Thermal Design of Microchannel Heat Sinks for Low-Orbit Micro-Satellites

2005 ◽  
Author(s):  
Amaury J. H. Heresztyn ◽  
Nicole C. DeJong Okamoto
Keyword(s):  
Heat Flux ◽  
Fluid Model ◽  
High Heat ◽  
Thermal Design ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Propulsion Systems ◽  
Pressure Drops ◽  
Nuclear Propulsion ◽  
Microchannel Heat Sinks

As reduction in the size of electronics creates demand for smaller, less expensive and faster-to-produce spacecraft, the use of high heat flux electronics or advanced nuclear propulsion systems will increase the stress on the thermal subsystem. This work presents a thermal management solution to this problem using liquid-cooled microchannel heat sinks. First, a simple computer model is used to illustrate the need for an atypical cooling method when high-heat flux electronics are used. Second, a thermal/fluid model of microchannel heat sinks is developed and applied to address the satellite thermal need. The total thermal resistances and pressure drops show excellent comparison with published experimental and analytical results. Finally, the model of the microchannel heat sink is optimized to remove 25 W/cm2 over a footprint of 3.7cm2. The mass flow rate needed was significantly lower (almost 5–10 times lower) when compared to other published results, which means that micro-pumps available on the market will be sufficient. The integration of the microchannel system with the satellite is also discussed.

Innovative Realizations of High Heat-Flux Boiling and Condensing Flows for Milli-Meter and Micro-Meter Scale Applications

2014 ◽  
Author(s):  
Michael Kivisalu ◽  
Amitabh Narain ◽  
Patcharapol Gorgitrattanagul ◽  
Ranjeeth Naik
Keyword(s):  
Heat Flux ◽  
Heat Load ◽  
High Heat ◽  
Electronic Cooling ◽  
System Level ◽  
High Heat Flux ◽  
Zero Gravity ◽  
Pressure Drops ◽  
Condensing Flows ◽  
High Heat Load

For shear driven mm-scale flows, the traditional boiler and condenser operations pose serious problems of degraded performance (low heat-flux values, high pressure drops, and device-and-system level instabilities). The innovative devices are introduced for functionality and high heat load capabilities needed for shear dominated electronic cooling situations that arise in milli-meter scale operations, certain gravity-insensitive avionics-cooling and zero-gravity applications.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

High heat flux flow boiling in silicon multi-microchannels – Part III: Saturated critical heat flux of R236fa and two-phase pressure drops

2008 ◽  
Vol 51 (21-22) ◽  
pp. 5426-5442 ◽  
Author(s):  
Bruno Agostini ◽  
Rémi Revellin ◽  
John Richard Thome ◽  
Matteo Fabbri ◽  
Bruno Michel ◽  
...  
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Flux Flow ◽  
Pressure Drops ◽  
Phase Pressure

scholarly journals Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling

Energies ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 6347
Author(s):  
Taha Baig ◽  
Zabdur Rehman ◽  
Hussain Ahmed Tariq ◽  
Shehryar Manzoor ◽  
Majid Ali ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Heat Removal ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Base Temperature ◽  
High Processing

Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20 %, 8.74 %, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work.

Flow Boiling Heat Transfer Enhancement in Subcooled and Saturated Refrigerants in Minichannel Heat Sinks

2014 ◽  
Author(s):  
Ehsan Yakhshi-Tafti ◽  
Howard Pearlman ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Laser Applications ◽  
Enhanced Boiling

Forced two-phase cooling is investigated for handling high power electronics and laser applications having high heat flux and isothermality requirements. Experimental results are reported for minichannel heat sinks with and without enhanced boiling coatings showing increased heat transfer coefficients and higher critical heat flux for coated versus uncoated surfaces.

scholarly journals Experimental Characterization of the Heat Transfer in Multi-Microchannel Heat Sinks for Two-Phase Cooling of Power Electronics

Fluids ◽  
2021 ◽  
Vol 6 (2) ◽  
pp. 55
Author(s):  
Gennaro Criscuolo ◽  
Wiebke Brix Markussen ◽  
Knud Erik Meyer ◽  
Björn Palm ◽  
Martin Ryhl Kærn
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Power Electronics ◽  
Flow Boiling ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Average Heat

This study aims to characterize experimentally the heat transfer in micro-milled multi-microchannels copper heat sinks operating with flow boiling, in the attempt to contribute to the development of novel and high heat flux thermal management systems for power electronics. The working fluid was R-134a and the investigation was conducted for a nominal outlet saturation temperature of 30 ∘C. The microchannels were 1 cm long and covered a square footprint area of 1 cm2. Boiling curves starting at low vapor quality and average heat transfer coefficients were obtained for nominal channel mass fluxes from 250 kg/m2s to 1100 kg/m2s. The measurements were conducted by gradually increasing the power dissipation over a serpentine heater soldered at the bottom of the multi-microchannels, until a maximum heater temperature of 150 ∘C was reached. Infrared thermography was used for the heater temperature measurements, while high-speed imaging through a transparent top cover provided visual access over the entire length of the channels. The average heat transfer coefficient increased with the dissipated heat flux until a decrease dependent on hydrodynamic effects occurred, possibly due to incomplete wall wetting. Depending on the channel geometry, a peak value of 200 kW/m2K for the footprint heat transfer coefficient and a maximum dissipation of 620 W/cm2 at the footprint with a limit temperature of 150 ∘C could be obtained, showing the suitability of the investigated geometries in high heat flux cooling of power electronics. The experimental dataset was used to assess the prediction capability of selected literature correlations. The prediction method by Bertsch et al. gave the best agreement with a mean absolute percent error of 24.5%, resulting to be a good design tool for flow boiling in high aspect ratio multi-microchannels as considered in this study.

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