Optimization of a Manifold Microchannel Heat Sink Using an Improved Version of the Augmented Epsilon Constraint Method

2019 ◽  
Author(s):  
L. K. Tartibu ◽  
M. O. Okwu
Keyword(s):  
Thermal Performance ◽  
Integrated Circuit ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Geometrical Configuration ◽  
Design Variables ◽  
Microchannel Heat Sinks ◽  
Constraint Method ◽  
Manifold Microchannel

Abstract The increase of heat generated in integrated circuit because of the miniaturization of electronic components requires more aggressive cooling solutions in order to minimize this high heat flux and address the temperature non-uniformity. In this paper, a manifold microchannel heat sinks has been investigated. In order to enhance the heat transfer performance of the microchannel, an improved version of the augmented epsilon constraint method is adopted for the optimization of the device. Four non-dimensional design variables have been used to describe the geometry of the manifold microchannel heat sinks. The thermal performance and the pumping power have been incorporated in the mathematical programming formulation as indicators of the thermal performance. A surrogate-based approximation based on the Response Surface Approximation has been utilized to evaluate these two objectives. This new mathematical approach has been implemented in the General Algebraic Modelling Systems (GAMS). Details about single and multi-objective optimization formulation of the problem will be disclosed. Optimal solutions describing the best geometrical configuration of the device will be computed. The implications of the geometrical configuration on the performance the manifold microchannel heat sinks will form part of the main contribution of this study.

scholarly journals Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

Entropy ◽  
2018 ◽  
Vol 21 (1) ◽  
pp. 16 ◽  
Author(s):  
Daxiang Deng ◽  
Guang Pi ◽  
Weixun Zhang ◽  
Peng Wang ◽  
Ting Fu
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Numerical Study ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Cross Sectional ◽  
Prime Concern ◽  
Microchannel Heat Sinks

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.

Thermal Design of Microchannel Heat Sinks for Low-Orbit Micro-Satellites

2005 ◽  
Author(s):  
Amaury J. H. Heresztyn ◽  
Nicole C. DeJong Okamoto
Keyword(s):  
Heat Flux ◽  
Fluid Model ◽  
High Heat ◽  
Thermal Design ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Propulsion Systems ◽  
Pressure Drops ◽  
Nuclear Propulsion ◽  
Microchannel Heat Sinks

As reduction in the size of electronics creates demand for smaller, less expensive and faster-to-produce spacecraft, the use of high heat flux electronics or advanced nuclear propulsion systems will increase the stress on the thermal subsystem. This work presents a thermal management solution to this problem using liquid-cooled microchannel heat sinks. First, a simple computer model is used to illustrate the need for an atypical cooling method when high-heat flux electronics are used. Second, a thermal/fluid model of microchannel heat sinks is developed and applied to address the satellite thermal need. The total thermal resistances and pressure drops show excellent comparison with published experimental and analytical results. Finally, the model of the microchannel heat sink is optimized to remove 25 W/cm2 over a footprint of 3.7cm2. The mass flow rate needed was significantly lower (almost 5–10 times lower) when compared to other published results, which means that micro-pumps available on the market will be sufficient. The integration of the microchannel system with the satellite is also discussed.

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
Gongnan Xie ◽  
Jian Liu ◽  
Weihong Zhang ◽  
Bengt Sunden
Keyword(s):  
Pressure Drop ◽  
Cross Section ◽  
Thermal Performance ◽  
Integrated Circuit ◽  
Rectangular Cross Section ◽  
Cooling Capacity ◽  
Heat Sinks ◽  
Liquid Cooling ◽  
Rectangular Microchannel ◽  
Microchannel Heat Sinks

With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty.

Numerical Analysis of Flow and Thermal Performance of a Water-Cooled Wavy Microchannel Heat Sink

2012 ◽  
Author(s):  
Gongnan Xie ◽  
Jian Liu ◽  
Weihong Zhang ◽  
Bengt Sundén
Keyword(s):  
Pressure Drop ◽  
Cross Section ◽  
Thermal Performance ◽  
Integrated Circuit ◽  
Rectangular Cross Section ◽  
Cooling Capacity ◽  
Heat Sinks ◽  
Liquid Cooling ◽  
Rectangular Microchannel ◽  
Microchannel Heat Sinks

With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty.

Empirical Optimization of High Density Plate-Fin Heat Sink for Constant Pumping Power in Low Profile Cooling Application

2005 ◽  
Author(s):  
Kazuaki Yazawa ◽  
Tatsuro Yoshida ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Fluid Dynamic ◽  
Dynamic Performance ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Low Profile ◽  
Data Points ◽  
Narrow Space ◽  
The Impact

Since the VLSI processors are increasing power in accordance with exponential law, cooling solutions for such as personal computers have been evolving for over a decade. Recent heat sinks are designed with high dense fins and low profile to adapt to a high heat flux source within a slim enclosure. To achieve such compact cooling solution, thin fin and small gap is desirable. In addition, the pumping power is also limited by the allowable narrow space for fans. Thus it is important to minimize the thermal resistance for given pumping power that we define the optimum. Due to the lack of literatures on topic of low profile and high dense fins experiments, an apparatus was specially built to measure the thermal and fluid dynamic performance at the same time. Since such a high dense fin arrangement requires extra space on the sides by manufacturing reasons, the impact of bypass flow needs to be considered. The experiments are carefully carried out and the results are precisely compared with numerical analysis. The numerical model aiming to find the optimum for given pumping power is discussed with extrapolating the data points. This report is concluded with the best configuration of plate fins of low profile heat sinks for a given fan performance.

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