Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

2000 ◽  
Author(s):  
Sandeep S. Tonapi ◽  
Sanjeev B. Sathe ◽  
K. Srihari ◽  
Bahgat B. Sammakia
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Physical Phenomenon ◽  
Ball Grid Array ◽  
Cover Plate ◽  
Transfer Model ◽  
Back Side ◽  
Significant Difference ◽  
Parametric Studies

Abstract This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

2006 ◽  
Vol 128 (4) ◽  
pp. 305-310
Author(s):  
Sandeep S. Tonapi ◽  
Sanjeev B. Sathe ◽  
Bahgat G. Sammakia ◽  
K. Srihari
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Vertical Channel ◽  
Ball Grid Array ◽  
Circuit Board ◽  
Cover Plate ◽  
Transfer Model ◽  
Back Side

This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s). Comparison is made for single sided and back-to-back cases.

Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks

2005 ◽  
Vol 128 (4) ◽  
pp. 412-418 ◽  
Author(s):  
Zhipeng Duan ◽  
Y. S. Muzychka
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Transfer Model ◽  
Heat Sinks ◽  
Transfer Model ◽  
Transfer Coefficients ◽  
Developing Flow ◽  
Rectangular Channels

Impingement cooling of plate fin heat sinks is examined. Experimental measurements of thermal performance were performed with four heat sinks of various impingement inlet widths, fin spacings, fin heights, and airflow velocities. The percent uncertainty in the measured thermal resistance was a maximum of 2.6% in the validation tests. Using a simple thermal resistance model based on developing laminar flow in rectangular channels, the actual mean heat transfer coefficients are obtained in order to develop a simple heat transfer model for the impingement plate fin heat sink system. The experimental results are combined into a dimensionless correlation for channel average Nusselt number Nu∼f(L*,Pr). We use a dimensionless thermal developing flow length, L*=(L∕2)∕(DhRePr), as the independent parameter. Results show that Nu∼1∕L*, similar to developing flow in parallel channels. The heat transfer model covers the practical operating range of most heat sinks, 0.01<L*<0.18. The accuracy of the heat transfer model was found to be within 11% of the experimental data taken on four heat sinks and other experimental data from the published literature at channel Reynolds numbers less than 1200. The proposed heat transfer model may be used to predict the thermal performance of impingement air cooled plate fin heat sinks for design purposes.

scholarly journals Flooded Two-Phase Flow Dynamics and Heat Transfer With Engineered Wettability on Microstructured Surfaces

2015 ◽  
Vol 137 (9) ◽  
Author(s):  
Bo Chen ◽  
Zhou Zhou ◽  
Junxiang Shi ◽  
Steven R. Schafer ◽  
Chung-Lung (C. L.) Chen
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Upward Movement ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Vof Model ◽  
Pulling Forces ◽  
3D Volume ◽  
Hydrophobic Material

Due to excessive droplet feeding, a period of flooding occurs as part of a typical droplet based thermal management cycle. The conventional superhydrophilic surface, which is designed for thin film evaporation because of its highly wettable character, has a limited improvement on the thermal performance during the flooded condition. This paper investigates microstructures which combine micropillars and four engineered wettability patterns to improve the heat dissipation rate during flooding. Using the transient, 3D volume-of-fluid (VOF) model, the bubble behaviors of growth, coalescence, and departure are analyzed within different microstructures and the effects of pillar height and wettability patterns on the thermal performance are discussed. The wettability gradient patched on the pillar's side is demonstrated to promote the bubble's upward movement due to the contact angle difference between the upper and lower interfaces. However, insufficient pulling force results in large bubbles being pinned at the pillar tops, which forms a vapor blanket, and consequently decreases the heat transfer coefficient. When only a patch of hydrophobic material is present on the pillar top, effective pulling forces can be developed to help bubbles in the lower level depart from the pillar forest, since bubble merging between them generates most of the power required to pull the bubbles to the surface. The simulation results, including heat source temperatures and heat transfer coefficients, indicate that a patch of hydrophobic material on the pillar top works best out of all of the cases studied.

A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

1999 ◽  
Vol 122 (2) ◽  
pp. 107-114 ◽  
Author(s):  
Sanjeev B. Sathe ◽  
Bahgat G. Sammakia
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Numerical Study ◽  
Radiation Heat Transfer ◽  
Three Dimensional ◽  
Cover Plate ◽  
Transfer Model ◽  
Turbulence Regime ◽  
Chip Carrier ◽  
Internal Thermal Resistance

This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By attaching a heat sink directly to the chip and using a thin layer of high thermal conductivity adhesive, a very low internal thermal resistance can be achieved. The package is attached to an organic card and placed vertically in a channel. A three-dimensional conjugate heat transfer model is used, accounting for conduction and radiation in the package and card and convection in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures. An experimental study was also conducted to verify the model. Even though the geometry is highly complex due to the multilayer construction of the module and the card, agreement between the model and the experimental measurement is excellent. It was shown that radiation heat transfer can be an equally significant mode as convection in the natural convection regime. [S1043-7398(00)01302-5]

Research on heat dissipation design method for motor controller radiator

2019 ◽  
Vol 234 (8) ◽  
pp. 1673-1685
Author(s):  
Huanlong Liu ◽  
Chixin Xie ◽  
Guanpeng Chen ◽  
Zeping Cao
Keyword(s):  
Heat Transfer ◽  
Electric Vehicles ◽  
Heat Dissipation ◽  
Design Method ◽  
Heat Transfer Model ◽  
Operating Conditions ◽  
Transfer Model ◽  
Insulated Gate Bipolar Transistor ◽  
Motor Controller ◽  
Key Factor

With the complication of electric vehicles operating conditions, the damage caused by the overheating of insulated gate bipolar transistor and freewheeling diode that are the core components of the motor controller has become a key factor restricting the development of electric vehicles. The motor controller is primarily cooled by a radiator, and the heat exchange of the radiator includes heat transfer between the heat sources of the motor controller and the radiator walls and heat convection between the cooling medium and the radiator walls. A fluid–solid coupling heat transfer model for analyzing the motor controller was established. The flow field performances and main influencing factors were analyzed, and the correctness of the method was verified by experiments. To improve the design efficiency of the motor controller radiator, a design method based on target temperature, installation position of the liquid cooling radiator, fluid parameters, and heating power was proposed. This method can quickly calculate and evaluate the heat dissipation capability of the radiator. The fluid–solid coupling heat transfer model using this design method is established in computational fluid dynamics software, and the results show that the relative error between the simulation results and the design method results is within 20%.

Numerical Study of Cavitation in Cryogenic Fluids

2005 ◽  
Vol 127 (2) ◽  
pp. 267-281 ◽  
Author(s):  
Ashvin Hosangadi ◽  
Vineet Ahuja
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Critical Temperature ◽  
Thermal Effects ◽  
Free Stream ◽  
Numerical Study ◽  
Stream Velocity ◽  
Transfer Model ◽  
Cryogenic Fluids ◽  
Parametric Studies

Numerical simulations of cavitation in liquid nitrogen and liquid hydrogen are presented; they represent a broader class of problems where the fluid is operating close to its critical temperature and thermal effects of cavitation are important. A compressible, multiphase formulation that accounts for the energy balance and variable thermodynamic properties of the fluid is described. Fundamental changes in the physical characteristics of the cavity when thermal effects become significant are identified; the cavity becomes more porous, the interface less distinct, and it shows increased spreading while getting shorter in length. The heat transfer model postulated in variants of the B-factor theory, where viscous thermal diffusion at the vapor-liquid interface governs the vaporization, is shown to be a poor approximation for cryogenic fluids. In contrast the results presented here indicate that the cavity is sustained by mass directly convecting into it and vaporization occurring as the liquid crosses the cavity interface. Parametric studies for flow over a hydrofoil are presented and compared with experimental data of Hord (1973, “Cavitation in Liquid Cryogens II—Hydrofoil,” NASA CR-2156); free-stream velocity is shown to be an independent parameter that affects the level of thermal depression.

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