Parametric studies of the thermal performance of back-to-back tape ball grid array (TBGA) packages

2002 ◽  
Author(s):  
S.S. Tonapi ◽  
S.B. Sathe ◽  
B.G. Sammakia ◽  
K. Srihari
Keyword(s):  
Thermal Performance ◽  
Ball Grid Array ◽  
Parametric Studies

Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

2000 ◽  
Author(s):  
Sandeep S. Tonapi ◽  
Sanjeev B. Sathe ◽  
K. Srihari ◽  
Bahgat B. Sammakia
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Physical Phenomenon ◽  
Ball Grid Array ◽  
Cover Plate ◽  
Transfer Model ◽  
Back Side ◽  
Significant Difference ◽  
Parametric Studies

Abstract This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.

A Semi-Empirically Thermal Optimization for Heat Sink/TEC Assemblies With Various External Thermal Resistances

2007 ◽  
Author(s):  
M. C. Wu ◽  
T. Y. Wu ◽  
J. T. Horng ◽  
S. F. Chang ◽  
P. L. Chen ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Network Models ◽  
Empirical Method ◽  
Heat Sinks ◽  
Performance Improvements ◽  
Design Variables ◽  
Fitting Method ◽  
Parametric Studies ◽  
Semi Empirical

An effective semi-empirical method that combines thermal network models and empirical correlations for exploring the thermal performance of heat sinks and HS/TEC assemblies under different external thermal resistances is successfully established. A series of parametric studies, including the effects of external thermal resistance, input current of TEC and pumping heat capacity, on thermal performance improvements of HS/TEC assemblies have been performed. The Response Surface Methodology (RSM) is applied to establish explicit models of the thermal performance of HS/TEC assemblies under various external thermal resistances in terms of the design variables through statistical fitting method. Furthermore, the numerical optimization results for HS/TEC assemblies under different constraints are obtained. With constrained optimal designs of HS/TEC assemblies, the HS/TEC assemblies can provide excellent thermal performance improvements on (1) the reduction of thermal resistance, (2) the enhancement of module heat loads and (3) the improvement of external thermal resistance.

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

2003 ◽  
Vol 125 (3) ◽  
pp. 447-455 ◽  
Author(s):  
K. Ramakrishna ◽  
J. R. Trent
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Ambient Temperature ◽  
Thermal Performance ◽  
Ball Grid Array ◽  
Automotive Applications ◽  
Molding Compound ◽  
Wide Range ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Thermal performance of a three chip, overmolded wire-bonded plastic ball grid array (WB-PBGA) package with four layer substrate attached to a 1.52-mm-thick, four-layer (2s2p), FR4 printed wiring board (PWB) has been evaluated under horizontal natural convection conditions for underhood automotive applications as a function of ambient temperature, package design parameters, and thermophysical properties of the package and PWB materials. A two-tier modeling approach, which accurately accounts for multidimensional heat transfer effects caused by substrate features such as vias and C5 solder joints, has been developed and implemented. In this methodology, the effect of small features is first characterized using a detailed micromodel from which an effective thermal conductivity is computed. The effective thermal conductivity is implemented in the global model thereby excluding the small features in the global model. The actual stackups of the package and PWB have been used in the computations to accurately determine the in-plane heat spreading. Using this methodology for automotive underhood applications, a parametric study of thermal performance of the WB-PBGA package has been carried out. This study shows that: 1. The maximum junction temperature rise above ambient, ΔT, decreases with increase in ambient temperature by 30% as the ambient temperature increases from 23 to 125°C. 2. ΔT decreases by 20% as the emissivity of the molding compound and the PWB surfaces increases from 0 (no radiative loss) to 0.8 under natural convection conditions. 3. The decrease in ΔT is small (∼7%) as the thermal conductivity of the die attach material varies over a wide range. 4. ΔT decreases by 30% as the thermal conductivity of the molding compound is varied over a wide range. 5. ΔT decreases by 45% as the thermal conductivity of the substrate increases (i.e., as the number of vias in the substrate increase) from no vias case to densely populated vias.

scholarly journals Thermal Performance Combined with Cooling System Parameters Study for a Roller Kiln Based on Energy-Exergy Analysis

Energies ◽  
2020 ◽  
Vol 13 (15) ◽  
pp. 3922 ◽  
Author(s):  
Yali Wang ◽  
Haidong Yang ◽  
Kangkang Xu
Keyword(s):  
Cost Saving ◽  
Residence Time ◽  
Thermal Performance ◽  
Exergy Analysis ◽  
Cooling System ◽  
Air Mass ◽  
Roller Kiln ◽  
Energy And Exergy ◽  
Parametric Studies ◽  
Cooling Air

Roller kilns, characterized as high energy consumption equipment, are widely used in the firing process of ceramic tiles. To evaluate the thermal performance of a roller kiln, a detailed energy and exergy analysis is carried out employing the operating values from a typical ceramic factory. In this study, parametric studies are performed that examine the impacts of the roller kiln’s cooling system on thermal performance, fuel-saving, cost-saving, and environmental influence. The results show that the targeted energy only accounts for 13.4% and 9.7% of the total energy and exergy inputs, indicating the poor efficiency of the roller kiln. This research also identifies that the exergy destruction is the largest cause of the exergy loss in the system, accounting for 85.1% of the total exergy input—of which 50.9% is due to heat and mass transfer, and 37.9% is caused by fuel combustion. Based on the parametric studies, it has been found that with every 1% increase in cooling air mass flow, the energy and the exergy efficiencies of the kiln increase by 0.06% and 0.04%; with every 1% increase in cooling gas temperature, the energy and the exergy efficiencies of the kiln drop by 0.09% and 0.07%; with every 1% increase in cooling gas residence time, the energy and the exergy efficiencies of the kiln increase by 0.16% and 0.12%. Furthermore, results show that the cooling air residence time has the main impact on the cost-saving and carbon dioxide emission reduction, followed by cooling air mass and cooling air temperature.

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