Metallic Nanoemulsion for Microchannel Heat-Sink

2016 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Gordon Yip ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Specific Heat ◽  
Heat Sink ◽  
Effective Medium Theory ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Viscosity Change ◽  
Transfer Capability ◽  
Heat Transfer Capability

Galinstan is a eutectic alloy of gallium, indium, and tin, of which thermal conductivity is ∼27 times higher than that of water, while the dynamic viscosity is only twice. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the direct use of galinstan can suffer from practical issues such as oxidation and low specific heat. Therefore, galinstan is mixed with a coolant as an additive to form a colloidal fluid; i.e., dispersion of nanoscale galinstan droplets in a coolant to enhance the thermal conductivity. It is expected that this “metallic nanoemulsion” can contribute to substantial improvement in heat transfer capability. Also, the common issues with colloidal fluids such as rapid sedimentation, erosion, and clogging, can be minimized by the “fluidity” of the liquid metal. It was shown that ultrasonic emulsification can yield few hundreds scale nanodroplets. However, the long exposure of galinstan to oxygen in water inevitably results in severe oxidation of the droplets. Theoretical analysis was also conducted to examine the feasibility of the metallic nanoemulsion as a microchannel heat-sink working fluid. Effective medium theory was used to evaluate the thermal conductivity of the mixture. The viscosity change was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Under one-dimensional laminar flow assumption, mass, momentum, and energy conservation equations were analytically solved. The effect of high thermal conductivity of galinstan was evident; the convection heat transfer capability was greatly enhanced, while the viscosity increase due to the nanoscale blending and the low specific heat of galinstan counteracts and reduce the flow rate and thus increase the caloric thermal resistance.

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

2015 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Navid Saneie ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Specific Heat ◽  
Thermal Management ◽  
Heat Sink ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Pumping Power

We numerically investigated a novel galinstan-based microfluidic heat-sink. Galinstan is an eutectic alloys of gallium, indium, and tin. The thermal conductivity of galinstan is ∼27 times that of water, while the dynamic viscosity is only twice of water. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the specific heat of galinstan is significantly lower than that of water, which will inevitably undermine the cooling capability by increasing fluid outlet temperature (i.e., increase of caloric thermal management) and/or flow rate. As an alternative, therefore, galinstan/water heterogeneous mixture was proposed as a working fluid and the cooling performance was numerically explored with varying volume composition of galinstan. Effective medium theory for heterogeneous medium was used to evaluate the thermal conductivity of the mixture. The viscosity change with respect to the volume composition was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Classical models were used for the mixture density and specific heat calculations. Heat transfer and pressure drop characteristics of laminar flow through a silicon microchannel heat-sink was simulated using Fluent. The length and width of the channel array are 10 mm and 9.5 mm, respectively. The cross-sectional area of each channel is 300 μm × 300 μm and the spacing between channels is 100 μm. The heat dissipation was 50 W and the pumping power was fixed at 5 mW for the comparison between the varying galinstan/water compositions. The results showed that more than 30% of the thermal resistance enhancement was attainable using the novel working fluid. Due to the compromise between the convective thermal resistance (effect of thermal conductivity) and the caloric thermal resistance (effect of viscosity and specific heat), the lowest junction temperature was marked at the galinstan composition of ∼35% by volume.

Flow Boiling Heat Transfer in a Silicon Microchannel Heat Sink Using Liquid Crystal Thermography

2008 ◽  
Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Microchannel Heat Sink

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.

Enhanced Thermal Transport in Microchannel Using Oblique Fins

2012 ◽  
Vol 134 (10) ◽  
Author(s):  
Y. J. Lee ◽  
P. S. Lee ◽  
S. K. Chou
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.

Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

2010 ◽  
Author(s):  
Yong-Jiun Lee ◽  
Poh-Seng Lee ◽  
Siaw-Kiang Chou
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Heat Sink ◽  
Leading Edge ◽  
Secondary Flows ◽  
Heat Sinks ◽  
Fluid Mixing ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Silicon Based

Sectional oblique fins are employed in contrast to the continuous fins in order to modulate the flow in microchannel heat sink. Experimental investigation of silicon based oblique finned microchannel heat sink demonstrated a highly augmented and uniform heat transfer performance against the conventional microchannel. The breakage of continuous fin into oblique sections leads to the re-initialization of the thermal boundary layers at the leading edge of each oblique fin, effectively reducing the boundary-layer thickness. This regeneration of the entrance effect causes the flow to be always in a developing state thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a fraction of the flow into the adjacent main channels. The secondary flows thus created improve fluid mixing which serves to further enhance the heat transfer. The average Nusselt number, Nuave, for the silicon microchannel heat sink which uses water as the working fluid can increase as much as 55%, from 8.8 to 13.6. Besides, the augmented convective heat transfer leads to reduction in both maximum chip temperature and its temperature gradient, by 8.6°C and 47% respectively. Interestingly, there is only little or negligible pressure drop penalty associated with this novel heat transfer enhancement scheme in contrast to conventional enhancement techniques.

Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability

2014 ◽  
Vol 136 (2) ◽  
Author(s):  
J. F. Zhou
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heating Surface ◽  
Bottom Surface ◽  
Cooling Power ◽  
Local Pressure ◽  
Pressure Drops ◽  
Transfer Capability ◽  
Length Width ◽  
Heat Transfer Capability

A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from the periphery to the center of the substrate by a vacuum pump and heat transferred from the bottom surface of substrate can be removed by air flowing through channels. Corresponding to the given heat transfer power and the target temperature of substrate, the relationship among length, width and depth of channel was analytically established. By numerical simulation, local pressure drops at the joint of channels and air duct are first obtained and then the dimensions of each channel in a triangular array can be determined one by one. The investigation reveals that the widths of channels will vary with their depths, lengths and pressure differences between two ends. Since all channels are required for the same cooling power, the homogeneous heat transfer of heat sink can be realized. By assembling a certain number of heat sink units, the area of dissipation of heat sink can be enlarged and contoured to fit close to heating surface.

Development of the Loop Heat Pipe (LHP)

2008 ◽  
Author(s):  
K. Tanaka
Keyword(s):  
Heat Transfer ◽  
Physical Development ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Maximum Heat ◽  
Maximum Heat Transfer ◽  
Transfer Capability ◽  
Heat Transfer Capability ◽  
Basic Equations ◽  
Test Result

First, I describe the basic equations that resolve the physical development of the LHP and how to estimate the maximum heat transfer capability of the LHP. Second, I describe the outline of experimental manufacture of the LHP. This LHP is made from copper. The evaporator is φ19×95mm, the vapor tube is φ5×300mm, the condenser is φ3.5×600mm and the liquid tube is φ3.5×300mm. The wick is made from the sintering cupper. The working fluid is methanol. Finally, I briefly describe the test result of heat transfer capability of this LHP.

Thermo-Fluidic Characteristics in a Cross-Linked Silicon Microchannel Heat Sink

2007 ◽  
Author(s):  
R. Muwanga ◽  
I. Hassan
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Cross Sections ◽  
Heat Sink ◽  
Local Heat Transfer ◽  
Local Heat ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Significant Difference ◽  
The Cross

This paper presents the flow and heat transfer characteristics in a cross-linked silicon microchannel heat sink. The heat sink is composed of 45 channels, 270 μm wide × 285 μm tall in a silicon substrate formed via deep reactive ion etching. A detailed discussion of the pressure drop data reduction is described, including characterization of the channel cross-sections and methods to account for inlet and exit loss coefficients. No significant difference is observed in the pressure drop measurements between the cross-linked and standard heat sinks flowing air and water. The use of un-encapsulated liquid crystal thermography was successfully utilized to obtain local heat transfer data with FC-72 as the working fluid. The heat transfer results show inflections in the thermal profile due to the cross-links.

Thermal Performance of the Mini-Loop Heat Pipe (LHP)

2009 ◽  
Author(s):  
K. Tanaka ◽  
M. Katsuta ◽  
Y. Ohuchi ◽  
K. Saitho
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Physical Development ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Transfer Capability ◽  
Heat Transfer Capability ◽  
Basic Equations ◽  
Test Result

In this paper, we describe the outline of experimental manufacture of the LHP. This LHP is made of a copper. The evaporator is φ19×95mm, the vapor tube is φ5×300mm, the condenser is φ3.5×600mm and the liquid tube is φ 3.5×300mm. The wick is made of the sintering copper. The working fluid is methanol. Second, we describe the test result of heat transfer capability of this LHP. Finally, I describe the basic equations that resolve the physical development of the LHP and how to estimate the each temperatures of the LHP.

Influence of Parallel and Trapezoidal Wick Structures to the Heat Transfer Capability of MHPs

2017 ◽  
Vol 868 ◽  
pp. 33-38
Author(s):  
Yi Luo ◽  
Zhi Xin Li ◽  
Zi Cheng Yu ◽  
Xiao Dong Wang
Keyword(s):  
Heat Transfer ◽  
Capillary Pressure ◽  
Equilibrium Temperature ◽  
Input Power ◽  
Small Dimension ◽  
Working Fluid ◽  
Transfer Capability ◽  
Calculation Results ◽  
Heat Transfer Capability ◽  
Micro Structures

Heat transfer capability of micro heat pipe (MHP) is relied on the thermal resistance of material, the specific phase change latent heat of working fluid, and the pattern of micro structures which is served as wick. In this paper, parallel and trapezoidal micro Cu structures were designed and fabricated by UV-LIGA. The capillary pressure and the effective coefficient of heat transfer conductivity of the micro grooves were calculated and results showed that trapezoidal grooves with small dimension in evaporator and large dimension in condenser (forward trapezoidal) have the best performance, because this structure can generate larger capillary force of working fluid and enhance the heat transfer. Two MHPs based on the calculations were fabricated and tested, results demonstrated that forward trapezoidal groove had the lowest equilibrium temperature while the inversed trapezoidal groove had the highest equilibrium temperature, approved the numerical calculation results. When the input power was 10W, the equilibrium temperature of forward trapezoidal, parallel and backward trapezoidal grooved MHP was 67.2 oC, 73.4°C and 89.1 oC, respectively. The forward trapezoidal grooves enlarge the capillary pressure and benefit the heat transfer of MHP.

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