study the hydrodynamic performance of the heat sink. Although the measurements showed 15% and 30% increase in the pumping power for the volume concentration of 2% of Al2O3–water and TiO2–water nanofluids, respectively, the average heat transfer coefficients increased by 16% and 14% and the thermal resistance decreased by 17% and 14% for each nanofluid.

Heat Transfer and Pressure Loss Characteristics of Pin-Fins With Different Shapes in a Wide Channel

2017 ◽  
Author(s):  
Jin Xu ◽  
Jiaxu Yao ◽  
Pengfei Su ◽  
Jiang Lei ◽  
Junmei Wu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Nusselt Number ◽  
Thermal Performance ◽  
Pressure Loss ◽  
Bottom Surface ◽  
Number Range ◽  
Pin Fin ◽  
Nominal Diameter ◽  
Pin Fins

Convective heat transfer enhancement and pressure loss characteristics in a wide rectangular channel (AR = 4) with staggered pin fin arrays are investigated experimentally. Six sets of pin fins with the same nominal diameter (Dn = 8mm) are tested, including: Circular, Elliptic, Oblong, Dropform, NACA and Lancet. The relative spanwise pitch (S/Dn = 2) and streamwise pitch (X/Dn = 4.5) are kept the same for all six sets. Same nominal diameter and arrangement guarantee the same blockage area in the channel for each set. Reynolds number based on channel hydraulic diameter is from 10000 to 70000 with an increment of 10000. Using thermochromic liquid crystal (R40C20W), heat transfer coefficients on bottom surface of the channel are achieved. The obtained friction factor, Nusselt number and overall thermal performance are compared with the previously published data from other groups. The averaged Nusselt number of Circular pin fins is the largest in these six pin fins under different Re. Though Elliptic has a moderate level of Nusselt number, its pressure loss is next to the lowest. Elliptic pin fins have pretty good overall thermal performance in the tested Reynolds number range. When Re>40000, Lancet has a same level of performance as Circular, but its pressure loss is much lower than Circular. These two types are both promising alternative configuration to Circular pin fin used in gas turbine blade.

Cryogenic Single-Phase Heat Transfer in a Microscale Pin Fin Heat Sink

2013 ◽  
Author(s):  
Eric D. Truong ◽  
Erfan Rasouli ◽  
Vinod Narayanan
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Sink ◽  
Single Phase ◽  
Flow Direction ◽  
Heat Sinks ◽  
Variable Cross ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients

A combined experimental and computational fluid dynamics study of single-phase liquid nitrogen flow through a microscale pin-fin heat sink is presented. Such cryogenic heat sinks find use in applications such as high performance computing and spacecraft thermal management. A circular pin fin heat sink in diameter 5 cm and 250 micrometers in depth was studied herein. Unique features of the heat sink included its variable cross sectional area in the flow direction, variable pin diameters, as well as a circumferential distribution of fluid into the pin fin region. The stainless steel heat sink was fabricated using chemical etching and diffusion bonding. Experimental results indicate that the heat transfer coefficients were relatively unchanged around 2600 W/m2-K for flow rates ranging from 2–4 g/s while the pressure drop increased monotonically with the flow rate. None of the existing correlations in literature on cross flow over a tube bank or micro pin fin heat sinks were able to predict the experimental pressure drop and heat transfer characteristics. However, three dimensional simulations performed using ANSYS Fluent showed reasonable (∼7 percent difference) agreement in the average heat transfer coefficients between experiments and CFD simulations.

An Experimental Study of Pin Fin Heat Sinks and Determination of End Wall Heat Transfer

2003 ◽  
Author(s):  
Massimiliano Rizzi ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Experimental Study ◽  
Heat Sink ◽  
Optimization Methods ◽  
Heat Sinks ◽  
Base Region ◽  
Transfer Coefficients ◽  
Media Type ◽  
Pin Fin ◽  
Heat Transfer Coefficients

An experimental study of a pin fin heat sink was carried out in support of the development of heat sink optimization methods requiring more detailed measurements be made. Measurements of heat flux and temperature are used to separately determine heat transfer coefficients for the pins and the base region between the pins. Three pitch to diameter ratios (distance from pin center to pin center measured diagonally) were studied: P/d = 3/1, 9/4, 3/2. Heat generation was accomplished using cartridge heaters inserted into a copper block. The high thermal conductivity of the copper ensured that the surface beneath the heat sink would be at a constant temperature. The cooling fluid was air and the experiments were conducted with a Reynolds numbers based on a porous media type hydraulic diameter ranging from 500 to 25000. The channel had a shroud that touches the fin tips, eliminating any flow bypass. The pin surface heat transfer coefficients match the values reported by Kays and London and by Zukauskas. The base region heat transfer coefficients were, surprisngly, larger than the pin values.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

scholarly journals Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement

1999 ◽  
Vol 122 (3) ◽  
pp. 282-285 ◽  
Author(s):  
Luis A. Brignoni ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Jet Impingement ◽  
Target Distance ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients ◽  
Air Jet ◽  
Finned Surface ◽  
Different Diameters

Experimental measurements were obtained to characterize the thermal performance of ducted air suction in conjunction with a pin-fin heat sink. Four single nozzles of different diameters and two multiple-nozzle arrays were studied at a fixed nozzle-to-target distance, for different turbulent Reynolds numbers 5000⩽Re⩽20,000. Variations of nozzle-to-target distance, i.e., open area, in ducted suction were found to have a strong effect on heat transfer especially with the larger diameter single nozzle and both multiple-nozzle arrays. Enhancement factors were computed with the heat sink in suction flow, relative to a bare surface, and were in the range of 8.3 to 17.7, with the largest value being obtained for the nine-nozzle array. Results from the present study on air jet suction are compared with previous experiments with air jet impingement on the pin-fin heat sink. Average heat transfer coefficients and thermal resistance values are reported for the heat sink as a function of Reynolds number, air flow rate, and pumping power. [S1043-7398(00)00903-8]

A Novel Concept to Improve the Performance of LED Panel Using Drilled Holes

2005 ◽  
Author(s):  
S. B. Chiang ◽  
C. C. Wang
Keyword(s):  
Heat Transfer ◽  
Surface Area ◽  
Heat Sink ◽  
Maximum Temperature ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Heat Transfer Coefficients ◽  
Pin Fins ◽  
Overall Performance ◽  
Novel Concept

In this study, the concept of the thermal module of LEDs cooling by use of drilled hole to entrain air flow was examined. It is found that the drilled hole does not necessarily improve the overall performance. It depends on the size of the drilled hole, the number of drilled holes, and the locations. The heat transfer coefficients are generally increased with the number of drilled holes and the diameter of the drilled hole. In this paper, the plate fin heat sink has a higher heat transfer coefficients than pin fins, but the overall performance of the LED panel having pin fin outperforms that of plate fin. This is because the pin fin provides much larger surface area. For decrease the maximum temperature of the LED panel, placement of the drilled holes along the hot region will be more effective.

scholarly journals Heat Transfer Coefficient Determination during FC-72 Flow in a Minichannel Heat Sink Using the Trefftz Functions and ADINA Software

Energies ◽  
2020 ◽  
Vol 13 (24) ◽  
pp. 6647
Author(s):  
Magdalena Piasecka ◽  
Beata Maciejewska ◽  
Paweł Łabędzki
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Transfer Problem ◽  
Heat Transfer Problem ◽  
Heated Wall ◽  
Inlet Temperature ◽  
Transfer Coefficients ◽  
Flowing Fluid

This work focuses on subcooled boiling heat transfer during flow in a minichannel heat sink with three or five minichannels of 1 mm depth. The heated element for FC-72 flowing along the minichannels was a thin foil of which temperature on the outer surface was measured due to the infrared thermography. The test section was oriented vertically or horizontally. A steady state heat transfer process and a laminar, incompressible flow of the fluid in a central minichannel were assumed. The heat transfer problem was described by the energy equations with an appropriate system of boundary conditions. Several mathematical methods were applied to solve the heat transfer problem with the Robin condition to determine the local heat transfer coefficients at the fluid/heated foil interface. Besides the 1D approach as a simple analytical method, a more sophisticated 2D approach was proposed with solutions by the Trefftz functions and ADINA software. Finite element method (FEM) calculations were conducted to find the temperature field in the flowing fluid and in the heated wall. The results were illustrated by graphs of local heated foil temperature and transfer coefficients as a function of the distance from the minichannel inlet. Temperature distributions in the heater and the fluid obtained from the FEM computations carried out by ADINA software were also shown. Similar values of the heat transfer coefficient were obtained in both the FEM calculations and the 1D approach. Example boiling curves indicating nucleation hysteresis are shown and discussed.

Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

2011 ◽  
Author(s):  
Sulaman Pashah ◽  
Abul Fazal M. Arif
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Packaging ◽  
Base Plate ◽  
Heat Sinks ◽  
Metallic Base ◽  
Plate Interface ◽  
Pin Fin ◽  
Pin Fins ◽  
Reliability Performance

Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.

Influence of Rib Turbulators on Pin-Fin Heat Transfer in the Trailing Region of Gas Turbine Vane: A Numerical Study

2006 ◽  
Author(s):  
N. Kulasekharan ◽  
B. V. S. S. S. Prasad
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Numerical Study ◽  
Pressure Ratio ◽  
Constant Heat Flux ◽  
Transfer Coefficients ◽  
Flux Boundary Condition ◽  
Pin Fin ◽  
Pin Fins ◽  
Rib Turbulators

A numerical investigation is carried out for estimating the influence of rib turbulators on heat transfer and pressure drop of staggered non-uniform pin-fin arrays of different shapes, in a simulated cambered vane trailing region. Pin-fins of square, circular and the diamond shapes, each of two sizes (d) were chosen. The ratio of span-wise pitch to longitudinal pitch is 1.06 and that to the pin size are 4.25 and 3.03, for all pin shapes. A constant heat flux boundary condition is assumed over the coolant channel walls, rib surfaces and circumferential faces of the pin-fins. Reynolds number is varied (20,000<ReD<40,000) by changing the coolant outlet to inlet pressure ratio. Pin end-wall and pin surface averaged heat transfer coefficients and Nusselt numbers are estimated and detailed contours of heat transfer coefficient on both the pressure and suction surfaces are presented. Whilst there is an enhancement in heat transfer and pressure drop with ribs for all the pin shapes, diamond pins have shown the highest enhancement values for both ribbed and non-ribbed configuration.

scholarly journals Experimental analysis of effect of base with different inner geometries filled nano PCM for the thermal performance of the plate fin heat sink

2021 ◽  
pp. 243-243
Author(s):  
Periyannan Lakshmanan ◽  
Saravanan Periyasamy ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Reynolds Number ◽  
Phase Shift ◽  
Experimental Research ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Base Plate ◽  
Heat Sinks

Experimental research demonstrates the performance of electronic devices on plate fin heat sinks in order to guarantee that operating temperatures are kept as low as possible for reliability. Paraffin wax (PCM) is a substance that is used to store energy and the aluminum plate fin cavity base is chosen as a Thermal Conductivity Enhancer (TCEs). The effects of PCM material (Phase shift material), cavity form base (Rectangular, Triangular, Concave and Convex) with PCM, Reynolds number (Re= 4000-20000) on heat transfer effectiveness of plate fin heat sinks were experimentally explored in this research. The thermal performance of concave base plate fin heat sink with PCM is increased up to 7.8% compared to other cavity base heat sinks.

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