scholarly journals Experimental analysis of effect of base with different inner geometries filled nano PCM for the thermal performance of the plate fin heat sink

2021 ◽  
pp. 243-243
Author(s):  
Periyannan Lakshmanan ◽  
Saravanan Periyasamy ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Reynolds Number ◽  
Phase Shift ◽  
Experimental Research ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Base Plate ◽  
Heat Sinks

Experimental research demonstrates the performance of electronic devices on plate fin heat sinks in order to guarantee that operating temperatures are kept as low as possible for reliability. Paraffin wax (PCM) is a substance that is used to store energy and the aluminum plate fin cavity base is chosen as a Thermal Conductivity Enhancer (TCEs). The effects of PCM material (Phase shift material), cavity form base (Rectangular, Triangular, Concave and Convex) with PCM, Reynolds number (Re= 4000-20000) on heat transfer effectiveness of plate fin heat sinks were experimentally explored in this research. The thermal performance of concave base plate fin heat sink with PCM is increased up to 7.8% compared to other cavity base heat sinks.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

Thermal Performance of Triangular Folded Fin Heat Sinks in a Duct

2003 ◽  
Author(s):  
Seo Young Kim ◽  
Taeho Ji ◽  
Dong Gyu Choi ◽  
Byung Ha Kang
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flow Velocity ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Heat Transfer Characteristics

Experiments have been carried out to investigate the convective heat transfer characteristics from triangular folded fin heat sinks in a suction-type fan duct. The dimension of the triangular folded fin heat sinks is 62 mm in height with a 12 mm thick base plate, 292 mm in width, and 447 mm in length. The inlet flow velocity is varied in the range of 0.6–5.3 m/s. Thermal performance of triangular folded fin heat sinks is evaluated in terms of thermal resistance of heat sinks according to flow velocity and fan power. The results obtained show that the present triangular folded-fin heat sink shows a higher thermal performance compared to a conventional extruded plate-fin heat sink. Especially, a perforated slit folded-fin heat sink displays a lower thermal resistance. As the number of slit fabricated on the perforated folded fins increases, thermal performance is more pronounced.

Experimental Investigation of Thermal Performance of Vapor Chamber Heat Sinks

2010 ◽  
Author(s):  
Hung-Yi Li ◽  
Ming-Hung Chiang ◽  
Chih-I Lee ◽  
Wen-Jei Yang
Keyword(s):  
Experimental Investigation ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Vapor Chamber ◽  
Lower Reynolds Number

This work experimentally studies the thermal performance of plate-fin vapor chamber heat sinks using infrared thermography. The effects of the fin width, the fin height and the Reynolds number on the thermal performance are considered. The results show that generated heat is transferred more uniformly to the base plate by a vapor chamber heat sink than by a similar aluminum heat sink. Therefore, the maximum temperature is effectively reduced. The overall thermal resistance of the vapor chamber heat sink declines as the Reynolds number increases, but the strength of the effect falls. The effect of the fin dimensions on the thermal performance is stronger at a lower Reynolds number.

Fluid Flow and Heat Transfer of Liquid Sodium in Small-Scale Heat Sinks With Different Geometries

2021 ◽  
Author(s):  
Mahyar Pourghasemi ◽  
Nima Fathi
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Cross Sections ◽  
Heat Sink ◽  
Volume Ratio ◽  
Heat Sinks ◽  
Liquid Sodium ◽  
Small Scale ◽  
Nusselt Numbers ◽  
The Difference

Abstract 3-D numerical simulations are performed to investigate liquid sodium (Na) flow and the heat transfer within miniature heat sinks with different geometries and hydraulic diameters of less than 5 mm. Two different straight small-scale heat sinks with rectangular and triangular cross-sections are studied in the laminar flow with the Reynolds number up to 1900. The local and average Nusselt numbers are obtained and compared against eachother. At the same surface area to volume ratio, rectangular minichannel heat sink leads to almost 280% higher convective heat transfer rate in comparison with triangular heat sink. It is observed that the difference between thermal efficiencies of rectangular and triangular minichannel heat sinks was independent of flow Reynolds number.

Study on the Factors Influencing Spreading Resistance of Heat Sinks

2011 ◽  
Vol 301-303 ◽  
pp. 165-169
Author(s):  
Da Yong Gao ◽  
Jian Xin Zhang ◽  
Ping Juan Niu
Keyword(s):  
Heat Source ◽  
Heat Sink ◽  
Electronic Devices ◽  
Great Influence ◽  
Base Plate ◽  
Critical Value ◽  
Area Ratio ◽  
Heat Sinks ◽  
Spreading Resistance ◽  
Factors Influencing

The spreading resistance is a very important parameter in the applications of heat sink. The design of electronic devices will fail without considering the influence of the spreading resistance. In this paper, a simple thermal model was simulated by Computational Fluid Dynamics software. Some factors, which have great influence on the spreading resistance, have been analyzed. The spreading resistance decreases significantly with the increasing of the area ratio between the heat source and the base-plate. While the ratio being 1, the spreading resistance reaches the mix value. The greater the thermal conductivity of heat sink, the lower the spreading resistance. With the increasing of the thickness of base-plate, the spreading resistance reduces. However, if the thickness exceeds the critical value, the spreading resistance will increase. And the spreading resistance reaches the mix value while the centers of heat source and the base-plate are overlapped.

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

1999 ◽  
Vol 123 (3) ◽  
pp. 315-318 ◽  
Author(s):  
Keiji Sasao ◽  
Mitsuru Honma ◽  
Atsuo Nishihara ◽  
Takayuki Atarashi
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Numerical Analysis ◽  
Numerical Method ◽  
Heat Sink ◽  
Flow Resistance ◽  
Air Flow ◽  
Heat Sinks ◽  
Flow And Heat Transfer ◽  
Conventional Methods

A numerical method for simulating impinging air flow and heat transfer in plate-fin type heat sinks has been developed. In this method, all the fins of an individual heat sink and the air between them are replaced with a single, uniform element having an appropriate flow resistance and thermal conductivity. With this element, fine calculation meshes adapted to the shape of the actual heat sink are not needed, so the size of the calculation mesh is much smaller than that of conventional methods.

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
V. Egan ◽  
P. A. Walsh ◽  
E. Walsh ◽  
R. Grimes
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Volume Flow Rate ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Superior Performance ◽  
Low Profile ◽  
In Series ◽  
Heat Sink Design

Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve this, the power consumed has to be dissipated over smaller areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which incorporate one of the smallest commercially available fans in series with two different heat sink designs. The first of these is the conventionally used finned heat sink design, which was specifically optimized and custom manufactured in the current study to complement the driving fan. While the second design proposed is a novel “finless” type heat sink suitable for use in low profile applications. Together the driving fan and heat sinks combined were constrained to have a total footprint area of 465 mm2 and a profile height of only 5 mm, making them ideal for use in portable electronics. The objective was to evaluate the performance of the proposed finless heat sink design against a conventional finned heat sink, and this was achieved by means of thermal resistance and overall heat transfer coefficient measurements. It was found that the proposed finless design proved to be the superior cooling solution when operating at low fan speeds, while at the maximum fan speed tested of 8000 rpm both provided similar performance. Particle image velocimetry measurements were used to detail the flow structures within each heat sink and highlighted methods, which could further optimize their performance. Also, these measurements along with corresponding global volume flow rate measurements were used to elucidate the enhanced heat transfer characteristics observed for the finless design. Overall, it is shown that the proposed finless type heat sink can provide superior performance compared with conventional finned designs when used in low profile applications. In addition a number of secondary benefits associated with such a design are highlighted including lower cost, lower mass, lower acoustics, and reduced fouling issues.

Numerical Simulation of Heat Sink Performance With Interrupted and Staggered Fins

2009 ◽  
Author(s):  
Suabsakul Gururatana ◽  
Xianchang Li
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Reynolds Number ◽  
Heat Transfer Rate ◽  
Heat Sink ◽  
Pressure Loss ◽  
Transfer Rate ◽  
Flow Direction ◽  
Heat Sinks ◽  
High Heat Transfer

Extended surfaces (fins) have been used to enhance heat transfer in many applications. In electronics cooling, fin-based heat sinks are commonly designed so that coolants (gas or liquid) are forced to pass through the narrow straight channel. To improve the overall heat sink performance, this study investigated numerically the details of heat sinks with interrupted and staggered fins cooled by forced convection. Long and narrow flow passages or channels are widely seen in heat sinks. Based on the fundamental theory of heat transfer, however, a new boundary layer can be created periodically with interrupted fins, and the entrance region can produce a very high heat transfer coefficient. The staggered fins can take advantage of the lower temperature flow from the upstream. The tradeoff is the higher pressure loss. A major challenge for heat sink design is to reduce the pressure loss while keeping the heat transfer rate high. The effect of fin shapes on the heat sink performance was also examined. Two different shapes under study are rectangular and elliptic with various gaps between the interrupted fins in the flow direction. In addition, studies were also conducted on the parametric effects of Reynolds number and gap length. It is observed that heat transfer increases with the Reynolds number due to the feature of developing boundary layer. If the same pressure drop is considered, the heat transfer rate of elliptic fins is higher than that of rectangular fins.

scholarly journals Heat Transfer Enhancement from Microprocessor

2020 ◽  
Vol 8 (4S4) ◽  
pp. 174-178
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Heat Transfer Enhancement ◽  
Thermal Performance ◽  
Hydraulic Diameter ◽  
Constant Speed ◽  
Heat Sinks ◽  
Experimental Investigations ◽  
Transfer Enhancement ◽  
Pass Through

Experiments were conducted to investigate the cooling of processor to increase the thermal performance by employing a mini channel instead of conventional heat sinks. Now a day’s aluminium fin with fans is used for cooling the processor. Constant speed of the fans is found to be not enough to remove the heat generated by the processor. The experimental investigations were carried out in the channels with the hydraulic diameter of about 1.5x10-3m for the Reynolds number varying from 80 to 1150. The water is allowed to pass through the channel by virtue of which heat is rejected from the processor. The influence of Reynolds number on heat transfer enhancement from the microprocessor is discussed in details. Comparison between heat transfer by air and by water is presented. From the experiment it is disclosed that further increase in heat transfer was observed when compared to air.

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